Untitled
Abstract: No abstract text available
Text: Heat Sink SQ50x34 TECHNICAL DATA Heat Sink for DPSS Laser Modules SQ50x34 is a heat sink designed for DPSS laser modules of 12mm diameter. Made of black anodized aluminium it features very good thermal conductivity. The heat sink’s ground plate comes with five M4
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SQ50x34
SQ50x34
50x50x34
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pcb board of miniskiip 2
Abstract: miniskiip board MiniSKiiP 1 Package MiniSKiiP MiniSKiiP Package SEMIKRON BOARD Wacker silicone paste p 12 wacker rubber Wacker Silicones
Text: MiniSKiiP Assembly Instructions 1. Preparation, surface specification 1.2 Heat sink ≤ 20 µm Heat sink > 10 µm ≤ 6,3 µm Fig. 1: Heat sink surface specification ♦ Heat sink must be free from grease and particles ♦ unevenness of heat sink mounting area must be ≤ 20 µm
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COHS-50
Abstract: heat sink DOWNLIGHT
Text: Data sheet Heat Sink for COINlight-OSTAR COHS Highlights ¾ Accessory part for for optimised heat dissipation of COINlight-OSTAR® ¾ Improved life time of the module ¾ Easy mounting by screwing the heat sink on the module ¾ Small diameter adapted to the compact
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COHS-50
COHS-50
CO06A)
heat sink
DOWNLIGHT
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heat sink
Abstract: din 84
Text: Data sheet Heat Sink for COINlight-OSTAR COHS Highlights ¾ Accessory part for for optimised heat dissipation of COINlight-OSTAR® ¾ Improved life time of the module ¾ Easy mounting by screwing the heat sink on the module ¾ Small diameter adapted to the compact
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COHS-50
COHS-50
CO06A
CO06A)
heat sink
din 84
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wacker silicone paste
Abstract: silicone paste p 12 IEC 326-3 Wacker Silicones P-12 Wacker Silicones pcb board of miniskiip 2 Wacker miniskiip board SEMIKRON BOARD wacker rubber
Text: MiniSKiiP - Technical Explanations Assembly Instructions 1 Preparation, surface specification To obtain the maximum thermal conductivity of the module, heat sink and module must fulfil the following specifications. 1.1 Heat sink ≤ 20 µm Heat sink > 10 µm
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G3PA-210B-VD
Abstract: G3PA-210BL-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260BL-VD G3PA-260B-VD G3PA-420B-VD g3pa220bv
Text: Power Solid-state Relay G3PA- VD Extremely Thin Relays Integrated with Heat Sink Downsizing achieved through optimum design of heat sink. Mounting possible via screws or via DIN rail. Dense mounting possible for linking terminals. (Except for G3PA-260B-VD.)
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G3PA-260B-VD.
G3PA-420B-VD/-430B-VD
G3PA-210B-VD
K94-E1-3
06-949-6115/Fax:
0397-1M
G3PA-210B-VD
G3PA-210BL-VD
G3PA-220BL-VD
G3PA-220B-VD
G3PA-240BL-VD
G3PA-240B-VD
G3PA-260BL-VD
G3PA-260B-VD
G3PA-420B-VD
g3pa220bv
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G32A-A20-VD
Abstract: G32A-A10-VD G3PA-240B-VD G32A-A40-VD G32A-A60-VD G3PA-210BL-VD G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD
Text: Power Solid-state Relay G3PA- VD Extremely Thin Relays Integrated with Heat Sink Downsizing achieved through optimum design of heat sink. Mounting possible via screws or via DIN rail. Dense mounting possible for linking terminals. (Except for G3PA-260B-VD.)
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G3PA-260B-VD.
