marking j9 sot-23
Abstract: No abstract text available
Text: BZX84C Series Zener Voltage Regulators SOT-23 1 1.02 0.89 2.04 1.78 225 mW Rating on FR-4 or FR-5 Board Zener Breakdown Voltage Range 2.4 V to 75 V Package Designed for Optimal Automated Board Assembly Small Package Size for High Density Applications
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BZX84C
OT-23
OT-23
BZX84C27
BZX84C30
BZX84C33
BZX84C36
BZX84C39
BZX84C43
BZX84C47
marking j9 sot-23
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3M DP100
Abstract: Oakite E61941
Text: 3 Scotch-Weld TM Epoxy Adhesive DP100 FR Technical Data July, 2011 Product Description 3M Scotch-Weld™ Epoxy Adhesive DP100 FR is a two-part flame retardant self-extinguishing version of Scotch-Weld DP100. It meets the UL94 V-O Burn Test requirements and has a work life of 4-8 minutes after mixing. It is ideal for
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DP100
DP100.
E61941)
225-3S-06
3M DP100
Oakite
E61941
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IDT7MB4048
Abstract: 2675 7MB4048
Text: IDT7MB4048 512K x 8 CMOS STATIC RAM MODULE Integrated Device Technology, Inc. FEATURES: DESCRIPTION: • High-density 4-megabit 512K x 8 Static RAM module • Fast access time: 25ns (max.) Surface mounted plastic packages on a 32-pin, 600 mil FR-4 DIP substrate
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IDT7MB4048
32-pin,
IDT7MB4048
32-pin
7MB4048
2675
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DP100
Abstract: 1876-61T Oakite 3M DP100 oils bulk modulus DP100FR ASTM D 2240 800-362
Text: 3 Scotch-Weld TM Epoxy Adhesive DP100 FR Technical Data July, 2011 Product Description 3M Scotch-Weld™ Epoxy Adhesive DP100 FR is a two-part flame retardant self-extinguishing version of Scotch-Weld DP100. It meets the UL94 V-O Burn Test requirements and has a work life of 4-8 minutes after mixing. It is ideal for
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DP100
DP100.
E61941)
225-3S-06
517-DP100FR
DP100FR
1876-61T
Oakite
3M DP100
oils bulk modulus
DP100FR
ASTM D 2240
800-362
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IDT7MB4048
Abstract: 7MB4048
Text: IDT7MB4048 512K x 8 CMOS STATIC RAM MODULE Integrated Device Technology, Inc. FEATURES: DESCRIPTION: • High-density 4-megabit 512K x 8 Static RAM module • Fast access time: 25ns (max.) Surface mounted plastic packages on a 32-pin, 600 mil FR-4 DIP substrate
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IDT7MB4048
32-pin,
IDT7MB4048
32-pin
7MB4048
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Untitled
Abstract: No abstract text available
Text: 4 Megabit CMOS SRAM DPS128X32XP/XHP DESCRIPTION: The DPS128X32XP/XHP is a 68-pin surface mount module consisting of four 128K x 8 SRAM devices in plastic TSOP packages surface mounted on a FR-4 substrate. The module is available with either “J”-Leads or
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DPS128X32XP/XHP
DPS128X32XP/XHP
68-pin
I/O31
30A16700
30A167-00
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2675
Abstract: IDT7MB4048 7MB4048
Text: IDT7MB4048 512K x 8 CMOS STATIC RAM MODULE Integrated Device Technology, Inc. FEATURES: DESCRIPTION: • High-density 4-megabit 512K x 8 Static RAM module • Fast access time: 25ns (max.) Surface mounted plastic packages on a 32-pin, 600 mil FR-4 DIP substrate
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IDT7MB4048
32-pin,
IDT7MB4048
32-pin
7MB4048
2675
