SPRING Controller TYCO
Abstract: relay 28.12 855010 Heat Trace Triac soft start MONI-RTD-200 "SPRING Controller" TYCO 8550101
Text: 910 Series Single-point heat-trace controller Product overview The DigiTrace 910 is a compact, full-featured microprocessor-based single-point heat trace controller. The 910 provides control and monitoring of electrical heat-tracing circuits for both freeze protection and temperature
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RS-485
RTD10CS
MONI-RTD-200
8550-RTD10CS
8550-RTD7AL
8550-RTD4AL
H56864
SPRING Controller TYCO
relay 28.12
855010
Heat Trace
Triac soft start
"SPRING Controller" TYCO
8550101
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Untitled
Abstract: No abstract text available
Text: 8 7 6 5 4 3 2 D 1 REVISIONS AMPHENOL PART NUMBER CONFIGURATION U90 - C 1 X 1 - 1 X 0 X PACKAGING HEAT SINK OPTION 1 = TRAY PACKAGING, HEAT SINK IN SEPARATE TRAY IF ORDERED 0 = NO HEAT SINK OPENING A = TRAY PACKAGING W/ HEAT SINK ASSEMBLED 1 = NO HEAT SINK OR CLIP SHIPPED
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P-U90-C1X1-1X0X
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Untitled
Abstract: No abstract text available
Text: 8 7 4 5 6 3 2 REVISIONS AMPHENOL PART NUMBER CONFIGURATION U90 - A 1 X 1 - 1 X 0 X HEAT SINK OPTION PACKAGING 0 = NO HEAT SINK OR CLIP SHIPPED, CLOSE TOP 1 = TRAY PACKAGING W/ HEAT SINK IN SEPARATE TRAY 1 = NO HEAT SINK OR CLIP SHIPPED, OPEN TOP A = TRAY PACKAGING W/ HEAT SINK ASSEMBLED
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DEC04/06
P-U90-A1X1-1X0X
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Untitled
Abstract: No abstract text available
Text: FEATURES High efficiency: 92.3% @ 3.3V/60A Size: 58.4x22.8x10.9mm 2.30”x0.90”x0.43” (Without heat-spreader) 58.4x22.8x12.7mm (2.30”x0.90”x0.50”) (With heat-spreader) Industry standard footprint Heat dissipation enhancement pinout
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V/60A
OHSAS18001
E48SP,
E48SP3R360
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E48SP3R360
Abstract: IEC60950-1999
Text: FEATURES High efficiency: 92.3% @ 3.3V/60A Size: 58.4x22.8x10.9mm 2.30”x0.90”x0.43” (Without heat-spreader) 58.4x22.8x12.7mm (2.30”x0.90”x0.50”) (With heat-spreader) Industry standard footprint Heat dissipation enhancement pinout
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V/60A
E48SP3R360,
OHSAS18001
E48SP3R360
IEC60950-1999
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Untitled
Abstract: No abstract text available
Text: FEATURES High efficiency: 92.3% @ 3.3V/60A Size: 58.4x22.8x10.9mm 2.30”x0.90”x0.43” (Without heat-spreader) 58.4x22.8x12.7mm (2.30”x0.90”x0.50”) (With heat-spreader) Industry standard footprint Heat dissipation enhancement pinout
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V/60A
OHSAS18001
E48SP3R360,
E48SP3R360
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INF-8438
Abstract: No abstract text available
Text: 7 8 6 5 3 4 1 2 REVISIONS REV. AMPHENOL PART NUMBER CONFIGURATION U90 - G 4X1 - 1XXX HEAT SINK OPTION 1 = NO HEAT SINK OR CLIP SHIPPED 5 = PIN STYLE HEAT SINK AND CLIP H1=15.1; H2=6.5; SAN HEIGHT 6 = PIN STYLE HEAT SINK AND CLIP (H1=12.8; H2=4.2; PCI HEIGHT)
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P-U90-G4X1-1XXX
INF-8438
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raychem s1125
Abstract: raychem s1125 adhesive RT876 rt-876 S1125 RT876 raychem RK6619 raychem JOINT KIT ADHESIVE s1125 raychem s1125 adhesive application
Text: Raychem S1125 High performance, chemical and heat resistant adhesive Service temperature range -75oC to +150oC Raychem S1125 high performance adhesive has been developed to match the superior chemical and heat resistance properties of DR-25 heat-shrinkable
