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    HEATSINK FANS FOR FPGA Search Results

    HEATSINK FANS FOR FPGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    PQU650M-F-COVER Murata Manufacturing Co Ltd PQU650M Series - 3x5 Fan Cover Kit, RoHs Medical Visit Murata Manufacturing Co Ltd
    GCM188D70E226ME36D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    GRM022C71A472KE19L Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM033C81A224KE01W Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155D70G475ME15D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd

    HEATSINK FANS FOR FPGA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    temperature controlled fan project report

    Abstract: LVCMOS25
    Text: Power Consumption and Management for LatticeECP3 Devices February 2009 Technical Note TN1181 Introduction A key requirement for designers using FPGA devices is the ability to calculate the power dissipation of a particular device used on a board. LatticeECP3 devices bring together the lowest-power FPGA with SERDES and the


    Original     		PDF TN1181 LVCMOS25, 1-800-LATTICE temperature controlled fan project report LVCMOS25

    LVCMOS25

    Abstract: AIR FLOW DETECTOR project report in
    Text: Power Estimation and Management for LatticeSC Devices July 2007 Technical Note TN1101 Introduction One requirement for designers using FPGA devices is the ability to determine the power considerations and consumption for a particular device used on a board. This technical note provides users with detailed power considerations, such as sequencing, along with an explanation of how to use the Power Calculator available in the


    Original     		PDF TN1101 1-800-LATTICE LVCMOS25 AIR FLOW DETECTOR project report in

    TN1052

    Abstract: No abstract text available
    Text: Power Estimation and Management for LatticeECP/EC and LatticeXP Devices September 2007 Technical Note TN1052 Introduction One of the requirements when using FPGA devices is the ability to calculate power dissipation for a particular device used on a board. Lattice’s ispLEVER design tools include a Power Calculator tool which allows designers


    Original     		PDF TN1052 TN1052

    hecs 450

    Abstract: Spare parts POWERFLEX 7000 7000T wiring diagrams POWER COMMAND Hmi 211 hecs 50
    Text: Troubleshooting Guide PowerFlex 7000 Medium Voltage AC Drives Publication 7000-TG002J-EN-P Important User Information Read this document and the documents listed in the additional resources section about installation, configuration, and operation of this equipment before you install, configure, operate, or maintain this product. Users are required to


    Original     		PDF 7000-TG002J-EN-P RA-DU002, 7000-TG002J-EN-P 7000-TG002I-EN-P hecs 450 Spare parts POWERFLEX 7000 7000T wiring diagrams POWER COMMAND Hmi 211 hecs 50

    JEDS51-2

    Abstract: xc4010e-pq208 XAPP415 xc4013e-pq240 xc73144bg225 PG223-XC4013E JC JB jt Malico xcv1000efg680
    Text: Application Note: Packaging R Packaging Thermal Management XAPP415 v1.0 December 19, 2001 Thermal Management Modern high-speed logic devices consume appreciable amount of electrical energy. This energy invariably turns into heat. Higher device integration drives technologies to produce


    Original     		PDF XAPP415 JEDS51-2 xc4010e-pq208 XAPP415 xc4013e-pq240 xc73144bg225 PG223-XC4013E JC JB jt Malico xcv1000efg680

    74 hc 59581

    Abstract: b768 transistor transistor smd 661 752 8 pin ic base socket round pin type lead 652B0082215-002 MM5231 702 transistor smd code LA9100 LGA 1155 Socket PIN diagram smd transistor w16
    Text: 717 Technical portal and online community for Design Engineers - www.element-14.com Semiconductor Hardware & Thermal Management Page Page 727 725 725 732 739 732 749 736 725 724 723 723 724 721 720 722 726 752 728 751 Crystal Oscillator Sockets . . . . . . . . . . . . . . . . . .


    Original     		PDF element-14 74 hc 59581 b768 transistor transistor smd 661 752 8 pin ic base socket round pin type lead 652B0082215-002 MM5231 702 transistor smd code LA9100 LGA 1155 Socket PIN diagram smd transistor w16

    sm712g

    Abstract: T9400 SCH5027 ddr2 ram slot pin detail intel mvp-6 debug codes ddr2 ram slot 240 pin detail ami bios post code remote host lpc flash bios recovery via debug header ami BIOS 32 Pin PLCC
    Text: Intel Core 2 Duo Processor T9400 and Intel® 5100 Memory Controller Hub Chipset Development Kit User Guide July 2008 Revision 001US Order Number: 319653-001US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR


    Original     		PDF T9400 001US 319653-001US CK505 T9400 sm712g SCH5027 ddr2 ram slot pin detail intel mvp-6 debug codes ddr2 ram slot 240 pin detail ami bios post code remote host lpc flash bios recovery via debug header ami BIOS 32 Pin PLCC

