photodiode demodulation
Abstract: gold metal detectors gold detectors circuit bond wire gold fiber optic detector fibre optic laser ceramic package PDB-C122
Text: PHOTONIC Silicon Photodiode, Blue Enhanced Photoconductive Monitor Photodiode Type PDB-C122 DETECTORS INC. PACKAGE DIMENSIONS INCH [mm] GOLD METAL THIS SIDE CL .040 [1.02] ACTIVE AREA CL .030 [0.76] .060 [1.52] ANODE METALIZATION TOP VIEW CATHODE METALIZATION
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PDB-C122
PDB-C122
100-PDB-C122
photodiode demodulation
gold metal detectors
gold detectors circuit
bond wire gold
fiber optic detector
fibre optic laser
ceramic package
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Untitled
Abstract: No abstract text available
Text: PHOTONIC Silicon Photodiode, Blue Enhanced Photoconductive Monitor Photodiode Type PDB-C122 DETECTORS INC. PACKAGE DIMENSIONS INCH [mm] GOLD METAL THIS SIDE CL .040 [1.02] ACTIVE AREA C L .030 [0.76] .060 [1.52] ANODE METALIZATION TOP VIEW CATHODE METALIZATION
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PDB-C122
PDB-C122
100-PDB-C122
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cdb7619
Abstract: No abstract text available
Text: DATA SHEET Silicon Schottky Barrier Diodes: Packaged, Bondable Chips and Beam Leads Applications • Detectors Mixers Features Available in both P-type and N-type low barrier designs Low 1/f noise Large bond pad chip design Planar passivated beam-lead and chip construction
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J-STD-020)
SQ04-0073.
200847F
cdb7619
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diode RL 207
Abstract: gold metal detectors gold detector circuit free x band diode detector waveguide CDB7620-207 ka-band mixer DDB2503-250 DDB2504-000 DDB2504-230 DDB2265-000
Text: DATA SHEET Silicon Schottky Barrier Diodes: Packaged, Bondable Chips and Beam Leads Applications x Detectors Features x Available in both P-type and N-type low barrier silicon x Low 1/f noise x Bonded junctions for reliability x Planar passivated beam-lead and chip construction
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J-STD-020)
200847B
diode RL 207
gold metal detectors
gold detector circuit free
x band diode detector waveguide
CDB7620-207
ka-band mixer
DDB2503-250
DDB2504-000
DDB2504-230
DDB2265-000
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gold metal detectors
Abstract: epoxy adhesive paste cte table 28 pin ic base socket round pin type lead spot welding schematics soft solder die bonding electrical three phase schematic riser DIAGRAM CERAMIC PIN GRID ARRAY wire lead frame ausi die attach thin silicon die soft solder wire dispensing 10 k ntc thermistor
Text: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity
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Alumina ceramic AI203
Abstract: ausi die attach gold metal detectors AI203 gold melting furnace pressure low die attach spot welding schematics ausi die attach thin silicon die Dissolve Oxygen ceramic pin grid array package wire bond
Text: Alumina & Leaded Molded Technology 3 3.1 Introduction The packaging technologies used to manufacture or assemble three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity
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solid solubility
Abstract: chemical control process block diagram
Text: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity
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Ultrasonic Cleaning Transducer
Abstract: Ultrasonic welding circuit diagram gold metal detectors ultrasonic transducer cleaning bath Ultrasonic nozzle schematic ultrasonic motion detector gold detectors circuit INCOMING RAW MATERIAL INSPECTION soft solder wire dispensing soft solder die bonding
Text: CHAPTER 3 IC ASSEMBLY TECHNOLOGY INTRODUCTION The material and process technology steps used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter The package families described in Chapter 1 provide the functional specialization and diversity required by our customers Material and construction attributes of individual family
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gold metal detectors
