Electron Radiation as an Indicator of Gold Nodule Defect during E-beam Evaporation
Abstract: No abstract text available
Text: Electron Radiation as an Indicator of Gold Nodule Defect during E-beam Evaporation Kezia Cheng Skyworks Solutions, Inc. 20 Sylvan Road, Woburn, MA. kezia.cheng@skyworksinc.com 781 241-2821 Keywords: … Back scattered electron, E-beam evaporation, Gold nodules, Gold spitting
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16th-19th,
Electron Radiation as an Indicator of Gold Nodule Defect during E-beam Evaporation
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Socket T for LGA
Abstract: 0.65mm pitch BGA socket
Text: BGA Socket Adapter System Fine Pitch BGA Socket Adapter System 0.50mm and 0.65mm Pitch Table of Models Features: • Advanced’s field-proven screwmachined terminals with multifinger contacts, arranged in an interstitial male/female pin pattern are gold plated for gold/gold
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R107
Abstract: No abstract text available
Text: IMP BOARD TO BOARD CONNECTOR SMT CONNECTOR Part Number R107 064 000 R107 064 010 R107 064 020 R107 064 020W Finish Gold Gold Gold Gold Packaging Reel of 2500 Reel of 600 Reel of 100 Unit Reel dimensions A 330 mm 180 mm 180 mm - This connector can also be developed upon request with other heights, in order to adjust space between PCB. Please consult us.
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Untitled
Abstract: No abstract text available
Text: IMP BOARD TO BOARD CONNECTOR SMT CONNECTOR Part Number R107 064 000 R107 064 010 R107 064 020 R107 064 020W Finish Gold Gold Gold Gold Packaging Reel of 2500 Reel of 600 Reel of 100 Unit Reel dimensions A 330 mm 180 mm 180 mm - This connector can also be developed upon request with other heights, in order to adjust space between PCB. Please consult us.
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pv101
Abstract: PV76 PV221-8I PV510-8I
Text: PV SERIES Piconics PV series has gold plated contact areas for bonding interconnecting leads. The bottom of the ceramic chip has a heavy gold plating for bonding the coil to a substrate. Please note that the PV series can be made with special substrate geometries
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M83446
M83446/17.
PV160-8I
PV250-8I
PV510-8I
PV760-8I
PV101-8I
MIL-STD-202,
pv101
PV76
PV221-8I
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"iso 7816-1"
Abstract: iso 7816-1 PIC16F84 wafer eeprom 24lc16 wafer card programmable PIC16F84 Microchip PIC16F84 PIC ISO7816 24LC16 ISO-7816
Text: Gold Wafer Card PIC-16F84+24LC16 GENERAL DESCRIPTION The GOLD wafer card is an 8 bit, field programmable, ISO-7816 compatible multi-chip Smart Card featuring the Microchip Technology, Inc. PIC16F84 + 24LC16 die. Fully compatible with similar products on the market, the card is
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PIC-16F84
24LC16)
ISO-7816
PIC16F84
24LC16
20MHz
"iso 7816-1"
iso 7816-1
PIC16F84 wafer
eeprom 24lc16
wafer card programmable
PIC16F84
Microchip PIC16F84 PIC
ISO7816
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Untitled
Abstract: No abstract text available
Text: MMS-1XX-02-XXX-XX-XX-XXX REVISION CJ 02 PLATING SPECIFICATION -S: 30µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -L: 10µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -F: 3µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -T: MATTE TIN OVER ENTIRE CONTACT
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MMS-1XX-02-XXX-XX-XX-XXX
LC-06-TM,
WG\MISC\Mktg\MMS-1XX-02-XXX-XX-XX-XXX-MKT
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Untitled
Abstract: No abstract text available
