photodiode demodulation
Abstract: gold metal detectors gold detectors circuit bond wire gold fiber optic detector fibre optic laser ceramic package PDB-C122
Text: PHOTONIC Silicon Photodiode, Blue Enhanced Photoconductive Monitor Photodiode Type PDB-C122 DETECTORS INC. PACKAGE DIMENSIONS INCH [mm] GOLD METAL THIS SIDE CL .040 [1.02] ACTIVE AREA CL .030 [0.76] .060 [1.52] ANODE METALIZATION TOP VIEW CATHODE METALIZATION
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PDB-C122
PDB-C122
100-PDB-C122
photodiode demodulation
gold metal detectors
gold detectors circuit
bond wire gold
fiber optic detector
fibre optic laser
ceramic package
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Untitled
Abstract: No abstract text available
Text: PHOTONIC Silicon Photodiode, Blue Enhanced Photoconductive Monitor Photodiode Type PDB-C122 DETECTORS INC. PACKAGE DIMENSIONS INCH [mm] GOLD METAL THIS SIDE CL .040 [1.02] ACTIVE AREA C L .030 [0.76] .060 [1.52] ANODE METALIZATION TOP VIEW CATHODE METALIZATION
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PDB-C122
PDB-C122
100-PDB-C122
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Untitled
Abstract: No abstract text available
Text: MADS-011010-1419 Schottky Zero Bias Detector Diode Chip Absolute Maximum Ratings 1,2 Features P-Type Schottky Diode Can be used Without External DC Bias Large Bondable Contact RoHs Compliant Available in Chip Form ODS-1419 Can be Mounted with Solder or Conductive Epoxy.
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MADS-011010-1419
ODS-1419)
MADS-011010-1419
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LED810-PD010_40D52
Abstract: IR LED 810 nm
Text: LED810/PD010-40D52 metal can sealed PD monitoring high power LED LED810/PD010-40D52 consists of a GaAlAs LED 810 nm and a Si-PD mounted onTO-18 stem hermetically sealed with a glass flat can, and is designed to monitor reflected light through detector for controlling its
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LED810/PD010-40D52
LED810/PD010-40D52
onTO-18
led810-pd010
40d52
LED810-PD010_40D52
IR LED 810 nm
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LED890-PD010_40D52
Abstract: No abstract text available
Text: LED890/PD010-40D52 metal can sealed PD monitoring high power LED LED890/PD010-40D52 consists of a GaAlAs LED 890nm and a Si-PD mounted onTO-18 stem hermetically sealed with a glass flat can, and is designed to monitor reflected light through detector for controlling its
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LED890/PD010-40D52
LED890/PD010-40D52
890nm
onTO-18
led890-pd010
40d52
LED890-PD010_40D52
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cdb7619
Abstract: No abstract text available
Text: DATA SHEET Silicon Schottky Barrier Diodes: Packaged, Bondable Chips and Beam Leads Applications • Detectors Mixers Features Available in both P-type and N-type low barrier designs Low 1/f noise Large bond pad chip design Planar passivated beam-lead and chip construction
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J-STD-020)
SQ04-0073.
