an 147
Abstract: ABT16244 AN-147 FCT162344T
Text: THE MYTH OF GROUND BOUNCE MEASUREMENTS AND COMPARISONS APPLICATION NOTE AN-147 THE MYTH OF GROUND BOUNCE MEASUREMENTS AND COMPARISONS APPLICATION NOTE AN-147 Integrated Device Technology, Inc. By Stanley Hronik INTRODUCTION GROUND BOUNCE DESCRIPTION Ground Bounce is one of the primary causes of false
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AN-147
100pF.
FCT162244T
FCT162244T
250pF.
FCT16244T
ABT16244
FCT162344T.
an 147
AN-147
FCT162344T
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AN-147
Abstract: an 147 ABT16244 FCT162344T
Text: THE MYTH OF GROUND BOUNCE MEASUREMENTS AND COMPARISONS APPLICATION NOTE AN-147 THE MYTH OF GROUND BOUNCE MEASUREMENTS AND COMPARISONS APPLICATION NOTE AN-147 Integrated Device Technology, Inc. By Stanley Hronik INTRODUCTION GROUND BOUNCE DESCRIPTION Ground Bounce is one of the primary causes of false
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AN-147
100pF.
FCT162244T
FCT162244T
250pF.
FCT16244T
ABT16244
FCT162344T.
AN-147
an 147
FCT162344T
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Untitled
Abstract: No abstract text available
Text: Ground Bounce Figure 2. Ringing Ground Bounce Introduction The development of fast PLDs has increased the importance of analog considerations the digital designer has been able to overlook in the past. One of these is ground bounce. Ground bounce refers to the ringing on an output
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Untitled
Abstract: No abstract text available
Text: Technical Note Ground Bounce in the FPID Family 1.0 Introduction A shift in the internal ground reference as a result of output switching is known as ground bounce. The effect of ground bounce on the overall system operation must be considered when designing with high speed digital ICs,
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IQ160
IQ160-M
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Untitled
Abstract: No abstract text available
Text: Ground Bounce October 2001 Introduction The development of fast PLDs has increased the importance of analog considerations the digital designer has been able to overlook in the past. One of these is ground bounce. Ground bounce refers to the ringing on an output
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7400 series TTL pinouts
Abstract: 244 FCT digital ic 7400 367V
Text: 16-bit FCT Ground Bounce Cypress 16-bit FCT Logic Has Low Ground and VCC Bounce Introduction This application note explains what ground bounce is, what causes it, how it is specified, and what systems level problems it may cause. Data taken on Cypress 8-bit and 16-bit
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16-bit
16-bit
7400 series TTL pinouts
244 FCT
digital ic 7400
367V
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74LS
Abstract: No abstract text available
Text: AN-01 Ground Bounce Noise in TTL Logic Q QUALITY SEMICONDUCTOR, INC. High-speed TTL octal drivers such as the FCT244 can generate ground bounce noise when driving capacitive loads at high-speed. On the FCT244, ground bounce occurs when seven of the eight outputs are switching HIGH-to-LOW with a high
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AN-01
FCT244
FCT244,
FCT244.
50pF/Pin
MAPN-00001-00
74LS
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transistor
Abstract: Signal Path Designer
Text: Ground Bounce INTRODUCTION The development of fast PLDs has increased the importance of analog considerations the digital designer has been able to overlook in the past. One of these is ground bounce. Ground bounce refers to the ringing on an output signal when one or more outputs on the same device are being
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13090C-007
transistor
Signal Path Designer
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APP2997
Abstract: AN2997
Text: Maxim/Dallas > App Notes > GENERAL ENGINEERING TOPICS AND PC BOARD LAYOUT POWER-SUPPLY CIRCUITS PROTOTYPING Keywords: switching-regulator layout, regulator layout, board layout, ground, grounding, component placement, analog ground, digital ground, stray capacitance, stray inductance, interference, noise,
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com/an2997
AN2997,
APP2997,
Appnote2997,
APP2997
AN2997
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amd pal spice
Abstract: A 107 transistor Signal Path Designer
Text: GENERAL INFORMATION 1 Ground Bounce INTRODUCTION The development of fast PLDs has increased the importance of analog considerations the digital designer has been able to overlook in the past. One of these is ground bounce. Ground bounce refers to the ringing on an output signal when one or more outputs on the same device are being
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qml-38535
Abstract: CDFP2-F14 CQCC1-N20 GDFP1-F14
Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED Change ground bounce limits. Editorial changes throughout - ¡ak. 99-08-21 Monica L. Poelking Change ground bounce limits. Corrections made to 1.4. Editorial changes throughout - ¡
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TDS820
Abstract: GTL3
Text: PRELIMINARY PAC R4G CALIFORNIA MICRO DEVICES HIGH PERFORMANCE BUS TERMINATION NETWORK Features Designed especially for High Performance computers/servers Provides high speed bus termination Reduces ground bounce with ground pin placement / Ultra low crosstalk
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GTL10
GTL11
74GTL16616
1000pF
PRN331A
TDS820
GTL3
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AN-835
Abstract: No abstract text available
Text: Due to the high current and very high speed capability of the Futurebus+ driver output stage, device ground pin allocation, circuit board layout and bus grounding are critical factors that affect the system performance. The series inductance on any ground path should be minimized to improve ground
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an011483
AN-835
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5101j
Abstract: No abstract text available
Text: differential terminator network The voltage terminating centered ground pins help reduce ground bounce and provide equal trace lengths for equal delay. This helps preserve data integrity and significantly increase circuit reliability by reducing the total number of solder joints.
