Untitled
Abstract: No abstract text available
Text: CHEMTRONICS CW7250 Technical Data Sheet CircuitWorks Boron Nitride Heat Sink Grease PRODUCT DESCRIPTION CircuitWorks Boron Nitride Heat Sink Grease facilitates heat transfer away from electrical/electronic components and into heat sinks. The material
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CW7250
MIL-C-47113
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Untitled
Abstract: No abstract text available
Text: CHEMTRONICS Technical Data Sheet CW7270 CircuitWorks Silicone Free Heat Sink Grease PRODUCT DESCRIPTION CircuitWorks Silicone Free Heat Sink Grease facilitates heat transfer away from electrical/electronic components and into heat sinks. This silicone-free compound
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CW7270
MIL-C-47113
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Untitled
Abstract: No abstract text available
Text: Extruded Heat Sinks for DC/DC Converters 14 Heat sinks for “Full-Brick” DC/DC Converters Heat sinks for “Full-Brick” DC/DC Converters Standard mounting slots mate with Vicor DC/DC converters. Optimized aluminum extruded fin construction transfers heat efficiently
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RT3830C00000
RT3835C00000
RT3845C00000
RT3840C00000
RT3830C00000
RT3835C00000
RT3840C00000
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j 692
Abstract: calibration certificate heat sensors 27160 heat flow sensor 400J
Text: Heat Flux Sensor Type 27160 Heat Flow sensors allow precision measurements of heat transfer through any surface material. They are cemented onto a surface like strain gauges, and will give an accurate measurement of heat transfer using a DVM as an indicator.
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95KW/m2
002sing
j 692
calibration certificate
heat sensors
27160
heat flow sensor
400J
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MATERIAL SAFETY DENATURED ALCOHOL
Abstract: TC-2707
Text: Technical Data November 2011 3M Thermally Conductive Interface Pads 5591 and 5591S Product Description 3M™ Thermally Conductive Interface Pads 5591 and 5591S are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks, heat spreaders or other cooling devices.
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5591S
5591S
5591/5591S
225-3S-06
MATERIAL SAFETY DENATURED ALCOHOL
TC-2707
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Untitled
Abstract: No abstract text available
Text: Technical Data July, 2010 3M Thermally Conductive Interface Pads 5592 and 5592S Product Description 3M™ Thermally Conductive Interface Pads 5592 and 5592S are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks, heat spreaders or other cooling devices.
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5592S
5592S
225-3S-06
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Untitled
Abstract: No abstract text available
Text: Technical Data July, 2010 3M Thermally Conductive Interface Pads 5595 and 5595S Product Description 3M™ Thermally Conductive Interface Pads 5595 and 5595S are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks, heat spreaders or other cooling devices.
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5595S
5595S
225-3S-06
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Untitled
Abstract: No abstract text available
Text: Technical Data December 2013 3M Thermally Conductive Silicone Interface Pads 5519 and 5519S Product Description 3M™ Thermally Conductive Silicone Interface Pads 5519 and 5519S are designed to provide a preferential heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. These
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5519S
5519S
225-3S-06
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Untitled
Abstract: No abstract text available
Text: CHEMTRONICS TDS # CT40 Technical Data Sheet CircuitWorks Heat Sink Grease PRODUCT DESCRIPTION CircuitWorks Heat Sink Grease silicone compound facilitates heat transfer away from electrical/electronic components. This heavy consistency material is thickened
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MIL-C-47113
CT40-5
1-800-TECH-401.
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QTM-500
Abstract: 5519S 5519
Text: Technical Data February 2012 3M Thermally Conductive Silicone Interface Pads 5519 and 5519S Product Description 3M™ Thermally Conductive Silicone Interface Pads 5519 and 5519S are designed to provide a preferential heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. These products consist
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5519S
5519S
225-3S-06
QTM-500
5519
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MIL-C-47113
Abstract: No abstract text available
Text: CHEMTRONICS TDS # CT40 Technical Data Sheet CircuitWorks Heat Sink Grease PRODUCT DESCRIPTION CircuitWorks Heat Sink Grease silicone compound facilitates heat transfer away from electrical/electronic components. This heavy consistency material is thickened with
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MIL-C-47113
-100F)
CT40-5
1-800-TECH-401.
