fr4 94v0
Abstract: 12X12 nema 23 NEMA FR-4
Text: Vectorbord: 12X12WE Home Page 1 of 1 About Vector Distributors Sales Contact Us Vectorbord Part Number : 12X12WE 12.0" W x 12.0 " L .No Holes.FR-4 Epoxy Glass .UNCLAD PCB SHEET MATERIAL Dimension 12" X 12" Square Sheets of FR-4 PCB laminate with NO COPPER
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Original
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12X12WE
P13949
com/Product/Vectorbord/12X12WE
fr4 94v0
12X12
nema 23
NEMA FR-4
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PDF
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Untitled
Abstract: No abstract text available
Text: Single Row Right Angle Board to Board Connectors Board to Board Connectors .100/ 2.54mm Pitch • Molded Insulators Female Table of Models Description: FR-4 Single Row (FLSS) Material: FR-4 Fiberglass Epoxy Board Index: -40°C to 140°C (-40°F to 284°F)
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Original
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FLSSXXX-160XX
FLSAXX-290
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PDF
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Untitled
Abstract: No abstract text available
Text: Single Row Right Angle Board to Board Connectors Board to Board Connectors .100/ 2.54mm Pitch • Molded Insulators Female Table of Models Description: FR-4 Single Row (FLSS) Material: FR-4 Fiberglass Epoxy Board Index: -40°C to 140°C (-40°F to 284°F)
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Original
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FLSSXXX-160XX
FLSAXXX-159X
QQ-N-290
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PDF
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pcb terminals 2.54
Abstract: ASTM545-97 ASTM-B-488 C17200 284F
Text: Single Row Right Angle Board to Board Connectors Board to Board Connectors .100/ 2.54mm Pitch • Molded Insulators Female Table of Models Description: FR-4 Single Row (FLSS) Material: FR-4 Fiberglass Epoxy Board Index: -40°C to 140°C (-40°F to 284°F)
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Original
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FLSSXXX-160XX
MIL-P-81728
QQ-N-290
pcb terminals 2.54
ASTM545-97
ASTM-B-488
C17200
284F
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PDF
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C17200
Abstract: ASTM-B488
Text: Single Row Right Angle Board to Board Connectors Board to Board Connectors .100/ 2.54mm Pitch • Molded Insulators Female Table of Models Description: FR-4 Single Row (FLSS) Material: FR-4 Fiberglass Epoxy Board Index: -40°C to 140°C (-40°F to 284°F)
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Original
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FLSSXXX-160XX
FLSAXX-290
C17200
ASTM-B488
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PDF
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ASTM545-97
Abstract: ASTM-B-488 C17200
Text: ? ? Low Insertion Force PGA Sockets PGA Sockets .100/ 2.54mm Standard Grid Table of Models Description: Peel-A-Way (KIS) Material: Polyimide Film Index: -269°C to 400°C (-452°F to 752°F) .005 (.13) Description: FR-4 (FIS) Material: FR-4 Fiberglass Epoxy Board
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Original
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PDF
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Untitled
Abstract: No abstract text available
Text: ? ? Low Insertion Force PGA Sockets PGA Sockets .100/ 2.54mm Standard Grid Table of Models Description: Peel-A-Way (KIS) Material: Polyimide Film Index: -269°C to 400°C (-452°F to 752°F) .005 (.13) Description: FR-4 (FIS) Material: FR-4 Fiberglass Epoxy Board
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Original
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PDF
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Untitled
Abstract: No abstract text available
Text: ? ? Low Insertion Force PGA Sockets PGA Sockets .100/ 2.54mm Standard Grid Table of Models Description: Peel-A-Way (KIS) Material: Polyimide Film Index: -269°C to 400°C (-452°F to 752°F) .005 (.13) Description: FR-4 (FIS) Material: FR-4 Fiberglass Epoxy Board
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PDF
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Untitled
Abstract: No abstract text available
Text: RECTRON MMSZ5221BSMMSZ5260BS SEMICONDUCTOR TECHNICAL SPECIFICATION SURFACE MOUNT ZENER DIODE VOLTAGE RANGE 2.4 to 43 Volts POWER RATING 200 mWatts FEATURES * * * * Planar Die Constrruction 200mW Power Dissipation on FR-4 PCB Gemera purpose, Medium Current
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Original
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MMSZ5221BSMMSZ5260BS
200mW
OD-323
MIL-STD-202E
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PDF
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Untitled
Abstract: No abstract text available
Text: RECTRON MMSZ5221BSMMSZ5260BS SEMICONDUCTOR TECHNICAL SPECIFICATION SURFACE MOUNT ZENER DIODE VOLTAGE RANGE 2.4 to 43 Volts POWER RATING 200 mWatts FEATURES * * * * Planar Die Constrruction 200mW Power Dissipation on FR-4 PCB Gemera purpose, Medium Current
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Original
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MMSZ5221BSMMSZ5260BS
200mW
OD-323
MIL-STD-202E
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PDF
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ASTM-B16-85
Abstract: No abstract text available
Text: 1110319 REPLACE SIERRA SC11310CN WITH MICROLINEAR ML2009CP FEATURES: • Allows drop in replacement of obsolete chip. SPECIFICATIONS: •Female socket material is black UL 94V-0 Glass-filled 4./ Nylon 170°C continuous use temp. • PCB is FR-4,.062 [1.56] or .094 [2.39] thick.
