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    FR4 SUBSTRATE 1.6MM Search Results

    FR4 SUBSTRATE 1.6MM Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    10135739-004LF Amphenol Communications Solutions OCTIS™ - SPLIT RUBBER GLAND 6MM Visit Amphenol Communications Solutions
    11826-CBA Amphenol Communications Solutions Lynx™, Mezzanine Connectors, Plug, 6mm HT 80 pin. Visit Amphenol Communications Solutions
    026-6A06-PDD Amphenol Communications Solutions Chameleon®,Mezzanine,Plug Assy,4PR 6MM,GEN2,14DP,4SE,4PWR Visit Amphenol Communications Solutions
    11826-CFA Amphenol Communications Solutions Lynx™, Mezzanine Connectors, Plug, 6mm HT 240 pin. Visit Amphenol Communications Solutions
    10132094-001LF Amphenol Communications Solutions PwrBlok® , Power Connectors, 6mm Power Pin diameter, vertical plug. Visit Amphenol Communications Solutions

    FR4 SUBSTRATE 1.6MM Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    SF-BGA64F-B-11

    Abstract: FR4 1.6mm substrate FR4 substrate 1.6mm SN63
    Text: 8mm [0.315"] 1.2mm [0.047"] 0.8mm typ. 1.2mm [0.047"] 8mm [0.315"] Top View 0.3mm dia. [0.012"] 0.8mm typ. 2 1.6mm [0.063"] 6.78mm [0.267"] 1 Side View 3 0.8mm typ. 0.33mm [0.013"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2


    Original     		FR4/G10 SF-BGA64F-B-11 2004IRONWOOD FR4 1.6mm substrate FR4 substrate 1.6mm SN63 PDF

    SF-BGA144F-B-11

    Abstract: SN63 PB37 SN63 FR4 substrate 1.6mm FR4 1.6mm substrate
    Text: Patent # 6,351,392 12mm [0.472"] 12mm [0.472"] 0.8mm typ. [0.031"] Top View 0.8mm typ. [0.031"] 0.3mm [0.012"] 2 6.78mm [0.267"] 1.6mm [0.063"] 1 Side View 3 0.8mm typ. [0.031"] 0.33mm [0.013"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2


    Original     		FR4/G10 13x13x4 SF-BGA144F-B-11 SN63 PB37 SN63 FR4 substrate 1.6mm FR4 1.6mm substrate PDF

    AMF1608B2450A1T

    Abstract: AMF1005B2450AT AMF1608B2450B1T 2400-2500MHz
    Text: MD-MDE013-201212 Multilayer Chip BPF AMF1005B / AMF1608B Series Applications Features • Mobile phone  Ultra Small Size and Low Profile 1.6mm（L）x0.8mm（W）×0.4mm（H） typ.  W-LAN , Bluetooth , etc. 1.0mm（L）×0.5mm（W）×0.4mm（H） typ.


    Original     		MD-MDE013-201212 AMF1005B AMF1608B 960MHz) AMF1005B2450AT 4800-5000MHz) 7200-7500MHz) 1710-1990MHz) 2110-2170MHz) AMF1005B5375AT AMF1608B2450A1T AMF1608B2450B1T 2400-2500MHz PDF

    SF-BGA256J-B-01

    Abstract: FR4 substrate 1.6mm SN63 FR4 1.6mm substrate 1.6mm pitch BGA
    Text: 14mm [0.551"] 1mm [0.039"] Top View 1mm [0.039"] 14mm [0.551"] 0.8mm [0.031"] pitch typ. 12mm [0.472"] sqr. 0.36mm [0.014"] 0.8mm [0.031"] pitch typ. Side View 6.78mm [0.267"] 2 1.6mm [0.063"] 1 0.8mm [0.031"] pitch typ. 0.33mm [0.013"] 3 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]


    Original     		FR4/G10 16x16 SF-BGA256J-B-01 FR4 substrate 1.6mm SN63 FR4 1.6mm substrate 1.6mm pitch BGA PDF

