OP35
Abstract: No abstract text available
Text: FEATURES DC to 4.25 Gbps per port NRZ data rate Adjustable receive equalization 3 dB, 6 dB, or 12 dB boost Compensates over 40 inches of FR4 at 4.25 Gbps Adjustable transmit preemphasis/deemphasis Programmable boost and output level Compensates over 40 inches of FR4 at 4.25 Gbps
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8b10b,
352-Ball
22206-A
BP-352
ADN4605
D09796-0-11/11
OP35
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Untitled
Abstract: No abstract text available
Text: FEATURES DC to 4.25 Gbps per port NRZ data rate Adjustable receive equalization 3 dB, 6 dB, or 12 dB boost Compensates over 40 inches of FR4 at 4.25 Gbps Adjustable transmit preemphasis/deemphasis Programmable boost and output level Compensates over 40 inches of FR4 at 4.25 Gbps
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8b10b,
ADN4605ABPZ
ADN4605-EVALZ
352-Ball
BP-352
ADN4605
D09796-0-11/11
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XEB72353
Abstract: XFP EVALUATION BOARD RD006 Mod Jp1 DS3900 OC192 10GHz serializer HFRD DS1868 NC7WZ04P6X
Text: Reference Design: HFRD-06.0 Rev. 3; 11/08 REFERENCE DESIGN FR4 XFP Host Board Maxim Integrated Products Reference Design: XFP Host Board Table of Contents Overview . 2 Obtaining Additional Information . 2
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HFRD-06
DS3900
XEB72353
XFP EVALUATION BOARD
RD006
Mod Jp1
OC192
10GHz serializer
HFRD
DS1868
NC7WZ04P6X
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1210 case
Abstract: MC08FA101J-F MC08FA680J-F MC08FA750J-F MC08FA820J-F MC08FA910J-F MC12FA470J-F
Text: Types MC and MCN Multilayer RF Capacitors High-Frequency, High-Power Chips and New Nonmagnetic Option. Rugged flexibility and compatibility with FR4 boards make Type MC and MCN capacitors ideal for use where other larger size multilayer caps aren’t recommended. The natural mica dielectric
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MC18
Abstract: No abstract text available
Text: Types MC and MCN Multilayer RF Capacitors High-Frequency, High-Power Chips and New Nonmagnetic Option. Rugged flexibility and compatibility with FR4 boards make Type MC and MCN capacitors ideal for use where other larger size multilayer caps aren’t recommended. The natural mica dielectric
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capacitor 560 pF 500V
Abstract: No abstract text available
Text: Types MC and MCN Multilayer RF Capacitors High-Frequency, High-Power Chips and New Nonmagnetic Option. Rugged flexibility and compatibility with FR4 boards make Type MC and MCN capacitors ideal for use where other larger size multilayer caps aren’t recommended. The natural mica dielectric
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Untitled
Abstract: No abstract text available
Text: TECHNICAL DATA SHEET 1/2 R223.990.000 MMBX DEMONSTRATION PCB Series : MMBX SMT TYPE RECEPTACLE All dimensions are in mm. . pn . ao COMPONENTS BODY CENTER CONTACT OUTER CONTACT INSULATOR GASKET OTHERS PARTS - PLATING µm MATERIALS FR4 - - - Issue : 0736 B
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Untitled
Abstract: No abstract text available
Text: TECHNICAL DATA SHEET 1/2 MMBX DEMONSTRATION PCB R223.991.000 SMT TYPE PLUG RECEPTACLE Series : MMBX All dimensions are in mm. . pn . ao COMPONENTS BODY CENTER CONTACT OUTER CONTACT INSULATOR GASKET OTHERS PARTS - PLATING µm MATERIALS FR4 - - Issue : 0736 B
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PS5570
Abstract: MAX3803 MAX3803UBP-T
Text: 19-2699; Rev 1; 6/04 DC-Coupled, UCSP 3.125Gbps Equalizer The MAX3803 equalizer automatically provides compensation for transmission-medium losses encountered with FR4 stripline and cable in an incredibly small 2mm x 2.5mm package. It is ideal for backplane applications
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125Gbps
MAX3803
160mW
MAX3803
PS5570
MAX3803UBP-T
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 518-77-NNNMXX-XXX106 PGA 1.27 mm grid socket, Surface mount SERIES 518 Micro pin grid array sockets µPGA , with contacts placed on 1.27 mm grid, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability
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518-77-NNNMXX-XXX106
CuZn36Pb3
C36000)
C17200)
CH-2800
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TRANSISTOR C 608
Abstract: f AG19 610-AG22 FR4 GLASS EPOXY 608-AG21 AG10 TRANSISTOR CATALOGUE AG21 AG19
Text: Data downloaded from http://www.anglia.com - the website of Anglia - tel: 01945 474747 Catalogue 1654741 Adapters Revised 1-04 Transistor Adapter Plugs 600-AG Series 608-AG22 FEATURES: PERFORMANCE SPECIFICATIONS: The 600-AG family of FR4 glass epoxy machined pin adaptors, converts
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600-AG
608-AG22
610-AG19
610-AG22
TRANSISTOR C 608
f AG19
610-AG22
FR4 GLASS EPOXY
608-AG21
AG10
TRANSISTOR CATALOGUE
AG21
AG19
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Untitled
Abstract: No abstract text available
Text: TG-CPCB3-LI98-0.15 Ceramic PCB with thermally conductive adhesive tape Features Patterned according to standard LED configurations Supplied with thermally conductive adhesive tape for ease of mounting Superior thermal management compared to FR4 and IMPCB Reduced cost of ownership
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TG-CPCB3-LI98-0
Al203
D5470
50psi
1000g
D3330
D1002
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PRBS7
Abstract: AN1473 DS40MB200 DS42BR400 DS42MB100 AN1541 an-1541 national