Abstract: soft solder die bonding schematic diagram intel atom INCOMING RAW MATERIAL INSPECTION lead side brazed hermetic X-RAY INSPECTION ausi die attach electrical three phase schematic riser DIAGRAM epoxy adhesive paste cte table intel 24008
Text: 2 3 Component Assembly Technology 1/22/97 9:49 AM CH03WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 3 COMPONENT ASSEMBLY TECHNOLOGY 3.1. INTRODUCTION The packaging technologies used to manufacture or assemble Intel’s three basic types of
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CH03WIP
gold metal detectors
soft solder die bonding
schematic diagram intel atom
INCOMING RAW MATERIAL INSPECTION
lead side brazed hermetic
X-RAY INSPECTION
ausi die attach
electrical three phase schematic riser DIAGRAM
epoxy adhesive paste cte table
intel 24008
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iec60603-7
Abstract: IEC-60603-7 IEC606037 85513 STR-1340
Text: Molex’s broad range of Palladium Nickel plated CAT 3 modular jacks exceeds the Cat 3 standard for low-speed Ethernet applications and meets the increased durability requirement of 2500 cycles, as stipulated by IEC 60603-7 PL2, at a lower cost than all-gold plated equivalents
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STR-1340
EUR/GF/2011
iec60603-7
IEC-60603-7
IEC606037
85513
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MAX8211CPA
Abstract: MAX8211 MAX8212 MAX8216 MAX8211EJA MAX8211MJA ICL8212 MAX8211EPA
Text: Maxim > Products > [Timekeeping, Timers, and Counters] [Military/Aerospace] MAX8211, MAX8212 Microprocessor Voltage Monitors with Programmable Voltage Detection Description Maxim's MAX8211 and MAX8212 are CMOS micropower voltage detectors that warn microprocessors µPs of power failures. Each contains a comparator, a
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MAX8211,
MAX8212
MAX8211
MAX8212
MS012
MAX8211CPA
MAX8216
MAX8211EJA
MAX8211MJA
ICL8212
MAX8211EPA
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2455R
Abstract: 2455RM 2450rc 3455rm 2455Rc 2455r honeywell 2455rbv 3455r 3450rc thermostats 3455rm
Text: THERMOSTATS - COMMERCIAL Thermostats - Commercial Commercial thermostats include products for use in a wide array of small and major appliances, automotive applications, office copy machines, heat and smoke detectors and HVAC equipment. These snap-action thermostats include automatic or manual reset options, phenolic or
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2450R/2450HR/2455R
2455R-
2455R
2455RM
2450rc
3455rm
2455Rc
2455r honeywell
2455rbv
3455r
3450rc
thermostats 3455rm
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Untitled
Abstract: No abstract text available
Text: HMC363G8 v00.0203 FREQUENCY DIVIDERS & DETECTORS - SMT 5 SMT GaAs HBT MMIC DIVIDE-BY-8, DC - 12.0 GHz Typical Applications Features Prescaler for DC to X Band PLL Applications: Ultra Low SSB Phase Noise: -153 dBc/Hz • Point-to-Point / Multi-Point Radios
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HMC363G8
HMC363G8
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gold metal detectors
Abstract: gold detectors circuit "Frequency Dividers" Corning 7052 PF 1002 HMC364G8
Text: HMC364G8 v00.1002 FREQUENCY DIVIDERS & DETECTORS - SMT 6 SMT GaAs HBT MMIC DIVIDE-BY-2, DC - 13 GHz Typical Applications Features Prescaler for DC to X Band PLL Applications: Ultra Low SSB Phase Noise: -145 dBc/Hz • Point-to-Point / Multi-Point Radios Wide Bandwidth
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HMC364G8
HMC364G8
gold metal detectors
gold detectors circuit
"Frequency Dividers"
Corning 7052
PF 1002
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Untitled
Abstract: No abstract text available
Text: HMC364G8 v00.1002 SMT GaAs HBT MMIC DIVIDE-BY-2, DC - 13.0 GHz FREQ. DIVIDERS & DETECTORS - SMT 10 Typical Applications Features Prescaler for DC to X Band PLL Applications: Ultra Low SSB Phase Noise: -145 dBc/Hz • Point-to-Point / Multi-Point Radios Wide Bandwidth
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HMC364G8
HMC364G8
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gold metal detectors
Abstract: gold detectors circuit corning tantalum "Frequency Dividers" Corning 7052 HMC365G8
