QK1 1500
Abstract: TY5512MX GSHS-4635WS TY553MX
Text: INDEX General Information Page HEAT SHRINK PRODUCTS SELECTION GUIDE 1-2 HEAT SHRINK PRODUCTS CROSS REFERENCE GUIDE 3 CABLE TIES CROSS REFERENCE GUIDE 4-8 HEAT SHRINK PRODUCTS INFORMATION 9-10 HEAT SHRINK APPLICATIONS / HEAT SHRINK TECHNOLOGY 11 TUBING FEATURES / SELECTION PARAMETERS / INSTALLATION INSTRUCTIONS
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HST-0400
QK1 1500
TY5512MX
GSHS-4635WS
TY553MX
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ALPS
Abstract: alps catalog Alps Electric car navigation system
Text: Heat Conducting Magnetic Sheet Liqualloy with Noise Suppression TM NEW 2009 HMFTW Series Dual function on 1 sheet Heat Radiation Noise Suppression Multi-functions of heat conduction and noise suppression in one device through our original magnetic material technology. The best heat and noise solutions for
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10MHz
ALPS
alps catalog
Alps Electric
car navigation system
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573300D00000G
Abstract: 411399
Text: Slalom Surface Mount Heat Sink for D2PAK RoHS Compliant SLALOM SURFACE MOUNT HEAT SINK Aavid Thermalloy introduces it newest innovation in SMT compatible heat sinks to meet the needs of newer higher power semiconductors. The heat sinks’ unique design Patent Pending combines the technology of
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Untitled
Abstract: No abstract text available
Text: WL 3000 Liquid to Air Heat Exchanger System Innovative Technology for a Connected World WATER COOLED HEAT EXCHANGER UNITS FOR MEDICAL AND INDUSTRIAL SYSTEMS The WL3000 is a re-circulating liquid to air heat exchanger that offers dependable, compact performance by removing large amounts of heat from a liquid circuit. The coolant is recirculated using a high pressure pump to assure maximum flow rate. Heat from coolant is
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WL3000
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Untitled
Abstract: No abstract text available
Text: WL 1000 Liquid to Air Heat Exchanger System Innovative Technology for a Connected World WATER COOLED HEAT EXCHANGER UNITS FOR MEDICAL AND INDUSTRIAL SYSTEMS The WL1000 is a re-circulating liquid to air heat exchanger that offers dependable, compact performance by removing large amounts of heat from a liquid circuit. The coolant is recirculated using a high pressure pump to assure maximum flow rate. Heat from coolant is
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WL1000
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Untitled
Abstract: No abstract text available
Text: WL 2000 Liquid to Air Heat Exchanger System Innovative Technology for a Connected World WATER COOLED HEAT EXCHANGER UNITS FOR MEDICAL AND INDUSTRIAL SYSTEMS The WL2000 is a re-circulating liquid to air heat exchanger that offers dependable, compact performance by removing large amounts of heat from a liquid circuit. The coolant is recirculated using a high pressure pump to assure maximum flow rate. Heat from coolant is
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WL2000
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Untitled
Abstract: No abstract text available
Text: WL 5000 Liquid to Air Heat Exchanger System Innovative Technology for a Connected World WATER COOLED HEAT EXCHANGER UNITS FOR MEDICAL AND INDUSTRIAL SYSTEMS The WL 5000 is a re-circulating liquid to air heat exchanger that offers dependable, compact performance by removing large amounts of heat from a liquid circuit. The coolant is recirculated using a high pressure pump to assure maximum flow rate. Heat from coolant is
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Untitled
Abstract: No abstract text available
Text: WL 1500 Liquid to Air Heat Exchanger System Innovative Technology for a Connected World WATER COOLED HEAT EXCHANGER UNITS FOR MEDICAL AND INDUSTRIAL SYSTEMS The WL1500 is a re-circulating liquid to air heat exchanger that offers dependable, compact performance by removing large amounts of heat from a liquid circuit. The coolant is
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WL1500
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Untitled
Abstract: No abstract text available
Text: WL 500 Liquid to Air Heat Exchanger System Innovative Technology for a Connected World WATER COOLED HEAT EXCHANGER UNITS FOR MEDICAL AND INDUSTRIAL SYSTEMS The WL500 is a re-circulating liquid to air heat exchanger that offers dependable, compact performance by removing large amounts of heat from a liquid circuit. The coolant is
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WL500
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ebonol
Abstract: 260-4TH5B ebonol c black 205cb AB-275 204-CB TUBE 1625 5 lead dd pak weight 260-6SH5B 205-CB
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
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O-220,
OT-223,
SOL-20
ebonol
260-4TH5B
ebonol c black
205cb
AB-275
204-CB
TUBE 1625
5 lead dd pak weight
260-6SH5B
205-CB
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ebonol
Abstract: 217-36CT6 218-40CT3 218-40CT5 MO-169 204sb
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
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O-220,
OT-223,
SOL-20
ebonol
217-36CT6
218-40CT3
218-40CT5
MO-169
204sb
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Untitled
Abstract: No abstract text available
Text: Heat Conducting Magnetic Sheet LiqualloyTM with Noise Suppression HMFTW Series Multi-functions of heat conduction and noise suppression in one device through our original magnetic material technology. The best heat and noise solutions for GPU/CPU optimum performance.