    SF-BGA60G-B-62F

    Abstract: FR4 substrate 1.6mm
    Text: 0.8mm typ. 1.6mm Detail A 1mm 0.89mm [0.035"] 2.83mm [0.112"] 13mm 1mm typ. 1mm Top View 8mm [0.315"] Detail A 2 2.48mm [0.098"] 1 3 0.36mm ± 0.05mm [0.014" ± 0.002"] CONTACT DATA Accepts 0.20mm - 0.33mm Diameter pins 3-finger 37/25 gram, Initial insertion force with 0.254mm/0.203mm dia. pin


    Original     		254mm/0 203mm 254mm0 FR4/G10 SF-BGA60G-B-62F FR4 substrate 1.6mm PDF

    SF-BGA60G-B-62

    Abstract: 1mm pitch BGA FR4 substrate 1.6mm
    Text: 1.6mm 0.8mm typ. Detail A 1mm 0.89mm [0.035"] 2.83mm [0.112"] 13mm 1mm typ. 1mm Top View 8mm [0.315"] Detail A 2 2.48mm [0.098"] 1 3 0.36mm ± 0.05mm [0.014" ± 0.002"] CONTACT DATA Accepts 0.20mm - 0.33mm Diameter pins 3-finger 37/25 gram, Initial insertion force with 0.254mm/0.203mm dia. pin


    Original     		254mm/0 203mm 254mm0 FR4/G10 con37 SF-BGA60G-B-62 1mm pitch BGA FR4 substrate 1.6mm PDF

    FR4 1.6mm substrate

    Abstract: Thermagon t-lam CLD-AP25 Fabrication process steps mcpcb FR-4 substrate 1.6mm NEMA FR-4 led mcpcb large copper trace thermal Thermagon pcb fabrication process kapton
    Text: Optimizing PCB Thermal Performance for Cree XLamp® LEDs Table of Contents 1. Introduction. 2 2. Thermal Management Principles. 2


    Original     		CLD-AP37 FR4 1.6mm substrate Thermagon t-lam CLD-AP25 Fabrication process steps mcpcb FR-4 substrate 1.6mm NEMA FR-4 led mcpcb large copper trace thermal Thermagon pcb fabrication process kapton PDF

    FR4 epoxy glass 1.6mm substrate

    Abstract: 32101-801 specification CECC 32100 Capacitor 32101-801 60068-2-21 CECC - Detail Specifications Syfer Capacitors syfer x7r capacitors syfer x7r 1206 CECC Capacitor
    Text: Syfer Technology Limited, Old Stoke Road, Arminghall, Norwich, Norfolk, NR14 8SQ, United Kingdom Tel: +44 0 1603 723300. Tel. (Sales): 01603 723310 Fax: +44 (0) 1603 723301 Email: sales@syfer.co.uk Web: www.syfer.com Bend Testing Introduction 2 International Requirements/ Specifications


    Original     		AN0002 FR4 epoxy glass 1.6mm substrate 32101-801 specification CECC 32100 Capacitor 32101-801 60068-2-21 CECC - Detail Specifications Syfer Capacitors syfer x7r capacitors syfer x7r 1206 CECC Capacitor PDF

    FR4 epoxy glass 1.6mm substrate

    Abstract: FR4 1.6mm substrate on 5295 transistor AN-996 SMD10 IRG4Z the calculation of the power dissipation for the IGBT IGBT heatsink cleaning FR4 substrate 1.6mm
    Text: AN-996 v.Int Guidelines for the Assembly of SMD10 Devices Introduction This application note gives details of thermal characteristics and mounting considerations for the SMD10 surface mount package from International Rectifier. With a proven track record for mounting on IMS board in International Rectifiers’


    Original     		AN-996 SMD10 FR4 epoxy glass 1.6mm substrate FR4 1.6mm substrate on 5295 transistor AN-996 IRG4Z the calculation of the power dissipation for the IGBT IGBT heatsink cleaning FR4 substrate 1.6mm PDF

