EP3SE110F1152
Abstract: f7807 EP3SE110-F1152 EP3SL110F780 107K hc335 WF484 EP3SE110F780 GEN-1002-00 EP3SL200-F1517
Text: HardCopy III ASIC Product Table v0.995 HardCopy Base Die HardCopy III ASIC Package Body Size 2 WF484 (23 mm) FF484 (23 mm) HC325 WF780 (29 mm) FF780 (29 mm) Generic Part Number HC325WF484N HC325FF484N HC325WF780N HC325FF780N Stratix III FPGA Prototype 107K
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EP3SE110--F7807
EP3SL200--H7807
EP3SL340--H11527
GEN-1002-00
EP3SE110F1152
f7807
EP3SE110-F1152
EP3SL110F780
107K
hc335
WF484
EP3SE110F780
GEN-1002-00
EP3SL200-F1517
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transistor 6c x
Abstract: f15u12 WF484 diode t25 4 G9 AC27 AA34 H1152 diode AG14 ah5 diode diode b14 8b
Text: Pin Information for HardCopy III HC325WF484 Version 1.0 Bank Number VREF Group 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A VREFB1AN0 VREFB1AN0 VREFB1AN0 VREFB1AN0
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HC325WF484
PT-HC325WF484-1
transistor 6c x
f15u12
WF484
diode t25 4 G9
AC27
AA34
H1152
diode AG14
ah5 diode
diode b14 8b
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transistor 6c x
Abstract: HC325WF780 AG12 AA34 H1152 diode F4 8c diode t25 4 g8
Text: Pin Information for HardCopy III HC325WF780 Version 1.0 Bank Number 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1C VREF Group VREFB1AN0 VREFB1AN0 VREFB1AN0 VREFB1AN0 VREFB1AN0 VREFB1AN0
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HC325WF780
PT-HC325WF780-1
transistor 6c x
HC325WF780
AG12
AA34
H1152
diode F4 8c
diode t25 4 g8
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HC325FF780
Abstract: PT-HC325FF780-1 transistor 6c x FF780 AA34 H1152 HC325Ff78 AE-15
Text: Pin Information for HardCopy III HC325FF780 Version 1.0 Bank Number VREF Group 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A VREFB1AN0 VREFB1AN0 VREFB1AN0 VREFB1AN0
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HC325FF780
PT-HC325FF780-1
HC325FF780
transistor 6c x
FF780
AA34
H1152
HC325Ff78
AE-15
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transistor 6c x
Abstract: HC325FF484 diode AG14 AH15 E20 L27 AA34 H1152 diode x9 FF484
Text: Pin Information for HardCopy III HC325FF484 Version 1.0 Bank Number VREF Group 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A VREFB1AN0 VREFB1AN0 VREFB1AN0 VREFB1AN0 VREFB1AN0
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HC325FF484
PT-HC325FF484-1
transistor 6c x
HC325FF484
diode AG14
AH15
E20 L27
AA34
H1152
diode x9
FF484
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EP4CE15
Abstract: EP4CE22 EP2AGX190 interlaken EP4CGX150 EP4CGX30 EP3SE50 EP4CE30 HC210 EP1C12
Text: Quartus II Software Version 10.0 SP1 Device Support RN-01057 Release Notes This document provides late-breaking information about device support in the 10.0 SP1 version of the Altera Quartus® II software. For information about disk space and system requirements, refer to the readme.txt file in your
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RN-01057
EP4CE15
EP4CE22
EP2AGX190
interlaken
EP4CGX150
EP4CGX30
EP3SE50
EP4CE30
HC210
EP1C12
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EP3SL340F1517
Abstract: altera cyclone 3 handbook texas instruments HC335FF1152 HC325Ff DDR3 jedec diode handbook fbga Substrate design guidelines hc335 texas instruments handbook
Text: HardCopy III Device Handbook, Volume 1 101 Innovation Drive San Jose, CA 95134 www.altera.com HC3_H5V1-3.2 Copyright 2010 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other
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DDR3 jedec
Abstract: linear handbook HC335 SSTL-15 SSTL-18 DDR3 SSTL class
Text: HardCopy III Device Handbook, Volume 3 101 Innovation Drive San Jose, CA 95134 www.altera.com HC3_H5V3-3.0 Copyright 2009 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other
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hc335
Abstract: 1517P WF484
Text: 1. HardCopy III Device Family Overview HIII51001-3.1 Introduction This chapter provides an overview of features available in the HardCopy III device family. More details about these features can be found in their respective chapters. HardCopy III devices are Altera’s low-cost, high-performance, low-power ASICs with
