Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 518-77-NNNMXX-XXX106 PGA 1.27 mm grid socket, Surface mount SERIES 518 Micro pin grid array sockets µPGA , with contacts placed on 1.27 mm grid, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability
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518-77-NNNMXX-XXX106
CuZn36Pb3
C36000)
C17200)
CH-2800
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 558-10-NNNMXX-XXX101 PGA 1.27 mm grid, Interconnect pin solder tail SERIES 558 Micro pin grid array sockets µPGA , with contacts placed on 1.27 mm grid, interconnect pin. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability
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558-10-NNNMXX-XXX101
CuZn36Pb3
C36000)
26x26
CH-2800
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 550-10-NNNMXX-XXX152 BGA 1.27 mm grid, Interconnect pin solder tail SERIES 550 Interconnect pin, through hole solder tail TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life
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550-10-NNNMXX-XXX152
CuZn36Pb3
C36000)
20x20
550-10-256M20-001152.
CH-2800
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TRANSISTOR C 608
Abstract: f AG19 610-AG22 FR4 GLASS EPOXY 608-AG21 AG10 TRANSISTOR CATALOGUE AG21 AG19
Text: Data downloaded from http://www.anglia.com - the website of Anglia - tel: 01945 474747 Catalogue 1654741 Adapters Revised 1-04 Transistor Adapter Plugs 600-AG Series 608-AG22 FEATURES: PERFORMANCE SPECIFICATIONS: The 600-AG family of FR4 glass epoxy machined pin adaptors, converts
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600-AG
608-AG22
610-AG19
610-AG22
TRANSISTOR C 608
f AG19
610-AG22
FR4 GLASS EPOXY
608-AG21
AG10
TRANSISTOR CATALOGUE
AG21
AG19
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 558-10-NNNMXX-XXX104 BGA 1.27 mm grid, Interconnect pin surface mount SERIES 558 Interconnect pin, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life
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558-10-NNNMXX-XXX104
CuZn36Pb3
C36000)
20x20
550-10-256M20-001152.
CH-2800
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 518-77-NNNMXX-XXX105 PGA 1.27 mm grid socket, Solder tail SERIES 518 Micro pin grid array sockets µPGA , with contacts placed on 1.27 mm grid, solder tail. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-O
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518-77-NNNMXX-XXX105
CuZn36Pb3
C36000)
C17200)
CH-2800
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 550-10-NNNMXX-XXX166 BGA 1.27 mm grid, BGA pin-adapter, SMD SERIES 550 Ball grid array adapters, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 New attribute UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life
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550-10-NNNMXX-XXX166
CuZn36Pb3
C36000)
20x20
514-83-256M20-001148.
CH-2800
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 514-PP-NNNMXX-XXX148 BGA 1.27 mm grid socket, Surface mount SERIES 514 Ball grid array sockets, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-0 Sleeve Brass CuZn36Pb3 C36000 Contact Beryllium copper (C17200)
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514-PP-NNNMXX-XXX148
CuZn36Pb3
C36000)
C17200)
CH-2800
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Preci-Dip
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 514-PP-NNNMXX-XXX148 BGA 1.27 mm grid socket, Surface mount SERIES 514 Ball grid array sockets, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-0 Sleeve Brass CuZn36Pb3 C36000 Contact Beryllium copper (C17200)
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514-PP-NNNMXX-XXX148
CuZn36Pb3
C36000)
C17200)
20x20
CH-2800
Preci-Dip
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loss tangent of FR4
Abstract: No abstract text available
Text: Plain Copper Clad Boards 500 Series Product Description We offer 1/16", 1/32" and 1/64" FR4 laminate with 1 ounce copper per square foot. This flame retardant laminate is translucent in color and made of continuous woven glass cloth impregnated with epoxy resin. The copper on 1