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22-lines
24-pin
MIL-R-55342
MIL-STD-202
5101j
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Untitled
Abstract: No abstract text available
Text: differential terminator network The voltage terminating centered ground pins help reduce ground bounce and provide equal trace lengths for equal delay. This helps preserve data integrity and significantly increase circuit reliability by reducing the total number of solder joints.
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22-lines
24-pin
MIL-R-55342
MIL-STD-202
MlL-STD-202
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PDF
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T2420
Abstract: T-2420 thermonics AN202 AN212 AN223 AN601 AN602 HFS9009 HFS-9009
Text: Philips Semiconductors Logic Products Application Note Ground and VCC Bounce of High-Speed Integrated Circuits AN223 Author: Mike Stevens INTRODUCTION GENERAL CONSIDERATIONS The purpose of this paper is to give a general description of what ground and VCC bounce
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AN223
AN212)
AN601)
AN202)
AN203)
AN602)
T2420
T-2420
thermonics
AN202
AN212
AN223
AN601
AN602
HFS9009
HFS-9009
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PDF
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HFS-9009
Abstract: T2420
Text: Philips Semiconductors Logic Products Application Note Ground and Vcc Bounce of High-Speed Integrated Circuits AN223 Author: Mike Stevens INTRODUCTION GENERAL CONSIDERATIONS The purpose of this paper is to give a general description of what ground and V cc bounce
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AN223
AN601)
AN202)
AN203)
AN602)
HFS-9009
T2420
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PDF
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cerdip 300mil
Abstract: AN212 philips Double high-speed switching diode 74F240 74F374 AN212 F374
Text: Philips Semiconductors Application note Package lead inductance considerations in high-speed applications AN212 Authors: Stephen C. Hinkle, Jeffrey A. West measured to be about 10nH. Switching 75mA through a ground lead with an inductive value of 10nH causes a ground bounce of about:
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AN212
SF01327
cerdip 300mil
AN212 philips
Double high-speed switching diode
74F240
74F374
AN212
F374
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XAPP689
Abstract: XAPP623 FF1152 XC2V6000
Text: Application Note: FPGAs R Managing Ground Bounce in Large FPGAs Author: Tony Duong XAPP689 v1.2 October 30, 2007 Summary Ground bounce must be controlled to ensure proper operation of high-performance FPGA devices. Particular attention must be applied to minimizing board-level inductance during PCB
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XAPP689
XAPP689
XAPP623
FF1152
XC2V6000
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QML-38535
Abstract: 54ABT16244 GDFP1-F48
Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED Add vendor cage 27014 as device type 02. Add ground bounce immunity criteria. Editorial changes throughout - ¡ak._ 96-11-04 Monica L. Poelking Change C N, Cour, and ground bounce for device type 01. Editorial changes
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qml-38535
Abstract: No abstract text available
Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Add vendor cage 27014 as device type 02. Add ground bounce immunity criteria. Editorial changes throughout – jak. 96-11-04 Monica L. Poelking B Change CIN, COUT, and ground bounce for device type 01. Editorial changes
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qml-38535
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qml-38535
Abstract: CQCC1-N20 GDFP2-F20
Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED Change Ground Bounce limits in Table I. - JAK 98-07-30 Monica L. Poelking Change Ground Bounce limits in Table I. Editorial changes throughout. - CFS 98-10-05 Monica L. Poelking Vendor part number change. Remove paragraph 1.5. Change propagation delay
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CV2f
Abstract: MOSFET Drivers EL7xxx 0931 switching transistor mosfet driver inductive loads power mosfet drivers
Text: Application Note Applying Power MOSFET Drivers Applying Power MOSFET Drivers by Bruce Rosenthal Overview Cause 3 Insufficient Overdrive During switching some ground bounce is going to occur If the ground bounce is greater than the overdrive to the input oscillation may result as the effective drive to the
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Untitled
Abstract: No abstract text available
Text: IPEC RG Series CALIFORNIA MICRO DEVICES VERY HIGH PERFORMANCE TERMINATION NETWORK Features Applications ♦ I t i ♦ ^ ^ Specially applicable for Pentium or P6-class computer/servers High speed termination network Center ground pin placement reduces ground
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250ppm
100mW
IPEC500RGQ/T
IPEC500RGQ/R
IPEC560RGQ/T
IPEC560RGQ/R
IPEC500RGQ
IPEC560RGQ
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