FBR59-HW
Abstract: No abstract text available
Text: Fujitsu Relays Automotive, Power, Signal, High Frequency, Solid State Product guide Fujitsu Components America, Inc. – Relays Content PRODUCT LINE-UP Automotive relays Page 4 Power relays Page 10 Signal relays Page 19 High frequency relays Page 21 Solid state relays
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Untitled
Abstract: No abstract text available
Text: MBF110 Solid-State Fingerprint Sensor Packages Overview The Fujitsu MBF110 Solid-State Fingerprint Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor with an integrated twodimensional array of metal electrodes in the sensing array. Each
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MBF110
MBF110
80-pin
BMS-DS-20878-08/2001
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capacitive fingerprint sensor specification
Abstract: CMOS image sensor fingerprint circuit biometric sensor BIT3 tsop sensor pcb layout fingerprint sensor pcb with circuit
Text: MBF110 Solid-State Fingerprint Sensor Packages Overview The Fujitsu MBF110 Solid-State Fingerprint Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor with an integrated twodimensional array of metal electrodes in the sensing array. Each
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MBF110
MBF110
80-pin,
500-dpi
capacitive fingerprint sensor specification
CMOS image sensor fingerprint circuit
biometric sensor
BIT3
tsop sensor pcb layout
fingerprint sensor pcb with circuit
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FPS110B
Abstract: MBF110 optical fingerprint sensor capacitive fingerprint sensor specification diagram of fingerprint sensor FPS110 tsop sensor pcb layout CE139
Text: MBF110 Solid-State Fingerprint Sensor Packages Overview The Fujitsu MBF110 Solid-State Fingerprint Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor with an integrated twodimensional array of metal electrodes in the sensing array. Each
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MBF110
MBF110
80-pin
BMS-DS-20878-08/2001
FPS110B
optical fingerprint sensor
capacitive fingerprint sensor specification
diagram of fingerprint sensor
FPS110
tsop sensor pcb layout
CE139
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FPS110B
Abstract: biometric fingerprint capacitive optical fingerprint sensor Veridicom capacitive fingerprint sensor array fingerprint sensor pcb with circuit tsop sensor pcb layout Fujitsu MBF110 diagram of fingerprint sensor MBF110
Text: MBF110 Solid-State Fingerprint Sensor Packages Overview The Fujitsu MBF110 Solid-State Fingerprint Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor with an integrated twodimensional array of metal electrodes in the sensing array. Each
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MBF110
MBF110
80-pin
BMS-DS-20878-08/2001
FPS110B
biometric fingerprint capacitive
optical fingerprint sensor
Veridicom
capacitive fingerprint sensor array
fingerprint sensor pcb with circuit
tsop sensor pcb layout
Fujitsu MBF110
diagram of fingerprint sensor
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MBF200
Abstract: CMOS image sensor fingerprint circuit diagram of fingerprint sensor fingerprint patent
Text: MBF200 Solid State Fingerprint Sensor Overview Packages The Fujitsu MBF200 Solid-State Fingerprint Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor composed of a twodimensional array of metal electrodes in the sensing array.
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MBF200
MBF200
CMOS image sensor fingerprint circuit
diagram of fingerprint sensor
fingerprint patent
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MBF200
Abstract: No abstract text available
Text: MBF200 Solid State Fingerprint Sensor Packages Overview The Fujitsu MBF200 Solid-State Fingerprint Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor composed of a twodimensional array of metal electrodes in the sensing array.
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MBF200
MBF200
BMS-DS-20886-10/2001
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CMOS image sensor fingerprint circuit
Abstract: No abstract text available
Text: MBF200 Solid State Fingerprint Sensor Packages Overview The Fujitsu MBF200 Solid-State Fingerprint Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor composed of a twodimensional array of metal electrodes in the sensing array.
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MBF200
MBF200
CMOS image sensor fingerprint circuit
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MBF200
Abstract: Veridicom fingerprint Sensor datasheet TST fingerprint sensor block diagram of fingerprint sensor CMOS image sensor fingerprint circuit diagram of fingerprint sensor Veridicom finger print
Text: MBF200 Solid State Fingerprint Sensor Packages Overview The Fujitsu MBF200 Solid-State Fingerprint Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor composed of a twodimensional array of metal electrodes in the sensing array.