    FR4 epoxy glass 1.5mm substrate

    Abstract: sheet metal press bending machine
    Text: MOUNTING INSTRUCTIONS page Axial-leaded devices 562 SOT54 T092 563 SOT82 564 SOT78 (T0220AB); SOT186A 567 SOT223; SOT428; SOT4Q4 572 Philips Semiconductors Mounting instructions Axial-ieaded devices GENERAL DATA AND INSTRUCTIONS General rules Excessive forces or temperature applied to a diode may


    OCR Scan     		T0220AB) OT186A OT223; OT428; FR4 epoxy glass 1.5mm substrate sheet metal press bending machine PDF

    FR4 epoxy pcb double sided

    Abstract: double sided pcb, thermal via FR4 pcb led 3w ASMT ASMT-MT00 ASMT-MW20 double sided pcb FR4
    Text: Thermal Management of Avago High Power LED Emitter ASMT-Mxxx/ASMT-Axxx/ASMT-Jxxx Application Note 5313 1. Introduction 2.1 Introduction to thermal resistance Avago Technologies ASMT-Mxxx/ASMT-Axxx/ASMT-Jxxx is a high power LED emitter that provides high luminous


    Original     		AV02-0082EN AV02-1958EN FR4 epoxy pcb double sided double sided pcb, thermal via FR4 pcb led 3w ASMT ASMT-MT00 ASMT-MW20 double sided pcb FR4 PDF

    FR4 epoxy pcb double sided

    Abstract: double sided pcb, thermal via double sided pcb FR4 Aluminum Base 3 LED emitters PCB HSMC-A100 LED APPLICATION NOTE FR4 1.6mm substrate 4032C
    Text: Thermal Management of Avago MonoPLCC LED Application Note 5373 Introduction Avago SMD LED that provides high luminous intensity output has common semiconductor component character with maximum permissible junction temperature in the range of 110 – 125°C. This means that the temperature of the LED die inside must not exceed this value when


    Original     		AV02-0955EN FR4 epoxy pcb double sided double sided pcb, thermal via double sided pcb FR4 Aluminum Base 3 LED emitters PCB HSMC-A100 LED APPLICATION NOTE FR4 1.6mm substrate 4032C PDF

    tektronix type 576 curve tracer

    Abstract: heat exchanger 96Sn4Ag tektronix 576 curve tracer 100N IRF6601 IRF6602 cardwell FR4 substrate 1.6mm
    Text: The Mechanical Ruggedness of DirectFET TM Stuart Cardwell & Arthur Woodworth International Rectifier, Holland Road, Hurst Green, Oxted, Surrey, RH8 9BB, UK as presented at PCIM Europe 02 Abstract This paper outlines the mechanical tests TM performed on the DirectFET , the reasons for


    Original     		PDF

    96Sn4Ag

    Abstract: E161567 heat exchanger tektronix 576 curve tracer MOSFET TEST SIMPLE Procedures 100N IRF6601 IRF6602 60068-2-21 FR4 substrate 1.6mm
    Text: DirectFET TM Technology: A Mechanically robust Surface Mount Technology Stuart Cardwell & Andrew Sawle International Rectifier, Holland Road, Hurst Green, Oxted, Surrey, RH8 9BB, UK As presented at the Power Electronics Conference, May 2002 Abstract This paper outlines a selection of mechanical


    Original     		PDF

    AMF100540L

    Abstract: AMF100540L2500AT AMF160840D87181AT S1156 AMF160840D87181BT AMF100540L0620AT AMF100540L2450AT 2400-2500MHz
    Text: MD-MDE015-201212 Multilayer Chip LPF AMF1005 L / AMF1608D Series Features Applications • Ultra Small Size and Low Profile  Mobile phone 1.0mm（L）x0.5mm（W）×0.4mm（H） typ.  RF Module 1.0mm（L）×0.5mm（W）×0.5mm（H） typ. Antenna Switch Module


    Original     		MD-MDE015-201212 AMF1005 AMF1608D 806MHz) AMF100540L0620AT 770MHz) 1429-1516MHz) 1710-2155MHz) 2400-2500MHz) AMF100540L0870AT AMF100540L AMF100540L2500AT AMF160840D87181AT S1156 AMF160840D87181BT AMF100540L2450AT 2400-2500MHz PDF