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HIII51001-3
hc335
1517P
WF484
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EP4CE6 package
Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
Text: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead
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DS-PKG-16
EP4CE6 package
EP4CE40
Altera EP4CE6
EP4CE55
5M240Z
5M1270Z
QFN148
5m570z
5M40
5M80
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F1517
Abstract: No abstract text available
Text: 1. HardCopy III Design Flow Using the Quartus II Software HIII53001-3.1 This chapter provides recommendations for HardCopy III development, planning, and settings considerations in the Quartus® II software. HardCopy III ASIC devices are Altera’s low-cost, high-performance, and low-power ASICs with pin-outs,
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HIII53001-3
F1517
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5AGX
Abstract: lpddr2 tutorial EP4CE22F17 solomon 16 pin lcd display 16x2 Altera MAX V CPLD DE2-70 vhdl code for dvb-t 2 fpga based 16 QAM Transmitter for wimax application with quartus altera de2 board sd card AL460A-7-PBF
Text: Version 11.0 Altera Product Catalog Contents Glossary. 2 Stratix FPGA Series. 3 HardCopy® ASIC Series. 17 Arria® FPGA Series. 21
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SG-PRDCT-11
5AGX
lpddr2 tutorial
EP4CE22F17
solomon 16 pin lcd display 16x2
Altera MAX V CPLD
DE2-70
vhdl code for dvb-t 2
fpga based 16 QAM Transmitter for wimax application with quartus
altera de2 board sd card
AL460A-7-PBF
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EP4CE15
Abstract: EP4CE40 EP4CE30 EP4CE22 EP4CGX30CF23 EP4CE10 EP4CE75 EP2AGX190 Altera EP4CE6 EP4CE6
Text: Quartus II Software Version 9.1 SP2 Device Support Release Notes RN-01053 March 2010 This document provides late-breaking information about device support in this version of the Altera Quartus® II software. For information about disk space and system requirements,
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RN-01053
EP4CE15
EP4CE40
EP4CE30
EP4CE22
EP4CGX30CF23
EP4CE10
EP4CE75
EP2AGX190
Altera EP4CE6
EP4CE6
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HC335f
Abstract: 1517 data sheet flip chip
Text: 12. HardCopy III Device and Packaging Information HIII51012-3.0 Introduction This chapter provides package information for HardCopy III devices. Device and Package Information HardCopy III device and package reference information is listed in Table 12–1.
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HIII51012-3
HC315W
HC325W
HC325F
HC335L
HC335F
HC335f
1517 data sheet
flip chip
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EP2AGX190
Abstract: EP3CLS200 EP2AGX125 EP4SE230 EP4SE530 EP2AGX260 HC210 EP2AGX45 EP3CLS150 EP3CLS70
Text: Quartus II Software Device Support Release Notes RN-01047-1.0 June 2009 This document provides late-breaking information about device support in this version of the Altera Quartus® II software. For information about disk space and system requirements, refer to the readme.txt file in your altera/<version number>/quartus directory.
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RN-01047-1
EP2AGX190
EP3CLS200
EP2AGX125
EP4SE230
EP4SE530
EP2AGX260
HC210
EP2AGX45
EP3CLS150
EP3CLS70
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EIA-644
Abstract: SSTL-15 SSTL-18 HC325Ff78 HC335f HC325FF780 HC325Ff
Text: Section II. I/O Interfaces This section includes the following chapters: • Chapter 6, HardCopy III Device I/O Features ■ Chapter 7, External Memory Interfaces in HardCopy III Devices ■ Chapter 8, High-Speed Differential I/O Interfaces and DPA in HardCopy III
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1517P
Abstract: HC325 EP3SE110F HC335FF1152 verilog code for delta sigma adc m9ka hc335ff1152n 24BAN HC335LF1152
Text: HardCopy III Device Handbook Volume 1: Device Interfaces and Integration HardCopy III Device Handbook Volume 1: Device Interfaces and Integration 101 Innovation Drive San Jose, CA 95134 www.altera.com HC3_H5V1-3.3 2011 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX are Reg. U.S. Pat.