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E214381
E213990)
loss tangent of FR4
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FR4 epoxy dielectric constant 4.4
Abstract: loss tangent of FR4
Text: Copper Clad Boards 500 Series We offer 1/16", 1/32" and 1/64" FR4 laminate with 1 ounce copper per square foot. This flame retardant laminate is translucent in color and made of continuou woven glass cloth impregnated with epoxy resin. The copper on 1 ounce boards is 1.34mil thick 0.0341mm
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34mil
0341mm
E214381
E213990)
FR4 epoxy dielectric constant 4.4
loss tangent of FR4
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FR4 epoxy dielectric constant 4.4
Abstract: FR4 substrate epoxy dielectric constant 4.4 Rogers 4350B Nelco 4000-13 FR4 epoxy dielectric constant 3.2 FR4 substrate with dielectric constant 4.4 Rogers 4350B substrate Nelco-4000 FR4 substrate fiberglass n6000-21-si
Text: PCB Dielectric Material Selection and Fiber Weave Effect on High-Speed Channel Routing Application Note 528 May 2008, v1.0 Introduction As data rates increase, designers are increasingly moving away from wide parallel buses to serial buses with differential signaling. Differential
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Nelco 4000-13
Abstract: Nelco 4000-6
Text: PCB Dielectric Material Selection and Fiber Weave Effect on High-Speed Channel Routing AN-528-1.1 Application Note As data rates increase, designers are increasingly moving away from wide parallel buses to serial buses with differential signaling. Differential signaling uses two output
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AN-528-1
Nelco 4000-13
Nelco 4000-6
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DOD-A-82720
Abstract: FR4 epoxy dielectric constant 4.2 DP-190 DP-100 Plus DP270 DP460 DP-420 3M DP100
Text: 0362220 Epoxy-Hotmelt 3/30/04 11:29 AM Page 1 High-performance adhesives for demanding electronics applications. With the ever-increasing sophistication of electronics, you need the most dependable and versatile methods for their fabrication and assembly. 3M Scotch-Weld epoxies and Jet-melt
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DP-100
DP-125
DP-190
DP-270
DP-420
DP-460
DOD-A-82720
FR4 epoxy dielectric constant 4.2
DP-100 Plus
DP270
DP460
3M DP100
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tip 35c circuit
Abstract: DA108S1 LCP1511D TLP140M TLP200M TLP270M schematic diagram "induction heating"
Text: TLPxxM Series Application Specific Discretes A.S.D. TRIPOLAR OVERVOLTAGE PROTECTION for TELECOM LINE MAIN APPLICATIONS Any sensitive telecom equipment requiring protection against lightning : Analog and ISDN line cards Main Distribution Frames Set-top boxes
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PowerSO-10TM
tip 35c circuit
DA108S1
LCP1511D
TLP140M
TLP200M
TLP270M
schematic diagram "induction heating"
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FR4 1.6mm substrate
Abstract: Thermagon t-lam CLD-AP25 Fabrication process steps mcpcb FR-4 substrate 1.6mm NEMA FR-4 led mcpcb large copper trace thermal Thermagon pcb fabrication process kapton
Text: Optimizing PCB Thermal Performance for Cree XLamp® LEDs Table of Contents 1. Introduction. 2 2. Thermal Management Principles. 2
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CLD-AP37
FR4 1.6mm substrate
Thermagon t-lam
CLD-AP25
Fabrication process steps mcpcb
FR-4 substrate 1.6mm
NEMA FR-4
led mcpcb large copper trace thermal
Thermagon
pcb fabrication process
kapton
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schaffner heatsink
Abstract: No abstract text available
Text: RBO40-40M REVERSEDBATTERYAND Application Specific Discretes A.S.D.TM OVERVOLTAGEPROTECTIONCIRCUIT RBO FEATURES PROTECTION AGAINST ”LOAD DUMP” PULSE 40A DIODE TO GUARD AGAINST BATTERY REVERSAL MONOLITHIC STRUCTURE FOR GREATER RELIABILITY BREAKDOWN VOLTAGE : 24 V min.