    MachXO2 Family

    Abstract: TN1198 LVCMOS25
    Text: Power Estimation and Management for MachXO2 Devices November 2010 Advance Technical Note TN1198 Introduction A key requirement for many of today’s high volume FPGA applications is low power consumption. The MachXO2 PLD provides many power-saving features including Power Controller, Bank Controller and Power Guard. This


    Original     		PDF TN1198 LVCMOS25, 1-800-LATTICE MachXO2 Family TN1198 LVCMOS25

    XCV1000E

    Abstract: XAPP158 X7R mid voltage dependence XAPP152 XC2S15 XC2S30 XCV50 V1000E
    Text: Application Note: Virtex Series, Virtex-II Series and Spartan-II Family R Powering Xilinx FPGAs Author: Austin Lesea and Mark Alexander XAPP158 v1.4 February 6, 2001 Summary Power consumption in Xilinx FPGAs depends upon the number of internal logic transitions and


    Original     		PDF XAPP158 XCV1000E XAPP158 X7R mid voltage dependence XAPP152 XC2S15 XC2S30 XCV50 V1000E

    SPARTAN-II xc2s200 pq208

    Abstract: XAPP189 Xilinx SPARTAN High Frequency Device Data Book PQ208 XAPP152 XC2S15 XC2S200 XC2S30 XCV50
    Text: Application Note: Spartan-II Family R Powering Xilinx Spartan-II FPGAs XAPP189 v1.1 July 20, 2001 Summary Power consumption in Xilinx Spartan -II FPGAs depends upon the number of internal logic transitions and is proportional to the operating clock frequency. As device size increases, so


    Original     		PDF XAPP189 SPARTAN-II xc2s200 pq208 XAPP189 Xilinx SPARTAN High Frequency Device Data Book PQ208 XAPP152 XC2S15 XC2S200 XC2S30 XCV50

    XAPP158

    Abstract: XCV1000E XAPP152 XC2S15 XC2S30 XCV50
    Text: Application Note: Virtex Series and Spartan-II Family R Powering Xilinx FPGAs Author: Austin Lesea and Mark Alexander XAPP158 v1.5 August 5, 2002 Summary Power consumption in Xilinx FPGAs depends upon the number of internal logic transitions and is proportional to the operating clock frequency. As device size increases, so does power


    Original     		PDF XAPP158 XAPP158 XCV1000E XAPP152 XC2S15 XC2S30 XCV50

    BFG95

    Abstract: No abstract text available
    Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


    Original     		PDF UG112 UG072, UG075, XAPP427, BFG95

    BIOS Writers Guide

    Abstract: BIOS Writers Guide Atom US15WP US15W flotherm processor atom menlow 0x19Ch desktop sch dts circuit board
    Text: Intel Atom Processor Z5xxP/T and Intel® System Controller Hub US15WP/T for Embedded Applications Thermal Design Guide August 2009 Revision 001 Document: 322352 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,


    Original     		PDF US15WP/T Z520P/T) BIOS Writers Guide BIOS Writers Guide Atom US15WP US15W flotherm processor atom menlow 0x19Ch desktop sch dts circuit board

    sGCT

    Abstract: 7000-TD001J-EN-P ABB inverter motor fault code 18-Pulse PF7000 ABB thyristor modules how to control firing angle in thyristor potentiometer alpha b 500k 1250-hp ABB SCR Datasheet
    Text: Medium Voltage AC Drive Parameters Air-Cooled and Liquid-Cooled Drives Technical Data www.abpowerflex.com Important User Information The information in this manual is to be used as a supplement to the following publications: • PowerFlex 7000A Medium Voltage AC Drive,


    Original     		PDF 000A-UM150 7000-UM150 7000L 7000L-UM300 7000/7000L 7000-TD001J-EN-P 7000-TD001H-EN-P sGCT 7000-TD001J-EN-P ABB inverter motor fault code 18-Pulse PF7000 ABB thyristor modules how to control firing angle in thyristor potentiometer alpha b 500k 1250-hp ABB SCR Datasheet

    HT12E HT12D

    Abstract: Panasonic RELAY Cross Reference NEC OMRON N80C196KC16 MOS248 TDA2086A GOULD 500 COLOUR LCD DIGITAL STORAGE OSCILLOSCOPE 1NA114AP ICM72171 SL443A nec matrix Vacuum tube display
    Text: Issued July 1996 021-928 Data Packs A-K RS data sheet/semiconductor manufacturers data sheet index Data Sheet Introduction RS data sheets form a unique source of detailed information regarding technical specifications, absolute maximum ratings and applications for engineers and designers working with RS products.


    Original     		PDF

    6120-37

    Abstract: what is pson gt64260 GT-64260 C219 C320 gt64260a GT-64260A Part Numbering System transformer Tyco H1102 application note
    Text: Errata MVPX2ERR/D Rev. D, 3/2002 MVP X2 Multiprocessor Evaluation System Errata 1 Introduction This document describes the known errata and limitations of the MVP reference platform. In all cases, if an errata has a workaround, it is applied to the system before shipped to customers.