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Untitled
Abstract: No abstract text available
Text: 7. External Memory Interfaces in HardCopy III Devices HIII51007-3.0 Introduction This chapter describes the hardware features that support high-speed memory interfacing for each double data rate DDR memory standard in HardCopy III devices. HardCopy III devices feature delay-locked loops (DLLs), phase-locked loops
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HIII51007-3
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hc335
Abstract: EP3SE110 M144K "Single-Port RAM" kb 355
Text: 4. TriMatrix Embedded Memory Blocks in HardCopy III Devices HIII51004-3.0 Introduction HardCopy III devices offer TriMatrix embedded memory blocks to efficiently address the needs of ASIC designs. TriMatrix memory comes in three different sizes and includes 640-bit memory logic array blocks MLABs , 9-Kbit M9K blocks, and
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HIII51004-3
640-bit
144-Kbit
M144K
hc335
EP3SE110
"Single-Port RAM"
kb 355
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modelsim 6.3f
Abstract: ekp 71 set_net_delay micron ddr3 POS-PHY ATM format EP2AGX125 EP2AGX190 EP2AGX45 EP2AGX65 EP3CLS200
Text: Quartus II Software Release Notes RN-01048-1.0 July 2009 This document provides late-breaking information about the following areas of this version of the Altera Quartus®II software. For information about memory, disk space, system requirements, and device support in this version of the Quartus II software, along with the
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RN-01048-1
modelsim 6.3f
ekp 71
set_net_delay
micron ddr3
POS-PHY ATM format
EP2AGX125
EP2AGX190
EP2AGX45
EP2AGX65
EP3CLS200
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EP4CE15
Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
Text: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead
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DS-PKG-16
EP4CE15
MS 034
BGA and QFP Altera Package mounting
Altera pdip top mark
jedec package MO-247
SOIC 20 pin package datasheet
QFN "100 pin" PACKAGE thermal resistance
Theta JC of FBGA
QFN148
EP4CE22
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1071.0080
Abstract: EP4SGX360K ep4sgx530kh40 ModelSim EP3CLS100 EP3CLS70 EP4CGX15 EP4CGX22 EP4CGX30 EP4SE360
Text: Quartus II Software Release Notes RN-01050-1.0 November 2009 This document provides late-breaking information about the following areas of the Altera Quartus®II software version 9.1. For information about memory, disk space, system requirements, and device support in this version of the Quartus II software, along with the
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RN-01050-1
1071.0080
EP4SGX360K
ep4sgx530kh40
ModelSim
EP3CLS100
EP3CLS70
EP4CGX15
EP4CGX22
EP4CGX30
EP4SE360
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1517 data sheet
Abstract: HC335f
Text: Section V. Packaging Information This section includes the following chapter: • Chapter 12, HardCopy III Device and Packaging Information Revision History Refer to each chapter for its own specific revision history. For information on when each chapter was updated, refer to the Chapter Revision Dates section, which appears
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HIII51012-3
1517 data sheet
HC335f
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hc322
Abstract: TC74HC162 hc324 TC74HC162AP 74LS1601 74LS160-163
Text: TC74HC160AP/AF TC74HC161AP/AF/AFN TC74HC162AP/A F •TC74HC163AP/A F / A F N SYNCHRO NO US P R E S E T T A B LE 4 - B IT COUNTER T C 7 4 H C 1 8 0 A P /A F D ECAD E. ASYNCHRONOUS C LE A R T C 7 4 H C lt1 A P /A F /A F N B IN A R Y . A S Y N C H R O N O U S C L E A R
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TC74HC160AP/AF
TC74HC161AP/AF/AFN
TC74HC162AP/A
TC74HC163AP/A
HC-327
-TC74HC161AP/AF/AFN
TC74HC162AP/AF
TC74HC163AP/AF/AFN
TC74HC160A/161A)
hc322
TC74HC162
hc324
TC74HC162AP
74LS1601
74LS160-163
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