200847F
cdb7619
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diode RL 207
Abstract: gold metal detectors gold detector circuit free x band diode detector waveguide CDB7620-207 ka-band mixer DDB2503-250 DDB2504-000 DDB2504-230 DDB2265-000
Text: DATA SHEET Silicon Schottky Barrier Diodes: Packaged, Bondable Chips and Beam Leads Applications x Detectors Features x Available in both P-type and N-type low barrier silicon x Low 1/f noise x Bonded junctions for reliability x Planar passivated beam-lead and chip construction
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J-STD-020)
200847B
diode RL 207
gold metal detectors
gold detector circuit free
x band diode detector waveguide
CDB7620-207
ka-band mixer
DDB2503-250
DDB2504-000
DDB2504-230
DDB2265-000
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Untitled
Abstract: No abstract text available
Text: epitex Φ5 STEM LED/PD Opto-Device & Custom LED L830/PD010-40D52 metal can sealed PD monitering high power LED L830/PD010-40D52 consists of a GaAlAs LED 830nm and a Si-PD mounted onTO-18 stem hermeticaly sealed with a glass flat can, and is designed to moniter reflected light through detector for
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L830/PD010-40D52
L830/PD010-40D52
830nm
onTO-18
IF50mA
J-6512
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Untitled
Abstract: No abstract text available
Text: epitex Opto-Device & Custom LED L810/PD010-40D52 Φ5 STEM LED/PD metal can sealed PD monitering high power LED L810/PD010-40D52 consists of a GaAlAs LED 810nm and a Si-PD mounted onTO-18 stem hermeticaly sealed with a glass flat can, and is designed to moniter reflected light through detector for
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L810/PD010-40D52
L810/PD010-40D52
810nm
onTO-18
IF50mA
J-6512
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TB478
Abstract: IPC-A610A
Text: PCB Assembly Guidelines for Shell-Op 3D Package Technical Brief Introduction The Shell-Op 3D package is a cavity package that utilizes a glass lid and is attached to the board via a solder ball array. The glass lid allows the detector on the die surface to sense blue
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TB478
IPC-A610A
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gold metal detectors
Abstract: epoxy adhesive paste cte table 28 pin ic base socket round pin type lead spot welding schematics soft solder die bonding electrical three phase schematic riser DIAGRAM CERAMIC PIN GRID ARRAY wire lead frame ausi die attach thin silicon die soft solder wire dispensing 10 k ntc thermistor
Text: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity
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Alumina ceramic AI203
Abstract: ausi die attach gold metal detectors AI203 gold melting furnace pressure low die attach spot welding schematics ausi die attach thin silicon die Dissolve Oxygen ceramic pin grid array package wire bond
Text: Alumina & Leaded Molded Technology 3 3.1 Introduction The packaging technologies used to manufacture or assemble three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity
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solid solubility
Abstract: chemical control process block diagram
Text: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity
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Ultrasonic Cleaning Transducer
Abstract: Ultrasonic welding circuit diagram gold metal detectors ultrasonic transducer cleaning bath Ultrasonic nozzle schematic ultrasonic motion detector gold detectors circuit INCOMING RAW MATERIAL INSPECTION soft solder wire dispensing soft solder die bonding
Text: CHAPTER 3 IC ASSEMBLY TECHNOLOGY INTRODUCTION The material and process technology steps used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter The package families described in Chapter 1 provide the functional specialization and diversity required by our customers Material and construction attributes of individual family
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LED780-PD010-40D52
Abstract: No abstract text available
Text: LED780-PD010-40D52 v 1.1 19.09.2014 LED780-PD010-40D52 consists of a GaAlAs LED 780 nm and a Si-PD mounted onTO-18 stem hermetically sealed with a glass flat can, and is designed to monitor reflected light through detector for controlling its own output power.
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LED780-PD010-40D52
LED780-PD010-40D52
onTO-18
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gold detector circuit free
Abstract: gold metal detectors metal detector schematic gold detectors circuit CDB7619-000 gold detector circuit drawing free circuits metal detector Surface Mount RF Schottky Barrier Diodes metal detector CDC7630-000