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MBF200
MBF200
BMS-DS-20886-10/2001
Veridicom
fingerprint Sensor datasheet
TST fingerprint sensor
block diagram of fingerprint sensor
CMOS image sensor fingerprint circuit
diagram of fingerprint sensor
Veridicom finger print
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MBF200
Abstract: Veridicom CMOS image sensor fingerprint circuit diagram of fingerprint sensor FUJITSU SOLID STATE
Text: MBF200 Solid State Fingerprint Sensor Overview Packages The Fujitsu MBF200 Solid-State Fingerprint Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor composed of a twodimensional array of metal electrodes in the sensing array.
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MBF200
MBF200
BMS-DS-20886-6/2003
Veridicom
CMOS image sensor fingerprint circuit
diagram of fingerprint sensor
FUJITSU SOLID STATE
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solid state fingerprint sensor specification
Abstract: capacitive fingerprint sensor specification MBF200 Fujitsu MBF200 1000PPM J-STD-020A capacitive fingerprint sensor array capacitive fingerprint capacitive fingerprint sensor pcb ac in usb fujitsu
Text: MBF200 Solid State Fingerprint Sensor Overview The Fujitsu MBF200 is a 500 DPI 8-bit grayscale solid-state capacitive fingerprint sensor that reliably captures fingerprint images. The 2-dimensional array consists of 256 x 300 pixels manufactured in standard CMOS. The sensing area is 12.8mm x
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MBF200
MBF200
1000PPM)
BIO-DS-21289-2/2008
solid state fingerprint sensor specification
capacitive fingerprint sensor specification
Fujitsu MBF200
1000PPM
J-STD-020A
capacitive fingerprint sensor array
capacitive fingerprint
capacitive fingerprint sensor
pcb ac in usb fujitsu
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fingerprint sensor pcb with circuit
Abstract: No abstract text available
Text: MBF200 Solid State Fingerprint Sensor Overview The Fujitsu MBF200 is a 500 DPI 8-bit grayscale solid-state capacitive fingerprint sensor that reliably captures fingerprint images. The 2-dimensional array consists of 256 x 300 pixels manufactured in standard CMOS. The sensing area is 12.8mm x
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MBF200
MBF200
1000PPM)
BMS-DS-20886-8/2005
fingerprint sensor pcb with circuit
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fingerprint lock circuit
Abstract: capacitance fingerprint sensor
Text: MBF300 Solid State Fingerprint Sweep Sensor Packages Overview The Fujitsu MBF300 Solid-State Fingerprint Sweep Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor composed of a two-dimensional array of metal electrodes in the sensing array.
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MBF300
MBF300
MBF300-FPC
BMS-DS-20936-6/2002
fingerprint lock circuit
capacitance fingerprint sensor
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fingerprint lock circuit
Abstract: MBF300-FPC MBF300 capacitive fingerprint sensor array Fujitsu MBF300 diagram of fingerprint sensor TST fingerprint sensor
Text: MBF300 Solid State Fingerprint Sweep Sensor Packages Overview The Fujitsu MBF300 Solid-State Fingerprint Sweep Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor composed of a two-dimensional array of metal electrodes in the sensing array.
