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    GOLD WIRE BONDING LOOPS Search Results

    GOLD WIRE BONDING LOOPS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    CN-ACPRREDAA0 Amphenol Cables on Demand RCA Male Plug Cable Connector (Red) - Amphenol ACPR-RED - Gold Plated Diecast Shell Datasheet
    MP-5XRJ11PPXS-014 Amphenol Cables on Demand Amphenol MP-5XRJ11PPXS-014 Flat Silver Satin Modular Crossed wiring Cable, RJ11 / RJ11 14ft Datasheet
    MP-64RJ4528GB-003 Amphenol Cables on Demand Amphenol MP-64RJ4528GB-003 Slim Category-6 (Thin CAT6) UTP 28-AWG Network Patch Cable (550-MHz) with Snagless RJ45 Connectors - Blue 3ft Datasheet
    MP-64RJ4528GG-014 Amphenol Cables on Demand Amphenol MP-64RJ4528GG-014 Slim Category-6 (Thin CAT6) UTP 28-AWG Network Patch Cable (550-MHz) with Snagless RJ45 Connectors - Green 14ft Datasheet

    GOLD WIRE BONDING LOOPS Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    GaAs MMIC ESD, Die Attach and Bonding Guidelines

    Abstract: RDE capacitor HMMC-5021 HMMC-5022 HMMC-5025 HMMC-5026 HMMC-5027
    Text: Agilent GaAs MMIC TWA Users Guide Application Note # 56 - Revision A January 2001 Includes: 1. Device Schematic, Topology, and Theory of Operation Descriptions 2. Assembly, Bonding, & Biasing Recommendations 3. Extended Low-Frequency Operation Assembly Guidelines


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    PDF HMMC-5021, HMMC-5022, HMMC-5026, HMMC5027 HMMC-5025 HMMC-5021/22/26 HMMC-5021/22/26 GaAs MMIC ESD, Die Attach and Bonding Guidelines RDE capacitor HMMC-5021 HMMC-5022 HMMC-5026 HMMC-5027

    AN-S003

    Abstract: 1 kilo ohm resistor specifications bonding capillary hp mmic MSA-0100 MSA-0200 MSA-0300 MSA-0500 MSA-0600 MSA-0700
    Text: MODAMP Silicon MMIC Chip Use Application Note S009 Introduction This Application Note supplies information needed to layout and assemble circuits when using Hewlett-Packard’s MODAMP silicon MMIC amplifiers in chip form. Section I gives an overview of the


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    PDF 5091-9054E AN-S003 1 kilo ohm resistor specifications bonding capillary hp mmic MSA-0100 MSA-0200 MSA-0300 MSA-0500 MSA-0600 MSA-0700

    HMMC-5002

    Abstract: No abstract text available
    Text:  Designing with HMMC-5021, -5022, -5026 and -5027 GaAs MMIC Amplifiers Application Note # 1053, Rev A MWTC Marketing October 1992 1.0 Introduction This application note gives a technical overview of the HMMC-5021, HMMC-5022, HMMC-5026, and HMMC-5027 GaAs MMIC Traveling Wave


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    PDF HMMC-5021, HMMC-5022, HMMC-5026, HMMC-5027 HMMC5021/22/26 HMMC-5021 HMMC-5022 HMMC5026 HMMC-5021/22/6 HMMC-5002

    Motorola Mil Std. 883

    Abstract: RADC-TR-67-108 aluminum solid capacitor mil std AN1025 motorola handbook MOTOROLA linear handbook trw RF POWER TRANSISTOR 217B motorola transistor handbook Motorola operational amplifier discrete
    Text: Order this document by AN1025/D MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN1025 RELIABILITY CONSIDERATIONS IN DESIGN AND USE OF RF INTEGRATED CIRCUITS Prepared by: James Humphrey and George Luettgenau ABSTRACT DEFINITIONS Reliability is a major factor in the profitability of CATV


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    PDF AN1025/D AN1025 Motorola Mil Std. 883 RADC-TR-67-108 aluminum solid capacitor mil std AN1025 motorola handbook MOTOROLA linear handbook trw RF POWER TRANSISTOR 217B motorola transistor handbook Motorola operational amplifier discrete

