Senju
Abstract: H60A senju h63a Senju Sn Pb 60 40 solder senju solder paste H63A Senju metal solder paste SPT-70-OF-2063 Ultrasonic flow
Text: !Solder and Flux 1 Solder Paste Flow Soldering : Use H60A or H63A. Reflow Soldering : Use RA type cream solder (Sn 60%/Pb 40%) (Type No. of cream solder : SPT-70-OF-2063 by Senju Metal Industrial) (2) Flux : Use Rosin type flux. Do not use acidic flux (with chlorine content exceeding 0.2wt%).
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SPT-70-OF-2063
Senju
H60A
senju h63a
Senju Sn Pb 60 40 solder
senju solder paste
H63A
Senju metal solder paste
Ultrasonic flow
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Senju
Abstract: SPT-70-OF-2063 senju h63a senju solder paste Senju flux solder paste H63A Senju metal solder paste H60A
Text: !Solder and Flux 1 Solder Paste Flow Soldering : Use H60A or H63A. Reflow Soldering : Use RA type cream solder (Sn 60%/Pb 40%) (Type No. of cream solder : SPT-70-OF-2063 by Senju Metal Industrial) (2) Flux : Use Rosin type flux. Do not use acidic flux (with chlorine content exceeding 0.2wt%).
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SPT-70-OF-2063
Senju
senju h63a
senju solder paste
Senju flux
solder paste
H63A
Senju metal solder paste
H60A
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H63A
Abstract: H60A DSA0038169
Text: 3. Standard Soldering Conditions SOLDERING TEMPERATURE AND TIME To prevent external electrode solder leaching and performance deterioration, solder within the temperature and time combinations illustrated by the slanted lines in the following graphs. If soldering is
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VCM11R
Abstract: H63A H60A
Text: 3. Standard Soldering Conditions SOLDERING TEMPERATURE AND TIME To prevent external electrode solder leaching and performance deterioration, solder within the temperature and time combinations illustrated by the slanted lines in the following graphs. If soldering is
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VCM11R/21R
VCM11R
H63A
H60A
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NFM60R
Abstract: NFM60 H63A H60A NFM51R
Text: 3. Standard Soldering Conditions SOLDERING TEMPERATURE AND TIME To prevent external electrode solder leaching and performance deterioration, solder within the temperature and time combinations illustrated by the slanted lines in the following graphs. If soldering is
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NFM51R
NFM60R
NFM60
H63A
H60A
NFM51R
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H63A
Abstract: H60A
Text: 3. Standard Soldering Conditions SOLDERING TEMPERATURE AND TIME To prevent external electrode solder leaching and performance deterioration, solder within the temperature and time combinations illustrated by the slanted lines in the following graphs. If soldering is
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BLA3216
H63A
H60A
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H60A
Abstract: H63A H63A FLOW SOLDER
Text: 3. Standard Soldering Conditions SOLDERING TEMPERATURE AND TIME To prevent external electrode solder leaching and performance deterioration, solder within the temperature and time combinations illustrated by the slanted lines in the following graphs. If soldering is
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H63A
Abstract: nfm39r H60A nfm39
Text: 3. Standard Soldering Conditions SOLDERING TEMPERATURE AND TIME To prevent external electrode solder leaching and performance deterioration, solder within the temperature and time combinations illustrated by the slanted lines in the following graphs. If soldering is
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VFM41R
NFM39R/40R/41R/2012P
NFM40P/41P
NFM839R
H63A
nfm39r
H60A
nfm39
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plm250
Abstract: H63A FLOW SOLDER H60A H63A PLM3216K
Text: 3. Standard Soldering Conditions SOLDERING TEMPERATURE AND TIME To prevent external electrode solder leaching and performance deterioration, solder within the temperature and time combinations illustrated by the slanted lines in the following graphs. If soldering is