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S1125
-75oC
150oC
S1125
DR-25
raychem s1125
raychem s1125 adhesive
RT876
rt-876
RT876 raychem
RK6619
raychem JOINT KIT
ADHESIVE s1125
raychem s1125 adhesive application
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BH 3852 S
Abstract: No abstract text available
Text: 7 8 6 5 3 4 1 2 REV - DESCRIPT - DATE - APPRVD AMPHENOL PART NUMBER CONFIGURATION U90 - G 3X1 - 1XXX HEAT SINK OPTION 1 = NO HEAT SINK OR CLIP SHIPPED 5 = PIN STYLE HEAT SINK AND CLIP H1=15.1; H2=6.5; SAN HEIGHT 6 = PIN STYLE HEAT SINK AND CLIP (H1=12.8; H2=4.2; PCI HEIGHT)
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P-U90-G3X1-1XXX
BH 3852 S
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Untitled
Abstract: No abstract text available
Text: 8 7 6 5 4 1 2 3 REVISIONS REV. U92 - A2X0 - 1X0X - XX F HEAT SINK OPTION 1 - NO HEAT SINK, NO CLIP 2 - FIN STYLE HEAT SINK BLACK OXIDE WITH CLIP 3 - FIN STYLE HEAT SINK (NICKEL PLATED) WITH CLIP D E F G H J K DESCRIPTION DATE PART # CORRECTED IN ISO VIEWS
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P-U92-A2X0-1X0X-XX
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Untitled
Abstract: No abstract text available
Text: SPECIFYING OMEGALUX HEAT CABLE For Piping Systems HEAT LOSS CALCULATIONS CALCULATING HEAT LOSSES FROM INSULATED METAL PIPES STEP 1. OBTAIN NECESSARY INFORMATION A. Desired pipe maintenance temperature in °F TM . B. Minimum expected ambient temperature in °F (TA).
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JESD51-7
Abstract: JESD51-1 JESD-51 G30-88 JESD-51-1 JESD51 JESD51-5 TB379 thermal resistance standards
Text: Thermal Characterization of Packages for ICs Technical Brief December 1999 TB379.1 Author: Michael Colquitt Introduction Any operating semiconductor device will produce heat as a by-product. Because heat can have significant effects on circuit performance and reliability, the management of heat
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TB379
JESD51-7
JESD51-1
JESD-51
G30-88
JESD-51-1
JESD51
JESD51-5
thermal resistance standards
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Untitled
Abstract: No abstract text available
Text: 8 7 5 6 4 3 2 D 1 REVISIONS AMPHENOL PART NUMBER CONFIGURATION U90 - T 1 X 1 - 1 X X X PACKAGING HEAT SINK OPTION 5 = PIN STYLE HEAT SINK NICKEL PLATED AND CLIP (H=6.5mm; SAN HEIGHT) 1 = TRAY PACKAGING W/ HEAT SINK IN SEPARATE TRAY 6 = PIN STYLE HEAT SINK (NICKEL PLATED) AND CLIP (H=4.2mm; PCI HEIGHT)
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P-U90-T1X1-1XXX
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raychem termination kit installation instructions
Abstract: raychem catalog termination kit raychem termination kit raychem catalog for 33 kV cable termination kit raychem TERMINATION CABLE 36 KV tyco lug raychem heat shrink terminations IXSU-F raychem termination kit 24 kv raychem outdoor termination kit
Text: Energy Division Raychem heat-shrinkable medium voltage terminations IXSU-F/OXSU-F Raychem heat-shrinkable medium voltage terminations IXSU-F/OXSU-F for indoor and outdoor applications for polymeric cables up to 42 kV Raychem heat-shrinkable medium voltage terminations IXSU-F/OXSU-F
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EN50343
Abstract: afnor nf 16-101 E1042 din 5510-2 AS81531 6853 HX-SCE-1K T-20019 TTDS-108 BS6853
Text: Wire and Harness ID Products Heat-Shrink/Cable Markers HX-SCE Low fire hazard heat-shrinkable wire identification sleeves Thin wall, zero-halogen, low smoke, low toxicity, radiation crosslinked, UV stabilised polyolefin heat-shrinkable tubing, assembled as cut sleeves organized in a ladder format.