Text: MMS-1XX-02-XXX-XX-XX-XXX REVISION CH 02 DO NOT SCALE FROM THIS PRINT PLATING SPECIFICATION -S: 30µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -L: 10µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -F: 3µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL
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MMS-1XX-02-XXX-XX-XX-XXX
WG\MISC\MKTG\MMS-1XX-02-XXX-XX-XX-XXX-MKT
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Untitled
Abstract: No abstract text available
Text: MMS-1XX-02-XXX-XX-XX-XXX REVISION BX 02 DO NOT SCALE FROM THIS PRINT PLATING SPECIFICATION -S: 30µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -L: 10µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -F: 3µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL
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MMS-1XX-02-XXX-XX-XX-XXX
WG\MISC\MKTG\MMS-1XX-02-XXX-XX-XX-XXX-MKT
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T3P20ME1LY
Abstract: 192991-0047 192991-0164 192991-0056
Text: Cannon Trident Connectors T3P Contacts Overview - T3P Contacts Typical Nomenclature: T3P 16 M C 1 L T Series T3P Plating = Three Part machined Contact T X Y Z Gender M F = Male Pin = Female (Socket) = = = = Tin 3 −m (120μ in.) Gold Gold Gold Flash (only for Pin Contacts)
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Abstract: No abstract text available
Text: MMS-1XX-02-XXX-XX-XX-XXX REVISION BY 02 PLATING SPECIFICATION -S: 30µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -L: 10µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -F: 3µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -T: MATTE TIN OVER ENTIRE CONTACT
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MMS-1XX-02-XXX-XX-XX-XXX
LC-06-TM,
WG\MISC\MKTG\MMS-1XX-02-XXX-XX-XX-XXX-MKT
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Untitled
Abstract: No abstract text available
Text: MMS-1XX-02-XXX-XX-XX-XXX REVISION CC 02 PLATING SPECIFICATION -S: 30µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -L: 10µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -F: 3µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -T: MATTE TIN OVER ENTIRE CONTACT
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MMS-1XX-02-XXX-XX-XX-XXX
WG\MISC\MKTG\MMS-1XX-02-XXX-XX-XX-XXX-MKT
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Untitled
Abstract: No abstract text available
Text: REVISION X FLE-1XX-XX-XX-DV-X No OF POSITIONS -02 THRU -75 PER ROW DO NOT SCALE FROM THIS PRINT LEAD STYLE -01: SURFACE MOUNT (USE C-96-01-XX) X X PLATING SPECIFICATION -G: 10µ" GOLD IN CONTACT AREA, 3µ" GOLD ON TAIL -H: 30µ" HEAVY GOLD IN CONTACT AREA,
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C-96-01-XX)
LMP-09,
PT-1-24-01-43
PT-1-24-05-63
PT-1-24-13-09
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Untitled
Abstract: No abstract text available
Text: REVISION BS FTS-1XX-XX-XX-XX-XX No OF POS x .0500[1.27] ±.010[0.25] LEAD STYLE SEE TABLE 1 .050 1.27 REF 02 PLATING SPECIFICATION -L: 10µ" GOLD IN CONTACT AREA, MATTE TIN ON TAIL -F: 3µ" GOLD IN CONTACT AREA, MATTE TIN ON TAIL -S: 30µ" GOLD IN CONTACT AREA,
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Untitled
Abstract: No abstract text available
Text: Catalog 1307191 Revised 10-00 RF Coax Connectors SMB Connectors, Mini 75 Ohm Continued Vertical PC Board Jacks Style Center Contact Plating Body Plating Part No. 2.11 .083 Brass Gold Gold 415504-1 2.11 .083 Brass Gold Gold Flash 415504-2 3.05 .120 Brass
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Untitled
Abstract: No abstract text available
Text: 9111 Series □ m in Special Contact for L, M & N Picture Lea pa Description P/N 9111-7MC75A01G30 Male, Crimp, 75Q,Coax Type l, Gold 30ß ? 9111-7MC75A01G20 Male, Crimp, 75£2,Coax Type l, Gold 20ß ? 9111-7MC75A01G10 Male, Crimp, 75Q,Coax Type l, Gold 10ß *
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9111-7MC75A01G30
9111-7MC75A01G20
9111-7MC75A01G10