Text: National Semiconductor Application Note 1541 Leo Chang December 2006 TABLE 1. XAUI Jitter Budget Allowances. 1.0 Introduction This paper demonstrates how National Semiconductor’s DS42MB100, DS40MB200, and DS42BR400 equalize XAUI backplane FR4 traces and reduce data dependent jitter to
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DS42MB100,
DS40MB200,
DS42BR400
AN-1541
PRBS7
AN1473
DS40MB200
DS42MB100
AN1541
an-1541 national
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 558-10-NNNMXX-XXX101 PGA 1.27 mm grid, Interconnect pin solder tail SERIES 558 Micro pin grid array sockets µPGA , with contacts placed on 1.27 mm grid, interconnect pin. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability
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558-10-NNNMXX-XXX101
CuZn36Pb3
C36000)
26x26
CH-2800
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Untitled
Abstract: No abstract text available
Text: TG-CPCB1-LI98-0.15 Ceramic PCB with thermally conductive adhesive tape Features Patterned according to standard LED configurations Supplied with thermally conductive adhesive tape for ease of mounting Superior thermal management compared to FR4 and IMPCB Reduced cost of ownership
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TG-CPCB1-LI98-0
Al203
D5470
50psi
1000g
D3330
D1002
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Untitled
Abstract: No abstract text available
Text: TG-CPCB2-LI98-0.15 Ceramic PCB with thermally conductive adhesive tape Features Patterned according to standard LED configurations Supplied with thermally conductive adhesive tape for ease of mounting Superior thermal management compared to FR4 and IMPCB Reduced cost of ownership
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TG-CPCB2-LI98-0
Al203
D5470
50psi
1000g
D3330
D1002
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 558-10-NNNMXX-XXX104 BGA 1.27 mm grid, Interconnect pin surface mount SERIES 558 Interconnect pin, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life
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558-10-NNNMXX-XXX104
CuZn36Pb3
C36000)
20x20
550-10-256M20-001152.
CH-2800
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transistor a226
Abstract: A226 transistor PHILIPS capacitors 0402 GJM1555C1H5R6CB01 0402 footprint balun sma GRM1555C1H4R7CB01 ATR2406-DEV-BOARD ATR2406-DEV-KIT 1p5 sot 23
Text: Features • Close to production PCB-Layout • Small Footprint FR4 2-Layer Module • Integrated Antenna & SMA-Antenna Connector • Printed Transmit/Receive Filters • Few Low Cost External Components • High Receiver Sensitivity of up to –91 dBm at Antenna-Port
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STK500
ATR2406-DEV-BOARD
ATR2406-DEV-BOARD
7-Sep-04
transistor a226
A226 transistor
PHILIPS capacitors 0402
GJM1555C1H5R6CB01
0402 footprint
balun sma
GRM1555C1H4R7CB01
ATR2406-DEV-KIT
1p5 sot 23
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c105m
Abstract: No abstract text available
Text: Low Inductance Chip Capacitors InterDigitated Capacitor IDC GENERAL DESCRIPTION + - + + - - AVX’s interdigitated capacitor is a very low inductance, surface mount capacitor. A measured inductance of 175pH makes this the lowest, FR4 mountable device in the industry. With the high speed microprocessors approaching
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175pH
500MHz,
c105m
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analog multimeter
Abstract: Metrawatt AN948 APP948 HP16500C MAX101A MAX101AEVKIT MAX104
Text: Maxim > App Notes > A/D and D/A CONVERSION/SAMPLING CIRCUITS HIGH-SPEED SIGNAL PROCESSING Keywords: data acquisition system, analog to digital converter, ADC, flash, time-interleaved quantizer, ECL-toTTL level shifters, ECL termination, FR4, FIFO, memory, flip-flop, register, FPGA, RAM
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MAX101A.
MAX101A
com/an948
MAX101A:
MAX101AEVKit:
AN948,
APP948,
Appnote948,
analog multimeter
Metrawatt
AN948
APP948
HP16500C
MAX101AEVKIT
MAX104
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 550-10-NNNMXX-XXX166 BGA 1.27 mm grid, BGA pin-adapter, SMD SERIES 550 Ball grid array adapters, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 New attribute UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life
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550-10-NNNMXX-XXX166
CuZn36Pb3
C36000)
20x20
514-83-256M20-001148.
CH-2800
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 514-PP-NNNMXX-XXX148 BGA 1.27 mm grid socket, Surface mount SERIES 514 Ball grid array sockets, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-0 Sleeve Brass CuZn36Pb3 C36000 Contact Beryllium copper (C17200)
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514-PP-NNNMXX-XXX148
CuZn36Pb3
C36000)
C17200)
CH-2800
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Preci-Dip
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 514-PP-NNNMXX-XXX148 BGA 1.27 mm grid socket, Surface mount SERIES 514 Ball grid array sockets, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-0 Sleeve Brass CuZn36Pb3 C36000 Contact Beryllium copper (C17200)
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514-PP-NNNMXX-XXX148
CuZn36Pb3
C36000)
C17200)
20x20
CH-2800
Preci-Dip
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TB342
Abstract: 10n5 n20 n10 C814 TB-342
Text: valuation Board and Circuit N13 EMPTY N14 (EMPTY) TB-342 NOTES: 1. SMA FEMALE 2. PCB MATERIAL: DWG NO: THIS DOCUMENT CONNECTORS. FR4 GRADE IT -1 8 0 T C (ITEQ DIELECTRIC C 0N STAN T=4.7, DIELECTRIC THICKNESS = .0 2 5 CORPORATION) EQUIVALENT, INCH. W TB-342
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TB-342
IT-180TC
WTB-342
TB342
10n5
n20 n10
C814
TB-342
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