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PLM3216K
PLP3216S
PLM250
plm250
H63A FLOW SOLDER
H60A
H63A
PLM3216K
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H60A
Abstract: H63A
Text: for reflow soldering Land Solder Resist NFE61P/61H Chip mounting side Back side Small diameter thru hole φ0.4— φ0.6 3.0 Connect to ground pattern of mounting side 1.6 2.6 3.0 1. Standard Land Pattern Dimensions The capacitor type chip EMI suppression filters NFp
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NFE61P/61H
H60A
H63A
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NFE31P
Abstract: H60A H63A 02MG
Text: for reflow and flow soldering NFW31S for reflow soldering NFE31P Chip mounting side Land Solder Resist Back side Small diameter thru hole φ0.4—φ0.6 3.0 3.0 Connect to ground pattern of mounting side 2.6 1.0 1. Standard Land Pattern Dimensions The capacitor type chip EMI suppression filters NFp
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NFW31S
NFE31P
NFE31P
H60A
H63A
02MG
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H60A
Abstract: No abstract text available
Text: 1. STANDARD LAND DIMENSIONS A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip coil electrode. Reflow soldering should be applied for LQS33N 5.5 1.0 2.0 LQH3Nxx24/3Cxx24 LQS33N Solder:Use H60A,H63A JIS Z 3282 or equivalent.
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LQH3Nxx24/3Cxx24
LQS33N
LQS33N
LQP10A/11A
LQG10A/11A.
LQH3Nxx34/3Cxx34
LQS33C
LQS33C
MR-8153RA
NF-3000
H60A
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murata chip suppression filter NFA
Abstract: NFA81
Text: 2. Solder Paste Printing and Adhesive Application When reflow soldering the chip EMI suppression filter, the printing must be conducted in accordance with the following cream solder printing conditions. If too much solder is applied, the chip will prone to be
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NFA3216G/3216D
murata chip suppression filter NFA
NFA81
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flux NF-3000
Abstract: LQH3ER MURATA LQW18A transistor tip 31c LQW18A LQM31F 025030
Text: 1. STANDARD LAND DIMENSIONS A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip coil electrode. a Land Pattern Solder Resist c b Series LQG15H LQG18H a b c 0.5-0.6 1.4-1.5 0.4 0.6-0.8 1.8-2.2
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LQG18H
LQG15H
LQM18N
LQM21N/21D/21F
LQM31F
LQP03T
LQP15M
LQP18M
LQP03T/15M/18M
LQG15H/18H.
flux NF-3000
LQH3ER
MURATA LQW18A
transistor tip 31c
LQW18A
LQM31F
025030
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LQN4N
Abstract: C2404 LQN21
Text: 1. STANDARD LAND DIMENSIONS A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip coil electrode. 7.5 1.5 3.0 LQH4N LQN4N LQH4C Solder:Use H60A,H63A JIS Z 3282 or equivalent. Use solder paste equivalent to H60A for
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LQP10A/11A
LQG10A/11A.
MR-8153RA
NF-3000
UVS-50R-2
LQG11N
LQG21N/21C/21F
LQG3216F
LQN21A
LQN4N
C2404
LQN21
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LQH3ER
Abstract: MURATA LQW18A H60A H63A LQH43C LQH43M LQH43N LQW18A jis magnetic
Text: 1. STANDARD LAND DIMENSIONS A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip coil electrode. LQH43M LQH43N LQH43C 1.5 3.0 7.5 1.5 1.5 1.5 Land Pattern Solder Resist in mm Solder : Use H60A,H63A JIS Z 3282 or equivalent.
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LQH43M
LQH43N
LQH43C
LQP03T/15M/18M
LQG15H/18H.
MR-8153RA
NF-3000
LQH3ER
MURATA LQW18A
H60A
H63A
LQH43C
LQH43M
LQH43N
LQW18A
jis magnetic
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flux NF-3000
Abstract: C2404 LQN21A LQG3 LQS33N MURATA LQH
Text: 1. STANDARD LAND DIMENSIONS A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip coil electrode. Solder:Use H60A,H63A JIS Z 3282 or equivalent. Use solder paste equivalent to H60A for LQP10A/11A and LQG10A/11A.