G3PA-210B-VD
G3PA-220B-VD
G3PA-430B-VD,
G3PA-430B-VD-2
K094-E1-3A
G32A-A20-VD
G32A-A10-VD
G3PA-240B-VD
G32A-A40-VD
G32A-A60-VD
G3PA-210BL-VD
G3PA-210B-VD
G3PA-220BL-VD
G3PA-220B-VD
G3PA-240BL-VD
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G32A-A20-VD
Abstract: G32A-A420 G3PA-220B-VD G32A-A10-VD G32A-A430 G3PA-210B-VD DC5-24 G3PA-240B-VD G3PA-260BL-VD G3PA-260B-VD G3PA-420B-VD
Text: Power Solid-state Relay G3PA- VD Extremely Thin Relays Integrated with Heat Sink Downsizing achieved through optimum design of heat sink. Mounting possible via screws or via DIN rail. Close mounting possible for linking terminals. (Except for G3PA-260B-VD.)
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G3PA-260B-VD.
G3PA-210B-VD
G3PA-220B-VD
G3PA-430B-VD,
G3PA-430B-VD-2
K094-E1-3B
G32A-A20-VD
G32A-A420
G3PA-220B-VD
G32A-A10-VD
G32A-A430
G3PA-210B-VD DC5-24
G3PA-240B-VD
G3PA-260BL-VD
G3PA-260B-VD
G3PA-420B-VD
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J137
Abstract: nissei capacitor nissei capacitors capacitor list nissei datasheet G32A-A20-VD G32A-A430 capacitor list nissei G3PA-220B-VD i2t graph phototriac
Text: Power Solid-state Relay G3PA- VD Extremely Thin Relays Integrated with Heat Sink • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. (Except for
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G3PA-260B-VD,
G3PA-450B-VD-2.
G3PA-210B-VD
G3PA-220B-VD
K094-E1-04
J137
nissei capacitor
nissei capacitors
capacitor list nissei datasheet
G32A-A20-VD
G32A-A430
capacitor list nissei
G3PA-220B-VD
i2t graph
phototriac
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miniskiip board
Abstract: MiniSKiiP
Text: Assembly of MiniSKiiP Heat sink Thermal paste MiniSKiiP power module Your printed circuit board Pressure part Screw 13.06.2006 11
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G3PB-225B-2H-VD
Abstract: G3PB525B2NVD
Text: Solid State Contactors New Heat Sink Construction G3PB-2N/-3N Refer to Safety Precautions for All Solid State Relays. Space and working time saved with new heat sink construction. Series now includes 480-VAC models to allow use in a greater range of applications.
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480-VAC
G3PB-225B-2H-VD
G3PB525B2NVD
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iec 62314
Abstract: No abstract text available
Text: Solid State Relays with Built-in Heat Sink - RSC Features • Slim design allows for compact DIN rail or panel mounting • Built-in heat sink maximizes current output capability • Epoxy-free design & improved thermal impedance • Choice of 20A, 30A and 45A models
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100k-cycle
UL508
80-280V
80-260V
0-140V
800-262-IDEC
iec 62314
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Untitled
Abstract: No abstract text available
Text: TÜV Rheinland Breakdown voltage 2,500V Slim profile SSR with heat sink mountable on DIN rail AQ-K (Breakdown voltage 4,000V) AQ-K RELAYS FEATURES APPLICATIONS 1. Combined with heat sink for vertical profile Helps to save space on control panel 2. Dielectric voltage of 2,500V or
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890inch
205inch
RS485
AKT4H111100
ASCTB85E
201201-T
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Untitled
Abstract: No abstract text available
Text: l a on i ss ion e of lut r P So Enclosures & Components Cooling elements as front or rear panel in the 19-inch technology Heat Sink Front Panels System Platforms Backplanes Enclosures & Components Cabinets Rotary Switches Da t a sheet Heat Sink Front Panels
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19-inch
81-062-xx
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panasonic varistor
Abstract: AQK1211 AQK1231 AQK2211 AQK2231
Text: TÜV Rheinland Breakdown voltage 2,500V Slim profile with heat sink mountable on DIN rail AQ-K (Breakdown voltage 4,000V) AQ-K RELAYS FEATURES APPLICATIONS 1. Combined with heat sink for vertical profile Helps to save space on control panel 2. Dielectric voltage of 2,500V or
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RS485
890inch
205inch
AKT4H111100
panasonic varistor
AQK1211
AQK1231
AQK2211
AQK2231
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torque of screw for pcb
Abstract: bga socket dowel pin SG-BGA-6074
Text: Top View without heatsink GHz BGA Socket - Direct mount, solderless Bottom View Holes tapped in backing plate for mounting socket base (x4). 63.245mm 1.91mm 63.245mm Side View 1 Side View (exploded) 42.5mm 2mm 7 1 Heat Sink Lid: Anodized 6061 Aluminum. Single piece construction. Bottom of heat sink has
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245mm
525mm
torque of screw for pcb
bga socket
dowel pin
SG-BGA-6074
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G3PB-245B-2N/2H-VD
Abstract: No abstract text available
Text: Solid State Contactors New Heat Sink Construction G3PB-2N/-3N CSM_G3PB-2N_-3N_DS_E_2_1 Space and working time saved with new heat sink construction. Series now includes 480-VAC models to allow use in a greater range of applications. • A comprehensive lineup that now includes 480-VAC models.