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10MHz
20ppm
100mm
100mm
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217-36CTT6
Abstract: ebonol 217-36CT6 230-75AB-10 MO-169 204-CB 260-6SH5B 215AP 627 Series 260-4T5
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
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O-220,
OT-223,
SOL-20
217-36CTT6
ebonol
217-36CT6
230-75AB-10
MO-169
204-CB
260-6SH5B
215AP
627 Series
260-4T5
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ebonol
Abstract: 215CB 647-25ABP 217-36CT6 230-75AB-10 MO-169 205-CB 281-2AB 204CB 1134 sot dm
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
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O-220,
OT-223,
SOL-20
ebonol
215CB
647-25ABP
217-36CT6
230-75AB-10
MO-169
205-CB
281-2AB
204CB
1134 sot dm
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Untitled
Abstract: No abstract text available
Text: Home | Products | About Us Quick Jump: | Heat Technology EconoIron Model EI | What's New | Parts & Service | Contact Us -20 K Entry-level, consumer quality, butane-powered soldering/heat tool kit Kit contains unit, solder tip, heat tip, torch tip, hot knife
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F/1300Â
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CRYDOM ssr panel mount
Abstract: Heat Sinks heat sink what is an Relay HS50 HS351 HS271DR solid state relay
Text: HS Series Heat Sinks & SSR/Heat Sink Assemblies 1 What is a Heat Sink & SSR/Heat Sink Assembly and Why Do We Need It? A heat sink is a mechanical structure designed to dissipate thermal energy from a mounted semiconductor into the surrounding ambient air.
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Heat Pipe Assemblies
Abstract: heat pipe
Text: Welcome to the World of Aavid Heat Pipes As a pioneer in heat pipe technology and their application, Aavid Thermalloy has developed a high quality manufacturing process to ensure long life and reliability in our heat pipes. We’ve had over a decade of experience designing
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ebonol
Abstract: abe sot-223 217-36CTRE6 217-36CT6 MO-169
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
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O-220,
OT-223,
SOL-20
ebonol
abe sot-223
217-36CTRE6
217-36CT6
MO-169
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N10015
Abstract: 218-40cte3 ebonol outline of the heat sink for JEDEC 217-36CT6 MO-169 218-40CTE5 217-36CTTE6 unc screw 230-75ABE-01
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
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O-220,
OT-223,
SOL-20
292-AB
292-AB
N10015
218-40cte3
ebonol
outline of the heat sink for JEDEC
217-36CT6
MO-169
218-40CTE5
217-36CTTE6
unc screw
230-75ABE-01
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Untitled
Abstract: No abstract text available
Text: presented in Figures 4 and 5 [3]. Figure 4 shows the temperature difference between evaporator and condenser at different power levels when the heat pipes are vertical. Compared to small diameter heat pipes, large diameter heat pipes transport more heat with
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JS-709
Abstract: 2410m case tower i7-2670QM
Text: Tower Heat-Sink FXXRGTHS Compare Queue 0 Home Intel Server Products Page 1 of 1 English Send Feedback Server Accessories Heat-Sink Options Type Here to Search Products Tower Heat-Sink FXXRGTHS Tower Heat-Sink FXXRGTHS SPECIFICATIONS All Essentials Specifications
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i7-2630QM/i7-2635QM,
i7-2670QM/i7-2675QM,
i5-2430M/i5-2435M,
i5-2410M/i5-2415M.
m/products/51231/Tower-Heat-Sink-FXXRGTHS
JS-709
2410m
case tower
i7-2670QM
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Untitled
Abstract: No abstract text available
Text: THERMAL MANAGEMENT PRODUCTS CATALOG CTS ELECTRONIC COMPONENTS www.ctscorp.com CTS ® TABLE OF CONTENTS PAGE FAN HEAT SINKS 3 ADHESIVE PEEL AND STICK HEAT SINKS 6 FORGED HEAT SINKS WITH PLATE FINS 7 FORGED HEAT SINKS WITH PIN FINS 9 CLIP AND TAPE STYLES
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O-126,
O-202,
O-218
O-220
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ebonol
Abstract: 637-10ABEP WTS001 MO-169 217-36CT6 634-20ABEP 637-15ABEP 236-150ABE-01 abe sot-223 sot-223 package dimensions
Text: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
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WTS001
p1-25
O-220,
OT-223,
SOL-20
ebonol
637-10ABEP
MO-169
217-36CT6
634-20ABEP
637-15ABEP
236-150ABE-01
abe sot-223
sot-223 package dimensions
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Untitled
Abstract: No abstract text available
Text: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
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WTS001
p1-25
O-220,
OT-223,
SOL-20
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