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MBF300
MBF300
MBF300-FPC
MBF300-FPC
BMS-DS-20936-6/2002
fingerprint lock circuit
capacitive fingerprint sensor array
Fujitsu MBF300
diagram of fingerprint sensor
TST fingerprint sensor
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takamisawa sn relay
Abstract: takamisawa power relay sn TAKAMISAWA SERIES VS TAKAMISAWA VS 100 takamisawa ra relay
Text: FUJITSU TAKAMISAWA COMPONENT CATALOG SOLID STATE RELAY I/O Module MAXIMUM LOAD CURRENT 1 A SN SERIES • FEATURES • I/O modules for interface between CPU and external input devices or loads • Ultra slim and light weight, SIL terminals type I/O modules
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Untitled
Abstract: No abstract text available
Text: n FUJITSU SEMICONDUCTOR DATA SHEET DS04-20100-3E ASSP TIMING EXTRACTION • DESCRIPTION The F1, F2 and F3 Series were developed as timing extraction filters for primary, secondary and tertiary digital communication devices. This new all-solid-state bandpass filter BPF uses a piezoelectric with a large electromechanical coefficient
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DS04-20100-3E
10OMFIz
35MHz:
400ppm
100MHz:
-30ppm/Â
500ppm
F9703
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takamisawa relay
Abstract: takamisawa takamisawa relay 12 takamisawa 24 takamisawa JY Diode SJ takamisawa relay sj takamisawa relay jy takamisawa relay 5 LR35579
Text: FUJITSU TAKAMISAWA COMPONENT CATALOG SOLID STATE RELAY MAXIMUM LOAD CURRENT 1 A SJ SERIES • FEATURES ● ● ● ● ● UL, CSA recognized Extremely small and light weight —Size: 10.0 W x 20.2 (L) × 12.8 (H) mm —Weight: approximately 5.5g High reliability, long life and maintenance free
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Abstract: No abstract text available
Text: cP r U II13U CT Iir r c i Ï FUJITSU takam isaw a COMPONENT CATALOG SOLID STATE RELAY MAXIMUM LOAD CURRENT 1 A SJ SERIES • FEATURES • UL, CSA recognized • Extremely small and light weight — Size: 10.0 W x 20.2 (L) x 12.8 (H) mm — W eight: approximately 5.5g
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takamisawa sn relay
Abstract: FUJITSU TAKAMISAWA VS 12 TAKAMISAWA SERIES sn Takamisawa relay Takamisawa 24 vdc relay TAKAMISAWA SERIES VS takamisawa SNA100B sn5001 takamisawa ny series
Text: <p C I ÏIÏT C Ï I r U III O U FUJITSU TAKAMISAWA COMPONENT CATALOG SOLID STATE RELAY I/O Module MAXIMUM LOAD CURRENT 1 A SN SERIES • FEATURES • I/O modules for interface between CPU and external input devices or loads • Ultra slim and light weight, SIL terminals type I/O modules
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Untitled
Abstract: No abstract text available
Text: Cp ITI IIITCII r u i l Ij U FUJITSU TAKAMISAWA c o m p o n e n t c a t a lo g SOLID STATE RELAY MAXIMUM LOAD CURRENT 1.5 A / 2A SE SERIES • FEATURES • Conforms to UL, CSA standards • Ultra slim and light weight, SIL terminals type — Size: 5.0 W x 20.0 (L) x 17.0 (H)mm
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TAKAMISAWA SERIES sg
Abstract: FUJITSU TAKAMISAWA VS 12 TAKAMISAWA SERIES VS
Text: cP CT H F T C f f r U I I 1 FUJITSU TAKAMISAWA COMPONENT CATALOG O l SOLID STATE RELAY MAXIMUM LOAD CURRENT 3 A SG SERIES • FEATURES • C onform s to UL, C SA S tandards • Slim , SIL Term inal Type — Size: 9.0 W) x 40.0 (L) x 20.0(H ) mm — W eight: a pp ro xim a tely 13g
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fujitsu ten
Abstract: keyboard scanning keyboards
Text: Keyswitches FES-8 Series Developed fo r use in keyboards. A v a ila b le in w id e range, Fujitsu Keyswitches in c lu d in g snap-action and non-snap a c tio n key switches, incandescent lam p o r LE D in d ic a tio n , reed capsule ty p e o r solid-state ty p e , and m o m e n ta ry o r alte rn a te a c tio n . L ife
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socket JL-5N
Abstract: minimum insulation resistance for high voltage ca 24 vdc power distribution board JL-5N
Text: SOLID STATE RELAY I/O Module MAXIMUM LOAD CURRENT 1 A SN SERIES • FEATURES ● ● ● ● ● ● I/O modules for interface between CPU and external input devices or loads Ultra slim and light weight, SIL terminals type I/O modules for high density mounting
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Abstract: No abstract text available
Text: SOLID STATE RELAY I/O Module MAXIMUM LOAD CURRENT 1 A SN SERIES • FEATURES ● ● ● ● ● ● I/O modules for interface between CPU and external input devices or loads Ultra slim and light weight, SIL terminals type I/O modules for high density mounting
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