LS-BGA49B-61
Abstract: g10 fr4 7mm
Text: Top View 7mm [0.276"] 1.1mm [0.043"] 7mm [0.276"] 1.1mm [0.043"] 0.8mm typ. 4.8mm [0.189"] 4.8mm [0.189"] 1 3.76mm [0.148"] 1.42mm [0.056"] 2 0.2mm dia. [0.008"] Side View 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. non
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FR4/G10
LS-BGA49B-61
g10 fr4 7mm
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g10 fr4 7mm
Abstract: No abstract text available
Text: Top View RoHS Compliant 11 20 7.6mm 10.2mm 10 1 25.4mm 7.6mm 2.5mm Typ. 3 1 11.9mm 11.9mm assembled 2 Side View End View 0.65mm pitch typ. Description: Package Converter 20 position DIP to 20 Position SOIC. Pinout 1:1 7mm 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent
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FR4/G10
PC-DIP/SOIC20-10F
SOIC20-10F
g10 fr4 7mm
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g10 fr4 7mm
Abstract: FR4 substrate 1.6mm FR4 1.6mm substrate pitch 0.75mm BGA SF-BGA48G-B-03 bga 6x8 0.3mm pitch BGA
Text: 16mm [0.630"] 13.5mm [0.531"] Compatible BGA Spec 7mm 13.2mm [0.520"] 5mm [0.197"] 10.72mm [0.422"] 7mm 0.75mm pitch typ. 6.5mm [0.256"] R0.8 x4 Top View 9.8mm [0.386"] 0.38mm [0.015"] 9.75mm [0.384"] 0.75mm pitch typ. Side View End View 11.28mm [0.444"]
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FR4/G10
SF-BGA48G-B-03
SF-BGA048G-B-03
g10 fr4 7mm
FR4 substrate 1.6mm
FR4 1.6mm substrate
pitch 0.75mm BGA
bga 6x8
0.3mm pitch BGA
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FR4 substrate 1.6mm
Abstract: FR4 1.6mm substrate bga 6x8 SF-BGA48H-B-03 pitch 0.75mm BGA g10 fr4 7mm
Text: 16mm [0.630"] 13.5mm [0.531"] Compatible BGA Spec 7mm 13.2mm [0.520"] 5mm [0.197"] 10.72mm [0.422"] 8.5mm 0.75mm pitch typ. 6.5mm [0.256"] R0.8 x4 Top View 9.8mm [0.386"] 0.38mm [0.015"] 9.75mm [0.384"] 0.75mm pitch typ. Side View End View 11.28mm [0.444"]
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FR4/G10
SF-BGA48H-B-03
SF-BGA048H-B-03
FR4 substrate 1.6mm
FR4 1.6mm substrate
bga 6x8
pitch 0.75mm BGA
g10 fr4 7mm
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PB-BGA48G-Z-01
Abstract: g10 fr4 7mm
Text: 35.56mm [1.400"] 11 12 7.62mm [0.300"] 1 J4 2 J1 1 2 Compatible BGA Spec 12 11 7mm 35.56mm [1.400"] 7mm 33.02mm [1.300"] 0.75mm pitch typ. 2 1 J3 11 12 J2 2 1 12 11 1 7.62mm [0.300"] Top View 33.02mm [1.300"] 3 * This height varies depending on the screw position.
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FR4/G10
PB-BGA48G-Z-01
g10 fr4 7mm
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PB-BGA36B-Z-01
Abstract: g10 fr4 7mm
Text: 35.56mm [1.400"] 11 12 7.62mm [0.300"] 1 J4 2 J1 1 2 Compatible BGA Spec 12 11 7mm 35.56mm [1.400"] 8.5mm 33.02mm [1.300"] 0.75mm pitch typ. 2 1 J3 11 12 J2 2 1 12 11 1 7.62mm [0.300"] Top V iew 33.02mm [1.300"] 3 * This height varies depending on the screw position.
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FR4/G10
PB-BGA36B-Z-01
g10 fr4 7mm
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PB-BGA48H-Z-01
Abstract: g10 fr4 7mm Fr43
Text: 35.56mm [1.400"] 11 12 7.62mm [0.300"] 1 J4 2 J1 1 2 Compatible BGA Spec 12 11 7mm 35.56mm [1.400"] 8.5mm 33.02mm [1.300"] 0.75mm pitch typ. 2 1 J3 11 12 J2 2 1 12 11 1 7.62mm [0.300"] Top View 33.02mm [1.300"] 3 * This height varies depending on the screw position.