    Sn60A

    Abstract: MIL-STD-883H MIL-STD-883H 2004.6 sodium silicate QQ-S-571 QQ-S-571, Class Sn 50 ultrasonic motion detector J-STD-002 MIL-F-14256 20 PIN LEADLESS CHIP CARRIER THICK FILM
    Text: MIL-STD-883H METHOD 2001.3 * CONSTANT ACCELERATION 1. PURPOSE. This test is used to determine the effects of constant acceleration on microelectronic devices. It is an accelerated test designed to indicate types of structural and mechanical weaknesses not necessarily detected in shock and


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    PDF MIL-STD-883H Sn60A MIL-STD-883H MIL-STD-883H 2004.6 sodium silicate QQ-S-571 QQ-S-571, Class Sn 50 ultrasonic motion detector J-STD-002 MIL-F-14256 20 PIN LEADLESS CHIP CARRIER THICK FILM

    AVR181: Automotive Grade0 - PCB and Assembly Recommendations

    Abstract: ATMEL flow soldering atmel Reflow soldering A104 AECQ100 AEC-Q100 AECQ1001 JESD22 JESD22-A101
    Text: AVR181: Automotive Grade0 - PCB and Assembly Recommendations 1. Foreword Modern cars still involve control loops between a set of captors and different actuators elements responsible for the transportation, but also the comfort and the safety of the occupants. To satisfy the constant growth of these elements, car makers and their


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    PDF AVR181: AVR181: Automotive Grade0 - PCB and Assembly Recommendations ATMEL flow soldering atmel Reflow soldering A104 AECQ100 AEC-Q100 AECQ1001 JESD22 JESD22-A101

    failure rate Freescale

    Abstract: Motorola Mil Std. 883 motorola handbook AN1025 217B 5bp transistor making RADC-TR-67-108 Motorola operational amplifier discrete BALLAST MOTOROLA "failure rate" Freescale
    Text: MOTOROLA Freescale Semiconductor, Inc. Order this document by AN1025/D SEMICONDUCTOR APPLICATION NOTE AN1025 Reliability Considerations in Design and Use of RF Integrated Circuits Freescale Semiconductor, Inc. Prepared by: James Humphrey and George Luettgenau


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    PDF AN1025/D AN1025 failure rate Freescale Motorola Mil Std. 883 motorola handbook AN1025 217B 5bp transistor making RADC-TR-67-108 Motorola operational amplifier discrete BALLAST MOTOROLA "failure rate" Freescale

    ablebond 84-1 LMI

    Abstract: ABLEBONd 84-1 A004R AMMC-6222 AMMC-6222-W10
    Text: Products > RF for Mobile, WLAN, mmW > mmW & microWave Devices > Amplifiers > AMMC-6222 AMMC-6222 7-21GHz GaAs High Linearity Low Noise Amplifier Description Avago Technologies AMMC-6222 is an easy-to-use broadband, high gain, high linearity Low Noise Amplifier that operates from 7 GHz to 21GHz.


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    PDF AMMC-6222 7-21GHz AMMC-6222 21GHz. AMMC-6222-W10 AMMC-6222-W50 ablebond 84-1 LMI ABLEBONd 84-1 A004R AMMC-6222-W10

    Sharp Semiconductor Lasers

    Abstract: AU4A transistor QB tensile-strength thermopile array BREAK FAILURE INDICATOR APPLICATIONS LIST relay failure analysis CRACK DETECTION PATTERNS gold wire bound failures due to ultrasonic cleaning 2n2222 micro electronics
    Text: Application Note Optoelectronics Failure Analysis of Optoelectronic Devices DEFINITIONS • US Military Standard: MIL-STD-883 Method 5003 Failure Analysis Procedures for Microcircuits – Failure analysis is a post-mortem examination of a failed device employing, as required, electrical


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    PDF MIL-STD-883 SMA04033 Sharp Semiconductor Lasers AU4A transistor QB tensile-strength thermopile array BREAK FAILURE INDICATOR APPLICATIONS LIST relay failure analysis CRACK DETECTION PATTERNS gold wire bound failures due to ultrasonic cleaning 2n2222 micro electronics

    NATIONAL SEMICONDUCTOR ink MARKING

    Abstract: Die Attach epoxy stamping cte table flip chip substrate cte table ic bga JESD 49 gold wire bond failures due to ultrasonic cleaning Aluminum alloys physical properties FLIP CHIP PRODUCTS micro machine thermal conductivity coefficient of thermal expansion of thermal conductive pressure sensitive adhesive
    Text: September 2000 Die Products Business Unit as watches, calculators and smart cards as well as leading edge multiple die applications like cellular handsets and digital cameras. Better device performance utilizing die show up in processor modules for computers, workstations and servers as


