dupont mylar
Abstract: kapton
Text: KAPTON RESISTANCE CARD Product Description Kapton® Resistance Cards are available in two types: Kapton® Type H This extremely tough plastic substrate material exhibits excellent physical and electrical properties over a wide temperature range, especially at very high temperatures.
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Text: REVISION H FC5-XX-XX-X-WT-X-XX DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] OPTION -TR: TAPE & REEL PACKAGING OPTION -K: DOT DOT APPLICATOR-KAPTON TAPE USE: K-DOT-.138-.250-.005 (FOR -01 LEAD STYLE ONLY) (SEE NOTE 6) No OF POSITION -15, -20, -25 DO NOT
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FC5-15-02-X-WT
FC5-15-01-X-WT
WT-75-01-T
PT-1-24-07-09
TP-12
PT-1-24-01-93
TP-24-02
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Untitled
Abstract: No abstract text available
Text: C orporate Hom e | Electronic Components | Se gm e nts | W ho W e Are My Account Searc h Products Documentation Resources My Account Customer Support Home > Products > By Type > Flexible Film C able Products > Product Feature Selector > Product Details FSK-22.5A-18 Product Details
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FSK-22
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Abstract: No abstract text available
Text: Flexible Interconnections Flexstrip DESCRIPTION/APPLICATION FLEXSTRIP Jumpers are multiconductor board-to-board interconnect devices, pre-plated and ready to use without wire stripping, cutting to length, or solder preparation. They provide a convenient, reliable alternative to
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Abstract: No abstract text available
Text: INTRODUCTION TO FLEXIBLE HEATERS Typical Applications of Flexible Heaters OMEGALUX is your dependable source of precision flexible heater products, and a unique source of creative application design, engineering assistance, and manufacturing support. OMEGALUX makes standard and
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SG-BGA-6094
Abstract: No abstract text available
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. Top View High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Ball guide prevents over compression of elastomer
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SG-BGA-6094
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Abstract: No abstract text available
Text: ASP-134601-01 REVISION NOTES: 1. VITA 57 CONNECTOR. 2. C REPRESENTS A CRITICAL DIMENSION. 3. MINIMUM PUSHOUT FORCE: .75 LB. 4. PARTS TO BE PACKAGED IN TAPE AND REEL. .1790 4.547 "C" 2.196 55.78 REF .006 [.15] C1 .123 3.12 REF 1.950 49.53 40 .578 14.68 REF
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ASP-134601-01
\dwg\sw\asp\134000\ASP-134601-01
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Abstract: No abstract text available
Text: ASP-134601-01 REVISION NOTES: 1. VITA 57 CONNECTOR. 2. C REPRESENTS A CRITICAL DIMENSION. 3. MINIMUM PUSHOUT FORCE: .75 LB. 4. PARTS TO BE PACKAGED IN TAPE AND REEL. .1790 4.547 "C" 2.196 55.78 REF .006 [.15] C1 .123 3.12 REF 1.950 49.53 .0500 1.270 TYP
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ASP-134601-01
\dwg\sw\asp\134000\ASP-134601-01
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D 6124
Abstract: SG-BGA-6124 DASF0094 676mm
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Top View Minimum real estate required Compression plate distributes forces evenly 24.23mm Ball guide prevents over compression of elastomer
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745mm.
SG-BGA-6124
D 6124
DASF0094
676mm
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Abstract: No abstract text available
Text: REVISION E DO NOT SCALE FROM THIS PRINT NOTES: 1. VITA 57 CONNECTOR. 2. C REPRESENTS A CRITICAL DIMENSION. 3. MINIMUM PUSHOUT FORCE: .75 LB. 4. PARTS TO BE PACKAGED IN TAPE AND REEL. 1 "C" 2.196 55.78 REF C1 1.950 49.53 .123 3.12 REF .024±.020 0.61±0.51
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ASP-134487-01
risevault\DWG\MISC\MKTG\ASP-134487-01-MKT
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Heatsinks
Abstract: b14-16 smd 123 25 34 SMD 4 DIL E 6 pin smd ic smd 83 51 a SMD IC smd E6 ART 230
Text: Hola1 H A H Heatsinks for DIL-IC, PLCC and SMD Heatsinks for DIL-IC B C art. no. ICK 6 8 L ICK 14 16 L ICK 20 L D for housings [mm] Rth [K/W] 6/8 contacts 14/16 contacts 20 contacts 8.5 19.0 25.0 83 46 34 for housings [mm] Rth [K/W] E art. no. ICK ICK ICK
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Abstract: No abstract text available
Text: REVISION E REVISION DO NOT SCALE FROM THIS PRINT NOTES: 1. VITA 57 CONNECTOR. 2. C REPRESENTS A CRITICAL DIMENSION. 3. MINIMUM PUSHOUT FORCE: .75 LB. 4. PARTS TO BE PACKAGED IN TAPE AND REEL. 1 "C" 2.196 55.78 REF C1 1.950 49.53 .123 3.12 REF .024±.020 0.61±0.51
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ASP-134487-01
risevault\DWG\MISC\MKTG\ASP-134487-01-MKT
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UV INK SPECIFICATION
Abstract: No abstract text available
Text: Analog 5-wire PET-On-Glass Touch Screen Specification 1. Mechanical Dimensions and Construction 1.1 General: Analog Resistive touch screen is laminated by ITO PET to ITO glass. 1.2 Construction: Item 1 2 3 4 5 6 7 8 9 10 11 12 Description ITO PET Top layer
