Untitled
Abstract: No abstract text available
Text: Accessories Heat Sinks Power-One has a wide range of standard and specialized heat sinks available for our converters. Shown below are standard product heat sinks. The heat sink kits include the heat sink, thermal pad, and mounting hardware. On horizontal heat
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HAS/HBC/HBCS/HHSK-HBX500-24H
HSK-HBX500-45H
HSK-HBX500-60H
HSK-HBX500-95H
HSK-HBX500-24V
HSK-HBX500-45V
HSK-HBX500-60V
HSK-TQD500-95H
HSK-TQD500-24V
HSK-TQD500-45V
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050234
Abstract: LGA1257 heat pipes
Text: Xeon 7500 Series 4U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL XEON 7500 SERIES PROCESSORS Aavid’s line of 7500 series processor heat sinks are suitable for mainstream servers. Their unique design removes heat using heat pipes, copper,
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050074
Abstract: heat pipes X5570 E5520 E5530 LGA1366 E5506 heat pipes intel
Text: Xeon 5500 Series 2U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL XEON 5500 SERIES PROCESSORS Aavid’s line of 5500 series processor heat sinks are suitable for mainstream PCs. Their unique design removes heat using heat pipes, copper,
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E5520
Abstract: LGA1366 E5530 E5506 heat pipes E5540
Text: Xeon 5500 Series 1U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL XEON 5500 SERIES PROCESSORS Aavid’s line of 5500 series processor heat sinks are suitable for mainstream servers. Their unique design removes heat using heat pipes, copper,
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050232
Abstract: Intel Xeon 5500 heat pipes LGA1366 X5570 AAvid 050232 Xeon 5500 X557
Text: Xeon 5500 Series 1U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL XEON 5500 SERIES PROCESSORS Aavid’s line of 5500 series processor heat sinks are suitable for mainstream servers. Their unique design removes heat using heat pipes, copper,
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050235
Abstract: heat pipes E5520 E5504 E5530 LGA1366 E5506 shinetsu
Text: Xeon 5500 Series Blade High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL XEON 5500 SERIES PROCESSORS Aavid’s line of 5500 series processor heat sinks are suitable for mainstream servers. Their unique design removes heat using heat pipes, copper,
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Untitled
Abstract: No abstract text available
Text: 6 5 ^ 4 DRAWING CINCH PART NUMBER MATRIX REV P/N: 581 01 60 031 P/N: 581 01 60 032 P/N: 581 01 60 033 ENCLOSURE WITH TWO HEAT SINKS ENCLOSURE WITH ONE HEAT SINK ENCLOSURE WITHOUT HEAT SINKS HEAT SINKS HEAT ON . SIDE P/N: 581 01 60 039 ENCLOSURE WITH TWO HEAT SINKS & MEMBRANE VENT
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CRYDOM ssr panel mount
Abstract: Heat Sinks heat sink what is an Relay HS50 HS351 HS271DR solid state relay
Text: HS Series Heat Sinks & SSR/Heat Sink Assemblies 1 What is a Heat Sink & SSR/Heat Sink Assembly and Why Do We Need It? A heat sink is a mechanical structure designed to dissipate thermal energy from a mounted semiconductor into the surrounding ambient air.
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050075
Abstract: E5540 LGA1366 Intel Xeon 5500 l5520 heat pipes E5506 W3520 E5520 E5530
Text: Xeon 5500 Series 4U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL XEON 5500 SERIES PROCESSORS Aavid’s line of 5500 series processor heat sinks are suitable for mainstream servers. Their unique design removes heat using heat pipes, copper, and
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050233
Abstract: E5504 Aavid thermalloy 9000 heat pipes intel E5520 E5530 LGA1366 x.25 intel E5506 aavid
Text: Xeon 5500 Series Active 2U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL XEON 5500 SERIES PROCESSORS Aavid’s line of 5500 series processor heat sinks are suitable for mainstream desktop PCs. Their unique design removes heat using heat pipes, copper, and
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Untitled
Abstract: No abstract text available
Text: CHEMTRONICS CW7250 Technical Data Sheet CircuitWorks Boron Nitride Heat Sink Grease PRODUCT DESCRIPTION CircuitWorks Boron Nitride Heat Sink Grease facilitates heat transfer away from electrical/electronic components and into heat sinks. The material
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CW7250
MIL-C-47113
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Untitled
Abstract: No abstract text available
Text: CHEMTRONICS Technical Data Sheet CW7270 CircuitWorks Silicone Free Heat Sink Grease PRODUCT DESCRIPTION CircuitWorks Silicone Free Heat Sink Grease facilitates heat transfer away from electrical/electronic components and into heat sinks. This silicone-free compound
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CW7270
MIL-C-47113
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Untitled
Abstract: No abstract text available
Text: Extruded Heat Sinks for DC/DC Converters 14 Heat sinks for “Full-Brick” DC/DC Converters Heat sinks for “Full-Brick” DC/DC Converters Standard mounting slots mate with Vicor DC/DC converters. Optimized aluminum extruded fin construction transfers heat efficiently
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RT3830C00000
RT3835C00000
RT3845C00000
RT3840C00000