9111-7MC50A01G30
9111-7MC50A01G20
9111-7MC50A01G10
9111-71L
9111-7FR75A01G30
9111-7FR75A01G20
9111-7FR75A01G10
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Untitled
Abstract: No abstract text available
Text: 13 12 10 71741-0004 YES YES PK-70873-063 TA PE & REEL 0. 76 GOLD 7 I74 E 0 0 0 3 NO YES PK-70873-063 TA PE & REEL 0. 76 GOLD 7I7 4 E 0 0 0 2 YES YES PK-70873-063 TA PE & REEL 0.2 5 GOLD 7 I7 4 E 0 0 0 I YES NO PK-70873-0607 TUBE 0 .25 GOLD PEGS PICK &. PLACE CAP
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PK-70873-063
PK-70873-0607
B0532
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PK-70873-053
Abstract: PK-70873-05 molex 5284
Text: 13 12 10 71741-0004 YES YES PK-70873-063 TAPE & REEL 0.76 GOLD 7 I74 I-0003 NO YES PK-70873-063 TAPE & REEL 0.76 GOLD 7 I7 4 I- 0 0 0 2 YES YES PK-70873-063 TAPE & REEL 0.25 GOLD 7 I74 I—0 0 0 I YES NO PK-70873-0607 TUBE 0.25 GOLD PACKAGING SPEC. NUMBER
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PK-70873-053
7I74H0003
PK-70873-D53
7I74E0002
7I74E000
PK-70873-0607
PK-70873-05
molex 5284
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Untitled
Abstract: No abstract text available
Text: Catalog 1307191 Revised 10-00 RF Coax Connectors SMA Connectors Continued Right Angle Jack, PC Board Mount 5.1 2 Pics. [ . 200 ] 0 1.7 [.067] In-Series Adapter, Jack to Jack Material & Finish M/A-C0M Model No. Stainless, Gold 2064-0000-00 Brass, Gold 2264-0000-09
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DC-18
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Untitled
Abstract: No abstract text available
Text: CompactPCI Power Connector Product Offering - Headers Introduction W inchester 47-pin CompactPCI® Power headers are offered in two plating finishes - 30 microinches of gold to meet 250 mating cycles per the PICMG® specification and 10 microinches of gold for a lower cost alternative.
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47-pin
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Untitled
Abstract: No abstract text available
Text: CompactPCI Power Connector Product Offering - Sockets Introduction W inchester 47-position CompactPCI® Power sock ets are offered in two plating finishes - 30 microinches of gold to meet 250 mating cycles per the PICMG® specifi cation and 10 microinches of gold for a lower cost
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47-position
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Untitled
Abstract: No abstract text available
Text: SIGN PART NUMBER: X USB-M2XFXX DATE TR - tape/reel w/pich up pad TU - tube TO - tape/reel w/out pad _ DESCRIPTION APPROVER THIS IS CAD DRA WING, DO NOT REVISE MANUALL Ylll M aterial • • • • • Plating: 6 - selective flash gold 8 - selective 30uH gold
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7MC75
Abstract: No abstract text available
Text: 9111 S eries □kJPhil S p ecial C ontact for L, M & N m= m D D :p is Description P /N Picture Application 9111 —7MC75A01G30 Male, Crimp, 7 5 0 , Coax Type 1, Gold 30M " 9111 —7MC75A01G20 Male, Crimp, 7 5 fi,Coax Type 1, Gold 20/U' 9111 —7MC75A01G10
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9111-7MC75A01G30
7MC75A01G20
7MC75A01G10
9111-7MC50A01G30
9111-7MC50A01G20
7MC50A01G10
20fif
9111-71L,
7FR75A01G30
7FR75A01G20
7MC75
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Untitled
Abstract: No abstract text available
Text: II 12 9 IS WHITE NATURAi CIRCUIT SIZE PLUG ASSEMBLY ITEM NUMBER 7 8 6 71436 3 1 2 lATERIAi CONTACT PLATING PICK & PLACE PACKAGING SPEC. PEGS SEE PLATING NOTES CAP NUMBER 71436-2164 YES 30 GOLD NO PK-70873-0607 TUBE 64 71436-2364 YES 30 GOLD YES PK-70873-0607
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2002/95/EC
2000/53/EC"
SDA-71436-2*
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