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


    Original     		PDF

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: 1.6X0.8mm SMD CHIP LED LAMP Part Number: APT1608SYCK-AMT Super Bright Yellow Description Features The Super Bright Yellow device is made with AlGaInP z High reliability LED package. on GaAs substrate light emitting diode chip. z 1.6mmx0.8mm SMT LED,0.75mm thickness


    Original     		APT1608SYCK-AMT 2000pcs ED4701/100 DSAI6419 JUN/15/2011 PDF

    APT1608SURCK-AMT

    Abstract: No abstract text available
    Text: 1.6X0.8mm SMD CHIP LED LAMP Part Number: APT1608SURCK-AMT Hyper Red Description Features z High reliability LED package. z 1.6mmx0.8mm SMT LED,0.75mm thickness z Low power consumption. The Hyper Red source color devices are made with AlGaInP on GaAs substrate Light Emitting Diode.


    Original     		APT1608SURCK-AMT 2000pcs ED4701/100 DSAI6420 NOV/24/2010 PDF

    FR4 epoxy glass 1.6mm substrate

    Abstract: CPA0612 FR4 substrate 1.6mm
    Text: CP02M581.04 Rev I - Page 1 of 4 Product Family: Current Sensing Power Resistor Part Number Series: CPA0612 Series Construction: Features: •       High purity alumina substrate Nickel alloy thin-film resistive element


    Original     		CP02M581 CPA0612 Sn100, FR4 epoxy glass 1.6mm substrate FR4 substrate 1.6mm PDF

    FR4 epoxy glass 1.6mm substrate

    Abstract: CPA0612 CPA0612QR005FS epoxy resin marking code b6 R005 FR4 substrate 1.6mm
    Text: CP02M581.04 Rev F - Page 1 of 4 Product Family: Current Sensing Power Resistor Part Number Series: CPA0612 Series Construction: Features: •       High purity alumina substrate Nickel alloy thin-film resistive element


    Original     		CP02M581 CPA0612 Sn100, FR4 epoxy glass 1.6mm substrate CPA0612QR005FS epoxy resin marking code b6 R005 FR4 substrate 1.6mm PDF

    MLCC CRACK

    Abstract: syfer x7r capacitors 1206 SAC CHIP capacitor cross reference AN0010 syfer 1206 TYPES OF CAPACITORS testing
    Text: Syfer Technology Limited, Old Stoke Road, Arminghall, Norwich, Norfolk, NR14 8SQ, United Kingdom Tel: +44 0 1603 723300. Tel. (Sales): 01603 723310 Fax: +44 (0) 1603 723301 Email: sales@syfer.co.uk Web: www.syfer.com The Effect of Lead Free Soldering on


    Original     		AN0010 MLCC CRACK syfer x7r capacitors 1206 SAC CHIP capacitor cross reference AN0010 syfer 1206 TYPES OF CAPACITORS testing PDF

    CPA0612-FS

    Abstract: FR4 epoxy glass 1.6mm substrate FR4 substrate 1.6mm
    Text: CP02M581.04 Rev J - Page 1 of 4 Product Family: Current Sensing Power Resistor Part Number Series: CPA0612 Series Construction: Features: •       High purity alumina substrate Nickel alloy thin-film resistive element


    Original     		CP02M581 CPA0612 Sn100, CPA0612-FS FR4 epoxy glass 1.6mm substrate FR4 substrate 1.6mm PDF

    2000PCS

    Abstract: APT1608SURCK-AMT
    Text: 1.6X0.8mm SMD CHIP LED LAMP Part Number: APT1608SURCK-AMT Hyper Red Description Features z High reliability LED package. z 1.6mmx0.8mm SMT LED,0.75mm thickness z Low power consumption. The Hyper Red source color devices are made with AlGaInP on GaAs substrate Light Emitting Diode.


    Original     		APT1608SURCK-AMT 2000pcs ED4701/100 DSAI6420 JAN/07/2012 PDF