    Original     		PDF

    powerflex 753 programming manual

    Abstract: rockwell powerflex 753 wiring diagram heidenhain rod 426 1024 heidenhain rod 426 rod 323 heidenhain hengstler 890 manual 20HIM-UM001 HEIDENHAIN rod 529 NSA 2000 inverter manual heidenhain rod 456
    Text: Programming Manual PowerFlex 750-Series AC Drives Firmware Versions:1.xxx…10.xxx Important User Information Read this document and the documents listed in the additional resources section about installation, configuration, and operation of this equipment before you install, configure, operate, or maintain this product. Users are required to


    Original     		PDF 750-Series RA-DU002, 750-PM001J-EN-P 750-PM001I-EN-P powerflex 753 programming manual rockwell powerflex 753 wiring diagram heidenhain rod 426 1024 heidenhain rod 426 rod 323 heidenhain hengstler 890 manual 20HIM-UM001 HEIDENHAIN rod 529 NSA 2000 inverter manual heidenhain rod 456

    mv64360

    Abstract: Marvell MV64360 mitsubishi sc09 Serial DB9 to RJ12 samsung R519 Acbel schematic diagram switching power supply ppc750fx schematic diagram epson r230 232273061 RJ12 db9
    Text:  PPC750FX Evaluation Board PCI Reference Design User’s Manual SA14-2720-00 Preliminary June 10, 2003 Title Page Copyright International Business Machines Corporation 2002, 2003 All Rights Reserved Printed in the United States of America June 2003


    Original     		PDF PPC750FX SA14-2720-00 PPC750FX 750FXebmIX 750FXebm mv64360 Marvell MV64360 mitsubishi sc09 Serial DB9 to RJ12 samsung R519 Acbel schematic diagram switching power supply schematic diagram epson r230 232273061 RJ12 db9

    lm35 sensor interfacing with adc

    Abstract: BJT 2N2222 datasheet LM35 cold junction circuits with oven temperature sensor 2501 optocoupler Sanyo Denki servo motor sanyo denki stepping motor LM334 Cold-Junction Compensation sanyo denki DC servo motor super V resistance type temperature sensors
    Text: Temperature Sensor Handbook national.com/tempsensors Q2 2008 Introduction .7 Temperature-Sensing Techniques. 9-13 Temperature-Sensor ICs . 15-43 Application Hints. 45-58


    Original     		PDF

    a5a1

    Abstract: ATI rn50 hp v3000 DIF3P TAG 8546 DATASHEET SFF-8484 pin out circuit diagram of motherboard dell 270 compaq v3000 64Gb Nand flash toshiba pdf of 64Gb Nand flash memory by toshiba
    Text: Intel Server System S7000FC4UR Technical Product Specification Intel order number E18291-001 Revision 1.0 July 13, 2007 Enterprise Platforms and Services Division - Marketing Revision History Intel® Server System S7000FC4UR Revision History Date July 13, 2007


    Original     		PDF S7000FC4UR E18291-001 com/design/USB/UHCI11D a5a1 ATI rn50 hp v3000 DIF3P TAG 8546 DATASHEET SFF-8484 pin out circuit diagram of motherboard dell 270 compaq v3000 64Gb Nand flash toshiba pdf of 64Gb Nand flash memory by toshiba

    DM9000E

    Abstract: CS18101
    Text: Integrating CobraNet into Audio Products Advice from the Experts CS18101 (CM-2) AppNote1 - rev 1.1 Jan, 2004 www.cirrus.com P RELIMINARY This page intentionally blank. ii CS18101 (CM-2) AppNote1 - rev 1.1 Jan, 2004 www.cirrus.com P RELIMINARY Introduction


    Original     		PDF CS18101 CS18101 CPB-18101-CM-2 DM9000E

    UPS sinus schematic

    Abstract: "direct torque control" AN2009-06 direct torque control motorola application notes basic principle of ups system Single-Bit ADCs in a Nutshell EICEDRIVER HCPL-0872 UPS basics
    Text: Application Note, V0.1, September 2009 AN2009-06 MIPAQ sense Making use of Modules with integrated Current Measurement Industrial Power Edition 2009-08-28 Published by Infineon Technologies AG 59568 Warstein, Germany Infineon Technologies AG 2009. All Rights Reserved.


    Original     		PDF AN2009-06 741ff HCPL-0872 UPS sinus schematic "direct torque control" AN2009-06 direct torque control motorola application notes basic principle of ups system Single-Bit ADCs in a Nutshell EICEDRIVER HCPL-0872 UPS basics

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    XILINX/part marking Hot

    Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160