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    sac305

    Abstract: G770* sumitomo ABL-2100A G770J 2100a epoxy G770 sumitomo epoxy HSBGA VSC452XHW-02 secret
    Text: Package Material Composition and Mass Calculation Customer:Vitesse Package:23x23 HSBGA Device Type:VSC452XHW-02 Die Size: 7100 X 7300 um Total Pck. Weight g : 2675.785 Provided By: Gerry Alamillo Date: 2007/08/14 name Mold Compound Substrate Silicon Die Attach


    Original     		PDF 23x23 VSC452XHW-02 G770J sac305 G770* sumitomo ABL-2100A G770J 2100a epoxy G770 sumitomo epoxy HSBGA VSC452XHW-02 secret

    Tsi148-133IL

    Abstract: G770* sumitomo ablebond 2100A TSI148-133CL 2100a epoxy G770J A1001-01 8355F A1001 seal sumitomo
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1001-01 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: DATE: Apr 2, 2010 TSI148-133CL TSI148-133IL


    Original     		PDF A1001-01 TSI148-133CL TSI148-133IL Tsi148-133IL G770* sumitomo ablebond 2100A TSI148-133CL 2100a epoxy G770J A1001-01 8355F A1001 seal sumitomo