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    Untitled

    Abstract: No abstract text available
    Text: Preliminary Information Agilent AMMC-6420 6 – 18 GHz 1W Power Amplifier Data Sheet Features • • • • • Wide frequency range of 6 - 18 GHz High gain : 18 dB Partial match Input and Output High Power: @ 16 GHz, P-3dB = 30 dBm Integrated RF Power Detector


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    PDF AMMC-6420

    tva0300n07

    Abstract: mmic amplifier marking code N10 MTVA0300N05 PST-02-A-1 TVA0300N07W3 electronic passive components catalog SC-1016 MTVA0300 SMT2010TALN 42TVA
    Text: EMC TECHNOLOGY Custom Engineered Solutions 8851 SW Old Kansas Ave. 772 286-9300 ISO 9001 & 14001 Certified M I C R OWAV E C O M P O N E N T S www.emct.com Resistive Products, Smart Loads , High Reliability Stuart, FL 34997 (800) 544-5594 Thermopads®, Equalizers,


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    Untitled

    Abstract: No abstract text available
    Text: AMMC - 6425 18 - 28 GHz Power Amplifier Data Sheet Chip Size: 2500 x 1750 µm 100 x 69 mils Chip Size Tolerance: ± 10 µm (±0.4 mils) Chip Thickness: 100 ± 10 µm (4 ± 0.4 mils) Pad Dimensions: 100 x 100 µm (4 ± 0.4 mils) Description Features The AMMC-6425 MMIC is a broadband 1W power


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    PDF AMMC-6425 18GHz 28GHz. 38dBm. 27GHz 30dBm AMMC-6425-W10 AMMC-6425-W50

    Untitled

    Abstract: No abstract text available
    Text: AMMC-6140 20 – 40 GHz Output x2 Active Frequency Multiplier Data Sheet Chip Size: 1300 x 900 µm 64 x 40 mils Chip Size Tolerance: ±10 µm (±0.4 mils) Chip Thickness: 100 ± 10 µm (4 ± 0.4 mils) Pad Dimensions: 120 x 80 µm (5x3 ± 0.4 mils) Description


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    PDF AMMC-6140 AMMC-6140 techn140 AMMC-6140-W10 AMMC-6140-W50 5989-2341EN 5989-3946EN

    sequential CIRCUIT

    Abstract: No abstract text available
    Text: Agilent AMMC-6120 8-20 GHz Output x2 Active Frequency Multiplier Data Sheet Chip Size: 1600 x 1000 µm 64 x 40 mils Chip Size Tolerance: ± 10 µm (± 0.4 mils) Chip Thickness: 100 ± 10 µm (4 ± 0.4 mils) Pad Dimensions: 120 x 80 µm (5x3 ± 0.4 mils)


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    PDF AMMC-6120 AMMC-6120-W10 AMMC-6120-W50 5989-2290EN 5989-3759EN sequential CIRCUIT

    Untitled

    Abstract: No abstract text available
    Text: AMMC-6140 20 – 40 GHz Output x2 Active Frequency Multiplier Data Sheet Chip Size: 1300 x 900 µm 51 x 35 mils Chip Size Tolerance: ±10 µm (±0.4 mils) Chip Thickness: 100 ± 10 µm (4 ± 0.4 mils) Pad Dimensions: 120 x 80 µm (5x3 ± 0.4 mils) Description


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    PDF AMMC-6140 AMMC-6140-W10 AMMC-6140-W50 5989-3946EN AV02-0701EN

    sequential CIRCUIT

    Abstract: No abstract text available
    Text: Agilent AMMC-6120 8-20 GHz Output x2 Active Frequency Multiplier Data Sheet Chip Size: 1600 x 1000 µm 64 x 40 mils Chip Size Tolerance: ± 10 µm (± 0.4 mils) Chip Thickness: 100 ± 10 µm (4 ± 0.4 mils) Pad Dimensions: 120 x 80 µm (5x3 ± 0.4 mils)


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    PDF AMMC-6120 AMMC-6120-W10 AMMC-6120-W50 5989-3759EN 5989-3944EN sequential CIRCUIT