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Original
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SC11310CN
ML2009CP
C36000
ASTM-B16-85.
MIL-P-81728
QQ-N-290.
C17200
ASTM-B194-92.
MIL-G-45204
ASTM-B16-85
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PDF
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SC11310CN
Abstract: No abstract text available
Text: 1110319 REPLACE SIERRA SC11310CN WITH MICROLINEAR ML2009CP FEATURES: • Allows drop in replacement of obsolete chip. SPECIFICATIONS: •Female socket material is black UL 94V-0 Glass-filled 4./ Nylon 170°C continuous use temp. • PCB is FR-4,.062 [1.56] or .094 [2.39] thick.
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Original
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SC11310CN
ML2009CP
C36000
ASTM-B16-85.
MIL-P-81728
QQ-N-290.
C17200
ASTM-B194-92.
MIL-G-45204
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PDF
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MMSZ5223BS
Abstract: MMSZ5225BS MMSZ5226BS MMSZ5227BS MMSZ5228BS MMSZ5229BS MMSZ5230BS
Text: MMSZ5223BSMMSZ5259BS SURFACE MOUNT ZENER DIODE VOLTAGE RANGE 2.7 to 39 Volts POWER RATING 200 mWatts FEATURES * * * * Planar Die Constrruction 200mW Power Dissipation on FR-4 PCB Gemera purpose, Medium Current Ldeally Suited for Automated Assembly SOD-323
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Original
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MMSZ5223BSMMSZ5259BS
200mW
OD-323
MIL-STD-202E
MMSZ5223BS
MMSZ5225BS
MMSZ5226BS
MMSZ5227BS
MMSZ5228BS
MMSZ5229BS
MMSZ5230BS
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PDF
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Untitled
Abstract: No abstract text available
Text: JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD SOT-323 Plastic-Encapsulate Diode MMBZ5221BW-MMBZ5259BW ZENER DIODE SOT-323 FEATURES Planar Die Construction 200mW Power Dissipation on FR-4 PCB General purpose, Medium Current Ideally Suited for Automated Assembly
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Original
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OT-323
MMBZ5221BW-MMBZ5259BW
OT-323
200mW
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PDF
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Untitled
Abstract: No abstract text available
Text: 1111903 24Pin SOWIC IC to 22Pin .4 CTR DIP Adapter for 75ALS162 and other IC’s FEATURES: • A cost effective means of upgrading to SOIC without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides.
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Original
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24Pin
22Pin
75ALS162
C36000
ASTM-B-16-85.
MIL-T-10727
MIL-P-81728
QQ-N-290.
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PDF
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Untitled
Abstract: No abstract text available
Text: MMSZ5223BSMMSZ5259BS SURFACE MOUNT ZENER DIODE VOLTAGE RANGE 2.7 to 39 Volts POWER RATING 200 mWatts FEATURES * * * * Planar Die Constrruction 200mW Power Dissipation on FR-4 PCB Gemera purpose, Medium Current Ldeally Suited for Automated Assembly SOD-323
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Original
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MMSZ5223BSMMSZ5259BS
200mW
OD-323
MIL-STD-202E
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PDF
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75als162
Abstract: QQN-290
Text: 1111903 24Pin SOWIC IC to 22Pin .4 CTR DIP Adapter for 75ALS162 and other IC’s FEATURES: • A cost effective means of upgrading to SOIC without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides.