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FR4/G10
PB-BGA48H-Z-01
g10 fr4 7mm
Fr43
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IPC-4101
Abstract: IPC4553 345C SF-SO20E-L-41 IPC-4553 g10 fr4 7mm
Text: RoHS COMPLIANT 7mm 5.2mm Compatible target board land pattern not to scale A < 0.235 B > 0.335 13mm 0.016" A 1.27mm pitch typ. B 2.54mm 0.46mm±0.03mm dia. Top View 4.7mm 7.58mm±0.38mm 2 4 1 3 0.65 mm pitch typ. End View Side View Description: Surface mount foot (SF)
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IPC4553
FR4/G10
SF-SO20E-L-41
IPC-4101
IPC4553
345C
IPC-4553
g10 fr4 7mm
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g10 fr4 7mm
Abstract: SF-BGA49B-B-62 bga 0.8mm pitch 49 balls
Text: 7mm [0.276"] Top View 1.1mm [0.043"] 1.1mm [0.043"] Ordering Information: Solder Ball Alloy Part Number Suffix Sn63Pb37 7mm [0.276"] -62 Sn96.5Ag3.0Cu0.5 0.8mm typ. -62F* *RoHS Compliant 4.8mm [0.189"] Side View Detail A 2 Detail A 2.83mm [0.112"] 2.48mm [0.098"]
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Sn63Pb37
254mm/0
203mm
254mm0
FR4/G10
SF-BGA49B-B-62
g10 fr4 7mm
bga 0.8mm pitch 49 balls
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SG-BGA-7050
Abstract: No abstract text available
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid
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475mm.
525mm
SG-BGA-7050
725mm
025mm
125mm.
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g10 fr4 7mm
Abstract: SG-BGA-7039 micron 100 ball BGA
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid
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475mm.
525mm
725mm
025mm
SG-BGA-7039
125mm.
g10 fr4 7mm
micron 100 ball BGA
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SG-BGA-8003
Abstract: 18X18
Text: GHz BGA Socket - Direct mount, solderless Features Top View Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 24.225mm Ball guide prevents over compression of elastomer
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225mm
SG-BGA-8003
725mm
025mm
18X18
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SG-BGA-6047
Abstract: 17X17
Text: GHz BGA Socket - Direct mount, solderless Features Top View Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 24.225mm Ball guide prevents over compression of elastomer
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225mm
725mm
025mm
SG-BGA-6047
125mm
17X17
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size 0204
Abstract: SG-BGA-6258 6258
Text: Top View GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required 32.225mm 42.23mm Compression plate distributes forces evenly
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225mm
SG-BGA-6258
725mm
725mm
025mm
125mm.
size 0204
6258
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SG-BGA-6201
Abstract: No abstract text available
Text: GHz BGA Socket - Direct mount, solderless Features Top View Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 24.225mm Ball guide prevents over compression of elastomer
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225mm
725mm.
allo73mm
725mm
025mm
SG-BGA-6201
125mm
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6135
Abstract: SG-BGA-6135
Text: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Ball guide prevents over compression of elastomer
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225mm
SG-BGA-6135
FR4/G10,
725mm
025mm
125mm
6135
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SG-BGA-6006
Abstract: No abstract text available
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. Top View High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 24.225mm Ball guide prevents over compression of elastomer
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225mm
725mm
025mm
SG-BGA-6006
125mm
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SG-BGA-6246
Abstract: No abstract text available
Text: Top View GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required 32.225mm Compression plate distributes forces evenly 42.23mm
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225mm
725mm.
SG-BGA-6246
725mm
725mm
025mm
125mm.
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transistor tt 6093
Abstract: transistor c 6093 tt 6093 c 6093 SG-BGA-6093 6093
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. Top View High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 24.225mm Ball guide prevents over compression of elastomer
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225mm
725mm.
Guide09,
725mm
025mm
SG-BGA-6093
125mm
transistor tt 6093
transistor c 6093
tt 6093
c 6093
6093
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SG-BGA-6220
Abstract: No abstract text available
Text: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 24.225mm Ball guide prevents over compression of elastomer
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225mm
725mm
025mm
SG-BGA-6220
125mm.
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SG-BGA-6226
Abstract: No abstract text available
Text: 32.51mm GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection 7 32.51mm Minimum real estate required A Compression plate distributes forces evenly A Ball guide prevents over compression of elastomer
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Thickne-BGA-6226
725mm
025mm
SG-BGA-6226
125mm.
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octagon
Abstract: SG-BGA-6245
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. Top View High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 40.225mm 42.225mm
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225mm
SG-BGA-6245
863mm
025mm
725mm
octagon
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Untitled
Abstract: No abstract text available
Text: LatticeECP3 PCI Express Solutions Board – Revision A User’s Guide August 2012 Revision: EB43_01.2 LatticeECP3 PCI Express Solutions Board – Revision A User’s Guide Introduction As PCI Express applications have emerged, the LatticeECP3 FPGA family has become a well-suited solution for
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6R-0603SMT
50R-0402SMT
FC0402E50R0BTBST1
133MHZ
CCLD-033-50-133
10NF-0402SMT
ECJ0EB1E103K
50R-0603SMT
FC0603E50R0BTBT1
125MW
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R114 082 000
Abstract: Radiall R114 665 110 R114 005 000 SMB R114 186 000 R114 665 000 right angle Female m12 PCB connector 1.33 cm male connector SMB r114.003 R114 426 000 SMB connector
Text: SMB CONTENTS PAGE SMB Introduction. 4 General . 5
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