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AS81531
MIL-STD-202
EN50343
afnor nf 16-101
E1042
din 5510-2
6853
HX-SCE-1K
T-20019
TTDS-108
BS6853
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231-75PAB-14V
Abstract: 251-62AB 216-40CTT wakefield engineering 67 c 945 p 239 c MO-184 REF-10 Wakefield Engineering EIA-481-3 MS-013
Text: BOARD LEVEL HEAT SINKS BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS D 2PAK, TO-220, SOL-20 Surface Mount Heat Sinks 216 SERIES Standard P/N 216-40CT 216-40CTT 216-40CTR Height Above PC Board .390 in. 9.9 .390 in. (9.9) .390 in. (9.9) Package Format Bulk Tube
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O-220,
SOL-20
216-40CT
216-40CTT
216-40CTR
LP-225
231-75PAB-14V
251-62AB
216-40CTT
wakefield engineering 67
c 945 p 239 c
MO-184
REF-10
Wakefield Engineering
EIA-481-3
MS-013
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A25Y
Abstract: HSTTV12-48-Q
Text: PAN -SHRINK Catalog SA# 101N48F-AIS DRY -S HRINK ™ , DAMP-SHRINK ™ and WET-SHRINK ™ Heat Shrink and Abrasion Protection Products Contents Heat Shrink Products Type Polyolefin, General Purpose Tubing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HSTT . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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101N48F-AIS
A25Y
HSTTV12-48-Q
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Untitled
Abstract: No abstract text available
Text: FEATURES High efficiency: 92% @ 12V/8A Size: 58.4mmx22.8mmx8.4mm 2.30”x0.90”x0.33” (Without heat-spreader) 58.4mmx22.8mmx12.7mm (2.30”x0.90”x0.50”) (With heat-spreader) Standard footprint Industry standard pin out Fixed frequency operation
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4mmx22
8mmx12
E48SC12008,
Delt998
E48SC12008
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Untitled
Abstract: No abstract text available
Text: FEATURES High efficiency: 84% @ 1.0V/50A Size: 33.0x22.8x9.5mm 1.30”x0.90”x0.37” ( W/O heat-spreader ) 33.0x22.8x12.7mm (1.30”x0.90”x0.50”) ( With heat-spreader ) Industry standard footprint and pinout Fixed frequency operation
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V/50A
OHSAS18001
V48SH,
50Aout
V48SH1R050
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Untitled
Abstract: No abstract text available
Text: FEATURES High efficiency: 92% @ 12V/8A Size: 58.4mmx22.8mmx8.4mm 2.30”x0.90”x0.33” (Without heat-spreader) 58.4mmx22.8mmx12.7mm (2.30”x0.90”x0.50”) (With heat-spreader) Standard footprint Industry standard pin out Fixed frequency operation
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4mmx22
8mmx12
E48SC12008,
E48SC12008
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dc to dc converter 48v to 12v 10a diagram
Abstract: No abstract text available
Text: FEATURES High efficiency: 87% @ 1.2V/35A Size: 33.0x22.8x9.5mm 1.30”x0.90”x0.37” ( W/O heat-spreader ) 33.0x22.8x12.7mm (1.30”x0.90”x0.50”) ( With heat-spreader ) Industry standard footprint and pinout Fixed frequency operation
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V/35A
OHSAS18001
V48SH,
V48SH1R235
dc to dc converter 48v to 12v 10a diagram
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DSP56301
Abstract: DSP56301PW66
Text: Design Considerations Heat Dissipation Considerations Power, Ground, and Noise Design Considerations Heat Dissipation Considerations The average chip-junction temperature, TJ, in °C can be obtained from: TJ = TA + PD x ΘJA (1) Where: TA = Ambient Temperature, °C
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DSP56301
DSP56301
DSP56301PW66
DSP56301PW66
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V48SH05017
Abstract: No abstract text available
Text: FEATURES High efficiency: 91.5% @ 5V/17A Size: 33.0x22.8x9.5mm 1.30”x0.90”x0.37” ( W/O heat-spreader ) 33.0x22.8x12.7mm (1.30”x0.90”x0.50”) ( With heat-spreader ) Industry standard footprint and pinout Fixed frequency operation
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V/17A
OHSAS18001
V48SH,
48V98
V48SH05017
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Untitled
Abstract: No abstract text available
Text: FEATURES High efficiency: 85% @ 1.0V/35A Size: 33.0x22.8x9.5mm 1.30”x0.90”x0.37” ( W/O heat-spreader ) 33.0x22.8x12.7mm (1.30”x0.90”x0.50”) ( With heat-spreader ) Industry standard footprint and pinout Fixed frequency operation
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V/35A
OHSAS18001
V48SH,
V48SH1R035
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