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LQN21A
LQW1608A
LQP10A/11A
LQG10A/11A.
MR-8153RA
NF-3000
UVS-50R-2
LQG11N
LQG21N/21C/21F
flux NF-3000
C2404
LQG3
LQS33N
MURATA LQH
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BUT 11A equivalent
Abstract: LQP10A
Text: 1. STANDARD LAND DIMENSIONS A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip coil electrode. LQG10A b 0.5-0.6 1.4-1.5 Flow Solder c 0.4 LQG11A 0.6-0.8 1.8-2.2 0.6-0.8 2.2-2.6 Flow 0.7 0.7
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LQG10A
LQG11N
LQG11A
LQG21N/21C/21F
LG3216F
LQP10A
LQP11A
LQP10A/11A
LQG10A/11A
MR-8153RA
BUT 11A equivalent
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0330M
Abstract: No abstract text available
Text: Ferrite Chip Wideband EMI Suppressors W ide Frequency Range, Rated Current: 1.5 and 3A max. ACC Series ACC201209 TYPE SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERNS 2 ± 0.2 REFLOW AND FLOW SOLDERINGS Term inal electro d e F errite _ t l_ ' p 1 1 0 .3 1 0 .2
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ACC201209
HF70ACC201209-D
HF50ACC201209-G
HF30ACC201209-D
100MHz]
HF50ACC201209
0330M
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LQG21
Abstract: LQN2A LQP21 coil LQP21A LQS33N LQS33 lqp21
Text: SURFACE MOUNT INDUCTORS SOLDERING SOLDERING METHOD RECOMMENDED SOLDERING CONDITIONS 2. Soldering Conditions Chip coils can be flow or reflow soldered. LQS33N, LQM32C, LQP21A/31A should be reflow soldered only. Please contact Murata Electronics regarding other
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LQS33N,
LQM32C,
LQP21A/31A
LQG21
LQG21N/C
LQS33N
LQS33
LQM32C
LQP21A
LQN2A
LQP21 coil
LQS33N
lqp21
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C7022
Abstract: cutting paste C-7022 H63A
Text: Hybrid 1C Notes About Quality Assurance Notes About Quality Assurance Rohm hybrid ICs are guaranteed in terms of high prod uct quality and high reliability through the manufactur ing flow shown below. H y b rid 1C manufacturing process flow v1/ •Q u a lity assurance testing program
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C7022
cutting paste
C-7022
H63A
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Untitled
Abstract: No abstract text available
Text: SURFACE MOUNT INDUCTORS SOLDERING SOLDERING METHOD 2. Soldering Conditions Chip coils can be flow or reflow soldered. LQS33N and LQP21A/31A should be reflow soldered only. Please contact Murata Electronics regarding other soldering methods. RECOMMENDED SOLDERING CONDITIONS
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LQS33N
LQP21A/31A
LQS33
LQP11A
LQP21A
LQP31A
LQN21A
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C7022
Abstract: JIS-C-7022 H63A
Text: Notes About Quality Assurance Hybrid 1C Notes About Quality Assurance Rohm hybrid IC s are guaranteed in terms of high prod uct quality and high reliability through the manufactur ing flow shown below. • H y b rid !C manufacturing process flow \ y /
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C7022
JIS-C-7022
H63A
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Untitled
Abstract: No abstract text available
Text: SURFACE MOUNT INDUCTORS SOLDERING SOLDERING METHOD 2. Soldering Conditions Chip coils can be flow or reflow soldered. LQS33N and LQP11A/21A should be reflow soldered only. Please contact Murata Electronics regarding other soldering methods. The volume of solder can cause minor fluctuations in
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LQS33N
LQP11A/21A
LQS33N:
LQP11A
LQP21A
LQS66C
LQS66C:
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