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    G173-G179

    Abstract: transistor G179
    Text: Journal of The Electrochemical Society, 156 ͑11͒ G173-G179 ͑2009͒ G173 0013-4651/2009/156͑11͒/G173/7/$25.00 The Electrochemical Society Interlevel Dielectric Processes Using PECVD Silicon Nitride, Polyimide, and Polybenzoxazole for GaAs HBT Technology


    Original     		PDF G173-G179 /G173/7/ G173-G179 transistor G179

    NATIONAL SEMICONDUCTOR ink MARKING

    Abstract: Die Attach epoxy stamping cte table flip chip substrate cte table ic bga JESD 49 gold wire bond failures due to ultrasonic cleaning Aluminum alloys physical properties FLIP CHIP PRODUCTS micro machine thermal conductivity coefficient of thermal expansion of thermal conductive pressure sensitive adhesive
    Text: September 2000 Die Products Business Unit as watches, calculators and smart cards as well as leading edge multiple die applications like cellular handsets and digital cameras. Better device performance utilizing die show up in processor modules for computers, workstations and servers as


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    250 micro solder ball

    Abstract: garrou fujitsu reflow profile SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY heller 1700 39ag
    Text: Lead-Free Wafer Level-Chip Scale Package: Assembly and Reliability V. Patwardhan, N. Kelkar, and L. Nguyen National Semiconductor Corporation P.O. Box 58090 M/S 19-100 Santa Clara, California 95052 Abstract This paper discusses the reliability testing results of a


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    maxim CODE TOP MARKING

    Abstract: Pb95Sn5 maxim TOP MARKING garrou wafer-level packaging has arrived Maxim ic date code ANALOG DEVICES ASSEMBLY DATE CODE philip IC marking Maxim date code DS2431 dALLAS MARKING CODE maxim assembly of code
    Text: Maxim > App Notes > 1-Wire Devices General Engineering Topics Keywords: flip, chip, scale, wafer, level, package, packages, packaging, wlp, ucsp, fchip, wlcsp, pb free, rohs, topmark, bump, die Apr 18, 2007 APPLICATION NOTE 4002 Understanding Flip-Chip and Chip-Scale Package Technologies and


    Original     		PDF DS2482-101: DS2502: DS2762: com/an4002 AN4002, APP4002, Appnote4002, maxim CODE TOP MARKING Pb95Sn5 maxim TOP MARKING garrou wafer-level packaging has arrived Maxim ic date code ANALOG DEVICES ASSEMBLY DATE CODE philip IC marking Maxim date code DS2431 dALLAS MARKING CODE maxim assembly of code