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2mb 72-pin simm
Abstract: fr 3709 27A3
Text: IDT7MP4135 PRELIMINARY 512K x 32 CMOS STATIC RAM MODULE Integrated Device Technology, Inc. FEATURES DESCRIPTION • • • • The IDT7MP4135 is a 512K x 32 Static RAM module constructed on an epoxy laminate FR-4 substrate using 4 512K x 8 Static RAMs in plastic packages. The availability of
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IDT7MP4135
IDT7MP4135
150ns
72-pin
7MP4135
2mb 72-pin simm
fr 3709
27A3
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Untitled
Abstract: No abstract text available
Text: 2M x 32 CMOS STATIC RAM MODULE PRELIMINARY IDT7MP4130 Integrated Device Technology, Inc. FEATURES DESCRIPTION • • • • The IDT7MP4130 is a 2M x 32 Static RAM module constructed on an epoxy laminate FR-4 substrate using 16 1M x 4 Static RAMs in plastic packages. Availability of four chip
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IDT7MP4130
IDT7MP4130
72-pin
7MP4130
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fr 3709
Abstract: fr 3709 z 3709 2mb 72-pin simm
Text: IDT7MP4135 PRELIMINARY 512K x 32 CMOS STATIC RAM MODULE Integrated Device Technology, Inc. FEATURES DESCRIPTION • • • • The IDT7MP4135 is a 512K x 32 Static RAM module constructed on an epoxy laminate FR-4 substrate using 4 512K x 8 Static RAMs in plastic packages. The availability of
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IDT7MP4135
IDT7MP4135
72-pin
7MP4135
fr 3709
fr 3709 z
3709
2mb 72-pin simm
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JESD22-A113-A
Abstract: JESD22A113-A RM05-6A JESD22-A113A MEDER rm05 6AS4 bga reflow
Text: RM Series MEDER electronic RF Reed Relay Module 4 input / 2 output DESCRIPTION The RM05-4A-S-4/2 and RM05-2A2B-S-4/2 are low-profile 4 input / 2 output Relay Modules with an FR-4 substrate and rugged thermoset epoxy overmold. Capable of switching beyond 3 GHz with <40ps rise times, this Relay Module switches into the billions of operations. High temperature solder terminations
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RM05-4A-S-4/2
RM05-2A2B-S-4/2
220oC.
JESD22-A113A
Sn63/Pb37,
JESD22-A113-A
JESD22A113-A
RM05-6A
JESD22-A113A
MEDER rm05
6AS4
bga reflow
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JESD22A113-A
Abstract: MEDER rm05 JEDEC wave 166 relay JESD22-A113-A
Text: RM Series MEDER electronic RF Reed Relay Module 4 input / 2 output DESCRIPTION The RM05-4A-S-4/2 and RM05-2A2B-S-4/2 are low-profile 4 input / 2 output Relay Modules with an FR-4 substrate and rugged thermoset epoxy overmold. Capable of switching beyond 3 GHz with <40ps rise times, this Relay Module switches into the billions of operations. High temperature solder terminations
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RM05-4A-S-4/2
RM05-2A2B-S-4/2
220oC.
JESD22-A113A
Sn63/Pb37,
JESD22A113-A
MEDER rm05
JEDEC wave
166 relay
JESD22-A113-A
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Untitled
Abstract: No abstract text available
Text: RM Series MEDER electronic RF Reed Relay Module 4 input / 2 output DESCRIPTION The RM05-4A-S-4/2 and RM05-2A2B-S-4/2 are low-profile 4 input / 2 output Relay Modules with an FR-4 substrate and rugged thermoset epoxy overmold. Capable of switching beyond 3 GHz with <40ps rise times, this Relay Module switches into the billions of operations. High temperature solder terminations
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RM05-4A-S-4/2
RM05-2A2B-S-4/2
220oC.