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480-VAC
G3PB-245B-2N/2H-VD
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1161A1
Abstract: No abstract text available
Text: TAP600 Series 600 Watt Heat Sinkable Planar Ohmite’s TAP600 delivers 600 watts of reliable power to a variety of power conditioning, power transmission, and power control applications. These resistors can be designed for liquid or air cooled heat sink systems.
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TAP600
1-866-9-OHMITE
1161A1
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Untitled
Abstract: No abstract text available
Text: TAP600 Series 600 Watt Heat Sinkable Planar Ohmite’s TAP600 delivers 600 watts of reliable power to a variety of power conditioning, power transmission, and power control applications. These resistors can be designed for liquid or air cooled heat sink systems.
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TAP600
1-866-9-OHMITE
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179D
Abstract: SN62
Text: Application Note for the Mounting of High Power Flange Devices When mounting High Power Flange Devices in a circuit, there are several key issues that should be taken into account. Heat Sink Design: The heat sink the device is mounted to must be designed to maintain the temperature design while it is
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179Deg
179D
SN62
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G3PA-210BL-VD
Abstract: G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260B-VD G3PA-450B-VD-2 J-21
Text: Solid State Relays G3PA Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA260B-VD and G3PA-450B-VD-2.
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G3PA260B-VD
G3PA-450B-VD-2.
K094-E1-06
G3PA-210BL-VD
G3PA-210B-VD
G3PA-220BL-VD
G3PA-220B-VD
G3PA-240BL-VD
G3PA-240B-VD
G3PA-260B-VD
G3PA-450B-VD-2
J-21
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G3PA-210BL-VD
Abstract: G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260B-VD G3PA-450B-VD-2 J-21
Text: Solid State Relays G3PA Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA260B-VD and G3PA-450B-VD-2.
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G3PA260B-VD
G3PA-450B-VD-2.
G3PA-210BL-VD
G3PA-210B-VD
G3PA-220BL-VD
G3PA-220B-VD
G3PA-240BL-VD
G3PA-240B-VD
G3PA-260B-VD
G3PA-450B-VD-2
J-21
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AC line snubber 3 phase 1000 amp
Abstract: crydom 5942 HS202 H12D2425D d2425d HS301DR-HD6025 hd4850 crydom 240 9622
Text: 1179-2012.qxp:QuarkCatalogTempNew 9/10/12 5:02 PM Page 1179 13 Heat Sinks and Solid State Relays RoHS HS301DR-D2425 HS201DR-D2450 HS053-D53TP50D Assemblies offer the advantage of eliminating the calculations and heat sink selection during the design phase of a project,
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HS501DR-D2425
HS501DR-HD6025
HS351DR-D2425
HS351DR-HD6025
HS301DR-D2425
HS301DR-HD6025
HS271DR-D2425
HS271DR-HD6025
HS251-D2450
HS251-HD6050
AC line snubber 3 phase 1000 amp
crydom 5942
HS202
H12D2425D
d2425d
hd4850 crydom
240 9622
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Untitled
Abstract: No abstract text available
Text: INSTALLATION INSTRUCTIONS KDI TYPE PPT/PPR HIGH POWER TERMINATIONS AND RESISTORS 2. MOUNTING 1. HEAT SINK REQUIREMENTS: These Devices must be mounted on a Heat Sink of sufficient thermal dissipation to control the mounting flange of the part to a maximum temperature of
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