Text: Applications • Mixer and detector Features • Low capacitance for usage beyond 40 GHz • ZBD and low barrier designs • P-type and N-type junctions • Large bond pad chip design • Chip products are Skyworks Green Silicon Schottky Diodes Skyworks broad product portfolio includes Schottky diodes as packaged and bondable
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CDB7619-000,
CDB7620-000,
CDB7630000,
CDB7631-000,
CDB7621-000
CDB7623-000
BRO376-09A
gold detector circuit free
gold metal detectors
metal detector schematic
gold detectors circuit
CDB7619-000
gold detector circuit drawing free
circuits metal detector
Surface Mount RF Schottky Barrier Diodes
metal detector
CDC7630-000
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avr 102
Abstract: No abstract text available
Text: BEAM LEAD SCHOTTKY DIODES FOR MIXERS AND DETECTORS 1-26 GHZ HSCH-5300 SERIES Features PLATINUM TRI-METAL SYSTEM High Temperature Stability * CATHODE / 130(6) ICO (4) SILICON NITRIDE PASSIVATION Stable, Reliable Performance <jU1 _U LCAUil GOLD LEADS t Zir-piTO
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HSCH-5300
avr 102
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AD9686BH
Abstract: AD9686TQ AD9686 AD9686BQ AD9686TE AD9686TH Q-16
Text: High-Speed TTL Voltage Comparator ANALOG DEVICES □ AD9686 AD9686 FUNCTIONAL BLOCK DIAGRAM FEATURES 7ns Propagation Delay Complementary TTL Outputs 85dB CMRR + 5V, —6V Supply Voltages + 5 .0 V APPLICATIONS High-Speed Triggers High-Speed Line Receivers Peak Detectors
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OCR Scan
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AD9686
AD9686
AD9686BH
AD9686TQ
AD9686BQ
AD9686TE
AD9686TH
Q-16
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AD9686
Abstract: AD9686BH AD9686BQ AD9686TE AD9686TH AD9686TQ Q-16
Text: High-Speed TTL Voltage Comparator ANALOG DEVICES □ AD9686 AD9686 FUNCTIONAL BLOCK DIAGRAM FEATURES 7ns Propagation Delay Complementary TTL Outputs 85dB CMRR + 5V, —6V Supply Voltages + 5 .0 V APPLICATIONS High-Speed Triggers High-Speed Line Receivers Peak Detectors
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OCR Scan
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AD9686
AD9686
AD9686BH
AD9686BQ
AD9686TE
AD9686TH
AD9686TQ
Q-16
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PDF
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Scans-051
Abstract: AD9686TH
Text: High-Speed TTLVoltage Comparator AD9686 ANALOG DEVICES □ AD9686 FUNCTIONAL BLOCK DIAGRAM FEATURES 7ns Propagation Delay Complementary TTL Outputs 85dB CMRR + 5V, —6V Supply Voltages APPLICATIONS High-Speed Triggers High-Speed Line Receivers Peak Detectors
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OCR Scan
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AD9686
AD9686
Scans-051
AD9686TH
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180 Degree hybrid ku band
Abstract: No abstract text available
Text: Universal Chip Mixer and Detector SchotUcy Barrier Diodes EBAIph CDX76XX, CME7660 Features • For Microwave M IC Assembly ■ Mechanically Rugged Design Exceeds MIL 883 Wire Bond Specifications for Hybrid Assembly ■ Optimized Barrier Heights for Mixer and Detector
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CDX76XX,
CME7660
AS004L2-11
AT001D3â
AK004M2-11
AS004M1-08
AT001D4-31
AK004R2-11
AS004M1-11
AT001D6-31
180 Degree hybrid ku band
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311 comparator pin diagram
Abstract: 9685BH AD9687BD AD9685
Text: ANALOG DEVICES □ High-Speed Comparators AD9685/AD9687 FEATURES AD9685/AD9687 FUNCTIONAL BLOCK DIAGRAMS 2.7ns Propagation Delay 0.5ns Latch Setup Time 90dB CMRR + 5V, -5 .2 V Supply Voltages APPLICATIONS High-Speed Triggers High-Speed Line Receivers Peak Detectors
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OCR Scan
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AD9685/AD9687
AD9685/AD9687
AD9685
AD9687
AD9687BD
AD9687
311 comparator pin diagram
9685BH
AD9687BD
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PDF
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CDB7619-000
Abstract: CDE7618-000 Silicon Detector Diodes
Text: EBA lpha Silicon Schottky Barrier Detector Diodes Features Both P-Type and N-Type Low Barrier Silicon Available Low 1/f Noise Bonded Junctions for Reliability Planar Passivated Beam-Lead and Chip Construction See Also Zero Bias Silicon Schottky Barrier Detector Diodes
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OCR Scan
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33e10
Abstract: No abstract text available
Text: I REVISIONS DESCRIPTION 0 INITIAL RELEASE 1 CHANGES PER DCN 4 0 3 2 2 1 DATE REV 10/10/02 11/1B/02 APPROVED WR/OFC HY/OFG 2X .156 1.002 DIA THRU ^ PIN NO. A DESIGNATION COLOR SLEEVE 1 THERMISTOR YELLOW 2 DETECTOR CATHODE - WHITE 3 DETECTDR ANDDE (+) GREEN
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11/1B/02
J19TE4
5-3CN-R01M
440023PDD
33e10
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