Text: HMC365G8 v00.1002 FREQUENCY DIVIDERS & DETECTORS - SMT 6 SMT GaAs HBT MMIC DIVIDE-BY-4, DC - 13 GHz Typical Applications Features Prescaler for DC to Ku Band PLL Applications: Ultra Low SSB Phase Noise: -151 dBc/Hz • Point-to-Point / Multi-Point Radios Wide Bandwidth
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HMC365G8
HMC365G8
gold metal detectors
gold detectors circuit
corning tantalum
"Frequency Dividers"
Corning 7052
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avr 102
Abstract: No abstract text available
Text: BEAM LEAD SCHOTTKY DIODES FOR MIXERS AND DETECTORS 1-26 GHZ HSCH-5300 SERIES Features PLATINUM TRI-METAL SYSTEM High Temperature Stability * CATHODE / 130(6) ICO (4) SILICON NITRIDE PASSIVATION Stable, Reliable Performance <jU1 _U LCAUil GOLD LEADS t Zir-piTO
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HSCH-5300
avr 102
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AD9686BH
Abstract: AD9686TQ AD9686 AD9686BQ AD9686TE AD9686TH Q-16
Text: High-Speed TTL Voltage Comparator ANALOG DEVICES □ AD9686 AD9686 FUNCTIONAL BLOCK DIAGRAM FEATURES 7ns Propagation Delay Complementary TTL Outputs 85dB CMRR + 5V, —6V Supply Voltages + 5 .0 V APPLICATIONS High-Speed Triggers High-Speed Line Receivers Peak Detectors
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AD9686
AD9686
AD9686BH
AD9686TQ
AD9686BQ
AD9686TE
AD9686TH
Q-16
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AD9686
Abstract: AD9686BH AD9686BQ AD9686TE AD9686TH AD9686TQ Q-16
Text: High-Speed TTL Voltage Comparator ANALOG DEVICES □ AD9686 AD9686 FUNCTIONAL BLOCK DIAGRAM FEATURES 7ns Propagation Delay Complementary TTL Outputs 85dB CMRR + 5V, —6V Supply Voltages + 5 .0 V APPLICATIONS High-Speed Triggers High-Speed Line Receivers Peak Detectors
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OCR Scan
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AD9686
AD9686
AD9686BH
AD9686BQ
AD9686TE
AD9686TH
AD9686TQ
Q-16
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Scans-051
Abstract: AD9686TH
Text: High-Speed TTLVoltage Comparator AD9686 ANALOG DEVICES □ AD9686 FUNCTIONAL BLOCK DIAGRAM FEATURES 7ns Propagation Delay Complementary TTL Outputs 85dB CMRR + 5V, —6V Supply Voltages APPLICATIONS High-Speed Triggers High-Speed Line Receivers Peak Detectors
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OCR Scan
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AD9686
AD9686
Scans-051
AD9686TH
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311 comparator pin diagram
Abstract: 9685BH AD9687BD AD9685
Text: ANALOG DEVICES □ High-Speed Comparators AD9685/AD9687 FEATURES AD9685/AD9687 FUNCTIONAL BLOCK DIAGRAMS 2.7ns Propagation Delay 0.5ns Latch Setup Time 90dB CMRR + 5V, -5 .2 V Supply Voltages APPLICATIONS High-Speed Triggers High-Speed Line Receivers Peak Detectors
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AD9685/AD9687
AD9685/AD9687
AD9685
AD9687
AD9687BD
AD9687
311 comparator pin diagram
9685BH
AD9687BD
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Microwave zero bias detector diodes
Abstract: No abstract text available
Text: W hol H EW LETT 1"EM P A C K A R D Schottky Barrier Diodes for Stripline, Microstrip Mixers and Detectors Technical Data Features • Small Size • Low Noise Figure 6 dB Typical at 9 GHz • Rugged Design • High Uniformity • High Burnout Rating 1 VVRF Pulse Power Incident
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5082-2200
Abstract: No abstract text available
Text: W fip t H E W LE T T rnLKÄ PACKARD Schottky Barrier Diodes for Stripline, Microstrip Mixers and Detectors 5082-2200/01/02/03 5082-2207/08/09/10 5082-2765/66 5082-2774/75 5082-2785/86 5082-2794/95 Technical Data Features • Small Size • Low Noise Figure
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Untitled
Abstract: No abstract text available
Text: What EW LETT* miltm HPACKARD Schottky Barrier Diodes for Stripline, Microstrip Mixers and Detectors Technical Data Features • Small Size • Low Noise Figure 6 dB Typical at 9 GHz • Rugged Design • High Uniformity • High Burnout Rating 1 W RF Pulse Power Incident
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