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High Heat Transfer
Abstract: MIL-R-18546C tepro TM 50
Text: TEPRO TYPE “TMG” ELECTRO TECHNIK ALUMINUM HOUSED, HIGH HEAT TRANSFER CORES FEATURES: Molded construction High purity cores for optimum heat dissipation Even heat distribution curve Extremely high stability at conventional power ratings DERATING CURVE VARIATIONS:
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Untitled
Abstract: No abstract text available
Text: Technical Data June 2011 3M Thermally Conductive Silicone Interface Pad 5515-20 and 5515-25 Product Description 3M™ Thermally Conductive Silicone Interface Pads 5515-20 and 5515-25 are designed to provide a preferential heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. The 3M Pad
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225-3S-06
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EHTCP01K
Abstract: RPH-R heat transfer
Text: 10405 - NON-SILICON HEAT TRANSFER COMPOUND REVISION DATE:MAY 2003 SAFETY DATA SHEET NON-SILICON HEAT TRANSFER COMPOUND 1. IDENTIFICATION OF THE SUBSTANCE/PREPARATION AND THE COMPANY: PRODUCT NAME: NON-SILICON HEAT TRANSFER COMPOUND PART No.: EHTCP01K SUPPLIER:
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EHTCP01K
R-51/53
R-51/53
EHTCP01K
RPH-R
heat transfer
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UL-224 vw-1
Abstract: H150X MIL-M-81531 H200X H200X034H1T H200X025H H200X064H H100X034H
Text: Military Grade Heat Shrink Labels SPECIFICATION SHEET specifications Military grade heat shrink labels shall be pre-cut, heat-shrinkable flattened polyolefin and shall readily accept thermal transfer print. The product shall meet the material requirements and physical properties of
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AMS-DTL-23053/5C
MIL-M-81531
MIL-STD-883E,
H050X025H
H075X025H
H100X025H
H150X025H
H200X025H
H050X034H
H075X034H
UL-224 vw-1
H150X
H200X
H200X034H1T
H200X064H
H100X034H
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Untitled
Abstract: No abstract text available
Text: Silicone Heat Transfer Compound Page 1 of 1 Silicone Heat Transfer Compound 860 z High thermal conductivity High dielectric constant High dissipation factor Use with heat sinks or metal chassis Will not dry or harden z Contains zincs oxides and polydimenthyl siloxane
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D-149
860-4G
860-60G
860-150G
860-1P
com/products/860
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TES1-3202T125
Abstract: 431W
Text: TES1-3202T125 TECHNICAL DATA Micro-Thermoelectric Cooling Module QCmax=4.31 W Thermoelectric cooling uses the Peltier effect to create a heat flux between the junction of two different types of materials. A Peltier cooler is a solid-state active heat pump which transfers heat
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TES1-3202T125
TES1-3202T125
431W
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TEC1-00705T125
Abstract: No abstract text available
Text: TEC1-00705T125 TECHNICAL DATA Thermoelectric Cooler, Qc=2.8 W Thermoelectric cooling uses the Peltier effect to create a heat flux between the junction of two different types of materials. A Peltier cooler is a solid-state active heat pump which transfers heat from one side of the
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TEC1-00705T125
TEC1-00705T125
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Untitled
Abstract: No abstract text available
Text: Heat Transfer Compounds Page 1 of 2 Non-Silicone Heat Transfer Compound 8610 z Special synthetic base, fortified with metal oxides and compounded to a paste-like consistency for ease of application z High efficient thermal conductive properties { Means more rapid transfer of heat for longer component life
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D-149
8610-60G
8610-1P
com/products/8610
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Untitled
Abstract: No abstract text available
Text: presented in Figures 4 and 5 [3]. Figure 4 shows the temperature difference between evaporator and condenser at different power levels when the heat pipes are vertical. Compared to small diameter heat pipes, large diameter heat pipes transport more heat with
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Untitled
Abstract: No abstract text available
Text: Technical Data September, 2010 3M Thermally Conductive Adhesive Transfer Tapes 9882 • 9885 • 9890 Product Description 3M™ Thermally Conductive Adhesive Transfer Tapes 9882, 9885, and 9890 are designed to provide a preferential heattransfer path between heat-generating components and heat sinks or other cooling devices e.g., fans, heat spreaders or
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225-3S-06
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Untitled
Abstract: No abstract text available
Text: pushPIN Heat Sink Assembly ATS Part#: ATS-H1-88-C3-R0 Description: pushPIN™ HS ASMBLY,FINE-PITCH,STRAIGHT, HOLE PATTERN:RIGHT-TABBED,BLUE,T412 Heat Sink Type: pushPIN™ Heat Sink Assembly Heat Sink Attachment: pushPIN™ / Spring Kit Features & Benefits
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ATS-H1-88-C3-R0
920mm
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chasis L 03.1
Abstract: No abstract text available
Text: TEPRO •>A ' M EUX TYPE "TMG' BO TEC -frJIK ALUMINUM HOUSED HIGH HEAT TRANSFER CORE TYPE "TMG" ALU M INUM HOUSED - HIGH HEAT TRANSFER CORES FEATURES Molded construction Exceeds MIL - R - 18546 C, MIL - R - 39009 High purity cores for optimum heat dissipation
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18546C
2000Q
chasis L 03.1
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Untitled
Abstract: No abstract text available
Text: TYPE "TMG" ELECTRO TECHNIK TYPE "TMG" A L U M IN U M HOUSED, H IG H HEAT TRANSFER CORES FEATURES: Molded construction Exceeds MIL - R - 18546 C, MIL - R - 39009 High purity cores for optimum heat dissipation Even heat distribution curve Exlremely high stability at conventional power ratings
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