RT3830C00000
RT3835C00000
RT3840C00000
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Untitled
Abstract: No abstract text available
Text: THERMAL MANAGEMENT PRODUCTS CATALOG CTS ELECTRONIC COMPONENTS www.ctscorp.com CTS ® TABLE OF CONTENTS PAGE FAN HEAT SINKS 3 ADHESIVE PEEL AND STICK HEAT SINKS 6 FORGED HEAT SINKS WITH PLATE FINS 7 FORGED HEAT SINKS WITH PIN FINS 9 CLIP AND TAPE STYLES
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O-126,
O-202,
O-218
O-220
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80486DX
Abstract: AMD 80486DX AM486TMdx4 helium gas sensor module 80486DX2 AM29030 AM486 heat sink Heat Sinks 80486DX intel
Text: Integrated Circuit Heat Sinks PENGUIN COOLERS: HEAT SINKS FOR MICROPROCESSORS AND ASICs 662 SERIES Pin Fin Heat Sink for Limited Height Applications for Intel 80486DX, AMD AM29030 17 x 17 PGA Standard P/N Base Dimensions in. mm Height in. (mm) Heat Sink
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80486DX,
AM29030
662-15AG
628-20AB
628-25AB
628-35AB
628-40AB
628-65AB
80486DX2TM,
AM486TMDX2,
80486DX
AMD 80486DX
AM486TMdx4
helium gas sensor module
80486DX2
AM29030
AM486
heat sink
Heat Sinks
80486DX intel
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83230
Abstract: No abstract text available
Text: Home| Contact Us| About Aavid Heat sink producer for both custom and standard heat sinks, Aavid Thermalloy A global manufacturer of custom and standard heat sinks. Heat sinks, interface materials, attachments, request sample, rfq, more Custom, Software, Design Process, Thermal Assemblies, CFD, Model Shop
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25han
83230
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MATERIAL SAFETY DENATURED ALCOHOL
Abstract: TC-2707
Text: Technical Data November 2011 3M Thermally Conductive Interface Pads 5591 and 5591S Product Description 3M™ Thermally Conductive Interface Pads 5591 and 5591S are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks, heat spreaders or other cooling devices.
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5591S
5591S
5591/5591S
225-3S-06
MATERIAL SAFETY DENATURED ALCOHOL
TC-2707
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Untitled
Abstract: No abstract text available
Text: 901-910 SERIES CHIPSET HEAT SINKS PIN FIN & ELLIPTICAL HEAT SINKS Wakefield-Vette’s 901-910 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx. TI, Motorola and many more! These heat sinks are designed for air flow applications. Enclosed pages
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Untitled
Abstract: No abstract text available
Text: heatsink C40 Heat Sink System The C40 Series Heat Sink System Patent Pending offers flexible, high performance and compact heat sinks with an exchangeable cam clip system for TO247, TO-264 and SOT-227 (clip in development) devices. This powerful heat sink can be thru-hole
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O-264
OT-227
C40-058-VE
C40-058-AE
CLA-T247-21E
O-247
O-264
1-866-9-OHMITE
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Untitled
Abstract: No abstract text available
Text: Technical Data July, 2010 3M Thermally Conductive Interface Pads 5592 and 5592S Product Description 3M™ Thermally Conductive Interface Pads 5592 and 5592S are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks, heat spreaders or other cooling devices.
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5592S
5592S
225-3S-06
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573300D00000G
Abstract: 411399
Text: Slalom Surface Mount Heat Sink for D2PAK RoHS Compliant SLALOM SURFACE MOUNT HEAT SINK Aavid Thermalloy introduces it newest innovation in SMT compatible heat sinks to meet the needs of newer higher power semiconductors. The heat sinks’ unique design Patent Pending combines the technology of
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Untitled
Abstract: No abstract text available
Text: Technical Data July, 2010 3M Thermally Conductive Interface Pads 5595 and 5595S Product Description 3M™ Thermally Conductive Interface Pads 5595 and 5595S are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks, heat spreaders or other cooling devices.
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5595S
5595S
225-3S-06
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Untitled
Abstract: No abstract text available
Text: Technical Data December 2013 3M Thermally Conductive Silicone Interface Pads 5519 and 5519S Product Description 3M™ Thermally Conductive Silicone Interface Pads 5519 and 5519S are designed to provide a preferential heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. These
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5519S
5519S
225-3S-06
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PF435
Abstract: PF434 PF436 PF432G PF435G 576802B04000G PF432 576802B03100G PF436G PF433
Text: TO-220 & TO-262 Heat Sinks Plug in style heat sink featuring four spring action clips FIGURE B FIGURE A 14.48 0.570 MAX 19.05 (0.750) Plug in style heat sink features four spring action clips to firmly hold the device to the heat sink ensuring maximum metal to
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O-220
O-262
PF436G
PF432,
PF433,
PF434,
PF435,
PF436
PF435
PF434
PF436
PF432G
PF435G
576802B04000G
PF432
576802B03100G
PF436G
PF433
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