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Original
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24Pin
22Pin
75ALS162
C36000
ASTM-B-16-85.
MIL-P-81728
QQN-290.
QQN-290
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PDF
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taitien packing
Abstract: taitien
Text: RoHS Compliant Standard VK Type Voltage Controlled Crystal Oscillator FEATURE 1. 2. 3. 4. 5. Typical 14.3 x 8.7 × 6.0 mm SMD. Metal cover, FR-4 PCB Based. Output: TTL/CMOS. Pulling Range +/-400ppm available. only for VDD= 5.0V Packing: Tape & Reel, 500 pcs per Reel.
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Original
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/-400ppm
8010TTL
100ppm
XO-0042-8
taitien packing
taitien
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PDF
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SAE 0700
Abstract: sae 0800 Brass 360 B194-08
Text: Series 354000 DIP-to-SOIC Adapter FEATURES • Convenient, cost-effective means of converting DIP-to-SOIC PC board layouts. GENERAL SPECIFICATIONS • SOCKET BODY: black, UL 94V-0 glass-filled 4/6 Nylon 170°C continuous use temp • PCB: FR-4, 0.062 [1.58] thick
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Original
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C36000,
B16/B16M
B579-73
AMS-QQ-N-290
MIL-G-45204
C17200,
B194-08
SAE 0700
sae 0800
Brass 360
B194-08
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PDF
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75als162
Abstract: OZ 9966 18071
Text: 1111903 24Pin SOWIC IC to 22Pin .4 CTR DIP Adapter for 75ALS162 and other IC’s FEATURES: • A cost effective means of upgrading to SOIC without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides.
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Original
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24Pin
22Pin
75ALS162
C36000
ASTM-B-16-85.
MIL-T-10727
MIL-P-81728
QQ-N-290.
OZ 9966
18071
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PDF
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18009
Abstract: DIP-to-SOIC Adapter SAE 0700
Text: Series 354000 DIP-to-SOIC Adapter FEATURES • Convenient, cost-effective means of converting DIP-to-SOIC PC board layouts. GENERAL SPECIFICATIONS • SOCKET BODY: black, UL 94V-0 glass-filled 4/6 Nylon 170°C continuous use temp • PCB: FR-4, 0.062 [1.58] thick
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Original
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C36000,
B16/B16M
B579-73
AMS-QQ-N-290
MIL-G-45204
C17200,
B194-08
18009
DIP-to-SOIC Adapter
SAE 0700
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PDF
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Untitled
Abstract: No abstract text available
Text: 1111903 24Pin SOWIC IC to 22Pin .4 CTR DIP Adapter for 75ALS162 and other IC’s FEATURES: • A cost effective means of upgrading to SOIC without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides.
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Original
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24Pin
22Pin
75ALS162
C36000
ASTM-B-16-85.
MIL-T-10727
MIL-P-81728
QQ-N-290.
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PDF
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1.5mm pin Header
Abstract: No abstract text available
Text: BB02-FR BB02-FR:- CUSTOMER PRODUCT SPECIFICATION SHEET 2.00MM PITCH S UR FAC E MOUNT PIN HEADER, 4 TO 80 CONTACTS FEATURES CUSTOM PIN LENGTH, GOLD OR TIN PLATED. LOW PROFILE FROM 1.50mm SPECIFICATIONS CURRENT RATING INSULATOR RESISTANCE DIELECTRIC WITHSTANDING
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OCR Scan
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BB02-FR
BB02-FR
CONTACTS-04
BB02-GB
BB02-GC
BB02-GF
BB02-GG
BB02-GH
BB02-GJ
BB02-GK
1.5mm pin Header
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PDF
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Untitled
Abstract: No abstract text available
Text: D1R FR D006 REVISION RECORD * 3 .2 8 ± 0 .5 1 M 5 .8 REV A A 6 .3 5 M 6 .3 * 1 3 .4 * 1 .2 7 -OPTION DRFT Drawinq Modify Drawing Modify CHKD sam m y 0 4 /2 6 /0 5 JAMYTN 1 2 /1 4 /0 5 CN Ò FRÊ6 -H 05 00 □d * * 1.02 *2 .9 2 NOTES: ELECTRICAL: 1. VOLTAGE RATING: 125 VAC RMS MIN.
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OCR Scan
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LOGO01-
GE523011--LA
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PDF
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