    ABLEBONd 84-1

    Abstract: A004R AMMC-6120 AMMC-6120-W10 AMMC-6120-W50 multiplier mmic
    Text: Agilent AMMC-6120 8-20 GHz Output x2 Active Frequency Multiplier Data Sheet Chip Size: 1600 x 1000 µm 64 x 40 mils Chip Size Tolerance: ± 10 µm (± 0.4 mils) Chip Thickness: 100 ± 10 µm (4 ± 0.4 mils) Pad Dimensions: 120 x 80 µm (5x3 ± 0.4 mils)


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    PDF AMMC-6120 AMMC-6120 AMMC-6120-W10 AMMC-6120-W50 5989-2290EN ABLEBONd 84-1 A004R AMMC-6120-W10 AMMC-6120-W50 multiplier mmic

    A004R

    Abstract: AMMC-6140 AMMC-6140-W10 AMMC-6140-W50
    Text: Agilent AMMC-6140 20 – 40 GHz Output x2 Active Frequency Multiplier Data Sheet Features • Input frequency range: 10–20 GHz • Broad input power range: -9 to +7 dBm • Output power: -1 to 0 dBm Pin = +4 dB • Fundamental suppression of 25 dBc • 50Ω input and output match


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    PDF AMMC-6140 AMMC-6140 integrated140-W10 AMMC-6140-W50 5989-2341EN 5989-3946EN A004R AMMC-6140-W10 AMMC-6140-W50

    9OSC0315

    Abstract: No abstract text available
    Text: 5.5-8.4 GHz GaAs MMIC Voltage Controlled Feedback Oscillator May 2005 - Rev 05-May-05 9OSC0315 Features Chip Device Layout tio n Ultra-Wide Tuning Range Divide-By-Four Frequency Divider Output On-Chip Filter +4.0 dBm Fundamental Output Power +1.0 dBm Divide-By-Four Output Power


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    PDF 05-May-05 9OSC0315 MIL-STD-883

    A004R

    Abstract: AMMC-6120 AMMC-6120-W10 AMMC-6120-W50
    Text: AMMC-6120 8-20 GHz Output x2 Active Frequency Multiplier Data Sheet Chip Size: 1600 x 1000 µm 64 x 40 mils Chip Size Tolerance: ± 10 µm (± 0.4 mils) Chip Thickness: 100 ± 10 µm (4 ± 0.4 mils) Pad Dimensions: 120 x 80 µm (5x3 ± 0.4 mils) Description


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    PDF AMMC-6120 AMMC-6120 AMMC-6120-W10 AMMC-6120-W50 5989-3759EN 5989-3944EN A004R AMMC-6120-W10 AMMC-6120-W50

    AMMC-6140-W50

    Abstract: A004R AMMC-6140 AMMC-6140-W10 AMMC6140
    Text: AMMC-6140 20 – 40 GHz Output x2 Active Frequency Multiplier Data Sheet Chip Size: Chip Size Tolerance: Chip Thickness: Pad Dimensions: 1300 x 900 µm 51 x 35 mils ±10 µm (±0.4 mils) 100 ± 10 µm (4 ± 0.4 mils) 120 x 80 µm (5x3 ± 0.4 mils) Description


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    PDF AMMC-6140 AMMC-6140 AMMC-6140-W10 AMMC-6140-W50 5989-3946EN AV02-0701EN AMMC-6140-W50 A004R AMMC-6140-W10 AMMC6140

    Untitled

    Abstract: No abstract text available
    Text: AMMC - 6430 25 - 33 GHz Power Amplifier Data Sheet Chip Size: 2500 x 1870 µm 100 x 74 mils Chip Size Tolerance: ± 10µm (±0.4 mils) Chip Thickness: 100 ± 10µm (4 ± 0.4 mils) Pad Dimensions: 100 x 100 µm (4 ± 0.4 mils) Description Features The AMMC-6430 MMIC is a broadband nearly 1W power


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    PDF AMMC-6430 25GHz 33GHz. 37dBm. 30GHz 29dBm AMMC-6430-W10

    Untitled

    Abstract: No abstract text available
    Text: AMMC - 6425 18 - 28 GHz Power Amplifier Data Sheet Chip Size: 2500 x 1870 µm 100 x 74 mils Chip Size Tolerance: ± 10 µm (±0.4 mils) Chip Thickness: 100 ± 10 µm (4 ± 0.4 mils) Pad Dimensions: 100 x 100 µm (4 ± 0.4 mils) Description Features The AMMC-6425 MMIC is a broadband 1W power amplifier designed for use in transmitters that operate in


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    PDF AMMC-6425 18GHz 28GHz. 38dBm. 27GHz 30dBm AMMC-6425-W10