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188mm
A001-2
AMT-02518-01
UV INK SPECIFICATION
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Untitled
Abstract: No abstract text available
Text: REVISION J DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] LSEM-1XX-XX-X-DH-A-X-X-TR PACKAGING -TR: TAPE & REEL SEE NOTE 6 No OF POSITIONS -20, -30, -40, -50 OPTION -K: POLYIMIDE FILM (SEE SHT 2, FIG3) (USE K-DOT-.217-.313-.005) LEAD STYLE -01: DO NOT SCALE FROM
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LSEM-20-01-DH-A
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Untitled
Abstract: No abstract text available
Text: REVISION D MMCX-J-P-X-S -SM1-XX 03.45 [.136] OPTION -TR: TAPE & REEL SEE SHT 2 -K: KAPTON PAD (SEE SHT 2) GENDER-J: JACK DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] TYPE — -P: PCB TERMINATION -SM I: SURFACE MOUNT PLATING SPECIFICATION -H: HEAVY GOLD
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742J2-08
Abstract: L-P-523 flexstrip jumpers 1.20"
Text: ThOm asQBettS_ Two MM Flexstrip Jumpers & Sockets • Features & Benefits Description/Application Two MM FLEXSTRIP® Jumpers are multiple conductor board-to-board interconnection devices, preplated and ready-to-use - without wire stripping, cutting to length or
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Untitled
Abstract: No abstract text available
Text: T h o m asB etts D escription /A pplication FLEXSTRIP8 Jumpers are multi conductor board-to-board interconnect devices, pre-plated and ready to use without wire stripping, cutting to length, or solder preparation. They provide a convenient, reliable alternative to
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Untitled
Abstract: No abstract text available
Text: ThomasiBetts D e s c r ip t io n /A p p lic a t io n FLEXSTRIP Jumpers are multi conductor board-to-board interconnect devices, pre-plated and ready to use without wire stripping, cutting to length, or solder preparation. They provide a convenient, reliable alternative to
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Untitled
Abstract: No abstract text available
Text: REVISION A DESIGNED & DIMENSIONED IN MILLIMETERS [INCHES] TEM-1XX-XX-XX.X-XX D-XX-XX No OF POSITIONS FIG. 1 I J TEM-110-02-03.0-XX-D SHOWN OPTION -TR: TAPE & REEL -K: POLYIMIDE FILM (USE K-500-300, SEE FIG. 5, SHT 2) -05 THRU -50 (PER ROW) (5 POS INCREMENTS)
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TEM-110-02-03
K-500-300,
ZE55201
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FH-301
Abstract: FH-301-020 fH301 FH-540 hall 503 FH520 pacific scientific FH-520 fh 520 540 hall
Text: Thin Film FH-3Q1/5QQ Series Hall Sensors InAs Thin Film, General Purpose, Transverse Hall Sensors Description FH-301 & FH-500 Series Hall sensors a re miniatire solid-state Hall effect magnetic field sensing devices. The FH-500 series uses a lead strip which is composed of printed circuit leads encased in DuPonfs Kapton
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FH-301/500
FH-301
FH-500
FH-301
FH-301)
Note00
FH-301/FH-500
FH-500
FH-301-020
fH301
FH-540
hall 503
FH520
pacific scientific
FH-520
fh 520
540 hall
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9090-4V
Abstract: No abstract text available
Text: ThomasBetts D e s c r iptio n /A pplicatio n Thomas & Betts has extended the well proven Flexstrip Jumper techrology to the Industry Standard Four Position Disk Drive Power Connector. This combination of high performance and a standardized interface brings a broad new range of
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PD-8/95/20M
901-68C-520C
9090-4V
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Untitled
Abstract: No abstract text available
Text: HO. I DESIGNED & DIMENSIONED IN MILLIMETERS [INCHES] SEM-110-02-03.0-XX-D SHOWN SEM-1XX-XX-XX.X-XX-D-XX-XX OPTION -TR: TAPE & REEL -K: POLYIMIDE FILM USE K-500-300, SEE FIG. 5, SHT 2 NoOF POSITIONS -05 THRU -50 (PER ROW) (IN 5 POS INCREMENTS) LEAD STYLE
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SEM-110-02-03
K-500-300,
E130i
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tp 8370
Abstract: No abstract text available
Text: REVISION AJ DO NOT SCALE FROM THIS PRINT BTE-XXX-XX-X-D-XX S TY LE -01 "A ” ,1600[4 .064] REF "B " ,1680[4.267] TA B LE 1 BODY BTE-XXX-01-D TE R M IN A L T-1S39-01-X M A TE D H E IG H T W ITH B S E ,1980[5 .029] REF -02 ,2781[7 .064] REF .2861 [7.267] BTE-XXX-02-D
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BTE-XXX-01-D
T-1S39-01-X
BTE-XXX-02-D
T-1S59-02-X
BTE-XXX-03-D
T-1S39-03-X
BTE-XXX-03-D
BTE-XXX-0381
BTE-XXX-01-D-X-FL
tp 8370
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Untitled
Abstract: No abstract text available
Text: to develop new, hard metric packaging specifications for microcomputers. This metric form factor packaging incorporates a 2mm pitch, 4-row & 5-row press-fit connector for both power and signal distribution. FUTUREBUS+ BACKPANEL SYSTEMS HIGH PERFORMANCE CONNECTORS
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EIA-1S-64
EIA-364)
IPC-FC-231
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