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RBO40-40M
PowerSO-10TM
schaffner heatsink
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st microelectronics powerso-10 marking
Abstract: TLPxxG DA108S1 LCP1511D TLP140M VDE0433 VDE0878 B1000-5
Text: TLPxxM/G/G-1 TRIPOLAR OVERVOLTAGE PROTECTION for TELECOM LINE Application Specific Discretes A.S.D. MAIN APPLICATIONS Any sensitive telecom equipment requiring protection against lightning : Analog and ISDN line cards Main Distribution Frames GND TIP
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PowerSO-10TM
st microelectronics powerso-10 marking
TLPxxG
DA108S1
LCP1511D
TLP140M
VDE0433
VDE0878
B1000-5
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RBO08-40G
Abstract: RBO08-40T RBO08-40M VF13 aluminium plane heatsink
Text: RBO08-40G/M/T REVERSED BATTERY AND Application Specific Discretes A.S.D.TM OVERVOLTAGE PROTECTION CIRCUIT RBO FEATURES 8A DIODE TO GUARD AGAINST BATTERY REVERSAL. NEGATIVE OVERVOLTAGE PROTECTION BY CLAMPING. COMPLIANT WITH ISO/DTR 7637 STANDARD FOR PULSES 1, 2, 3a and 3b.
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RBO08-40G/M/T
RBO08-40G
PowerSO-10TM
RBO08-40M
RBO08-40G
RBO08-40T
RBO08-40M
VF13
aluminium plane heatsink
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tip 149
Abstract: SO10 package st microelectronics powerso-10 st microelectronics powerso-10 marking tip 143 DA108S1 LCP1511D TLP140M VDE0433 VDE0878
Text: TLPxxM/G/G-1 TRIPOLAR OVERVOLTAGE PROTECTION for TELECOM LINE Application Specific Discretes A.S.D. MAIN APPLICATIONS Any sensitive telecom equipment requiring protection against lightning : Analog and ISDN line cards Main Distribution Frames GND TIP
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PowerSO-10TM
tip 149
SO10 package
st microelectronics powerso-10
st microelectronics powerso-10 marking
tip 143
DA108S1
LCP1511D
TLP140M
VDE0433
VDE0878
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diode ir31
Abstract: TRANSIL RBO08-40G transil diode equivalent transistor marking code SGs IR31 RBO08-40M RBO08-40T VF13
Text: RBO08-40G/M/T REVERSEDBATTERYAND Application Specific Discretes A.S.D.TM OVERVOLTAGEPROTECTIONCIRCUIT RBO FEATURES 8A DIODE TO GUARD AGAINST BATTERY REVERSAL. NEGATIVE OVERVOLTAGE PROTECTION BY CLAMPING. COMPLIANT WITH ISO/DTR 7637 STANDARD FOR PULSES 1, 2, 3a and 3b.
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RBO08-40G/M/T
RBO08-40G
PowerSO-10TM
RBO08-40M
diode ir31
TRANSIL
RBO08-40G
transil diode equivalent
transistor marking code SGs
IR31
RBO08-40M
RBO08-40T
VF13
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Untitled
Abstract: No abstract text available
Text: 3 Bonding Film AF111 for Electronics Applications Technical Data Product Description March, 2004 3M Bonding Film AF111 is an epoxy, thermoset film adhesive developed for structural bonding of metals and high-strength plastic materials epoxy and phenolic .
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AF111
AF111
1-1W-10,
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Untitled
Abstract: No abstract text available
Text: Epoxy glass cloth base laminated FR4 5.10 RATING ,5 .9 0 ^ °10 DATE CODE EPOXY SEAL « mm CO a d a d co MM MM TT TT 0.76+.o.oo 0.76+gi1 - 0.00 5.08 10.16 14.35 P.C. MOUNTING 6 .0 5 _ ▲ ID csi SWITCH FUNCTION + 3 POS. 1 T2 Model No. 1 01.09 & POS. 2 4
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OCR Scan
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20mOhm
UL94V-0)
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Untitled
Abstract: No abstract text available
Text: A I V I F * Catalog 1307612 Adapters Revised 7-01 T ran s isto r A d ap ter Plugs 600-AG Series 608-AG22 FEATURES: PERFORMANCE SPECIFICATIONS: The 600-AG family of FR4 glass epoxy machined pin adaptors, converts standard 6 thru 10 lead round style transistor packages to standard 14 and
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600-AG
608-AG22
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