JESD22-A113A
Sn63/Pb37,
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Untitled
Abstract: No abstract text available
Text: Integrated Device Technology, Inc. IDT7MP4060 IDT7MP4095 128K x 32 CMOS STATIC RAM MODULES FEATURES: DESCRIPTION: • High density 4 megabit static RAM modules The IDT7M P4095/7M P4060 are 128K x 32 static RAM modules constructed on an epoxy laminate FR-4 substrate
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IDT7MP4060
IDT7MP4095
64-pin
64-lead,
72-lead
7MP4095
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151-ETQP2H
Abstract: 1R2B
Text: ft fr Date of Issue : 2002^4^240 April 24,2002_ * fr K # C lassificatio n : ff« « _ LJ Change New D igj-kev A À tt I t PRODUCT SPECIFICATION FOR INFORMATION m ¿s * » Product Description : P O W E R C H O K E C O IL SI o°« n°n # Product Part Number
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TlPC-02026
151-ETQP2H
1R2B
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Untitled
Abstract: No abstract text available
Text: IDT 7MB4009 2 16K x 16 CMOS STATIC RAM FR-4 DIP MODULE FEATURES: DESCRIPTION: • H ig h D en sity 512K 2(16K x 16) S ta tic RAM M odule • C ost effective surface m o un t c o m p o n e n ts m o un ted o n an e po xy lam in ate (FR-4) substrate T h e ID T7M B 4009 Is a 512K 2(16K x 16) h ig h -sp ee d static RAM
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7MB4009
IDT7198
S13-97
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Untitled
Abstract: No abstract text available
Text: 1M x 32 CMOS STATIC RAM MODULE PRELIMINARY IDT7MP4104 Integrated Device Technology, Inc. FEATURES: DESCRIPTION: • High density 4 megabyte static RAM module The IDT7MP4104 is a 1M x 32 static RAM module con structed on an epoxy laminate FR-4 substrate using 8 1M x
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IDT7MP4104
IDT7MP4104
200mV
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V2658
Abstract: p4008
Text: 512K x 8 CMOS STATIC RAM MODULE IDT7MP4008S Integrated Device Technology, Inc. FEATURES: DESCRIPTION: • High-density 4 megabit C M O S static RAM module • Fast access times — 30ns max. • Cost effective plastic surface mount RAM packages on a epoxy laminate (FR-4) substrate
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36-pin
IDT7MP4008S
IDT7MP4008
7MP4008
V2658
p4008
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LJ016
Abstract: No abstract text available
Text: 4 Megabit CMOS SRAM DPS128X32XP/XHP ADVANCED INFORMATION DESCRIPTION: The DPS128X32XP/XHP is a 68-p'rn surface mount module consisting of four 128K x 8 SRAM devices in plastic TSO P packages surface mounted on a FR-4 substrate. The module is available with either “J"-Leads or
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DPS128X32XP/XHP
DPS128X32XP/XHP
68-pin
128Kx
I/00-I/031
1/016-1/packacc
-40-C
JOA16700
LJ016
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Untitled
Abstract: No abstract text available
Text: DPS64X16P □ Dense-Pac Microsystems, Inc. 0_ 64K X 16 CMOS CM SRAM MODULE PRELIMINARY DESCRIPTION: The DPS64X16P is a 64K X 16 high-speed, low-power static RAM module comprised of four 64K X 4 monolithic SRAM's, and decoupling capacitors surface mounted on a FR-4 substrate.
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DPS64X16P
DPS64X16P
220mW
30A057-00
S64X16P
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Untitled
Abstract: No abstract text available
Text: 4 Megabit CMOS SRAM DENSE-PAC DPS128X32XP/XHP MICROSYSTEMS DESCRIPTION: The DPS128X32XP/XHP is a 68-pin surface mount module consisting of four 128K x 8 SRAM devices in plastic TSOP packages surface mounted on a FR-4 substrate. The module is available with either "J"-Leads or
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DPS128X32XP/XHP
DPS128X32XP/XHP
68-pin
30A167-00
30A16700
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Untitled
Abstract: No abstract text available
Text: IDT7MB4048 512K x 8 CMOS STATIC RAM MODULE Integrated Device Technology, Inc. FEATURES: DESCRIPTION: • High-density 4-megabit 512K x 8 Static RAM module The IDT7MB4048 Is a 4-megabit (512K x 8) Static RAM module constructed on a multilayer epoxy laminate (FR-4)
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IDT7MB4048
32-pin,
IDT7MB4048
32-pin
7MB4048
512Kx
0D21254
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fr 3709 z
Abstract: No abstract text available
Text: IDT7MP4135 PRELIMINARY 512K x 32 CMOS STATIC RAM MODULE Integrated Device Technology, Inc. FEATURES DESCRIPTION • • • • The IDT7MP4135 is a 512K x 32 Static RAM module constructed on an epoxy laminate FR-4 substrate using 4 512K x 8 Static RAMs in plastic packages. The availability of
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IDT7MP4135
IDT7MP4135
ThelDT7MP4135
72-pin
7MP4135
2S771
0D223Ã
fr 3709 z
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Untitled
Abstract: No abstract text available
Text: ¡¡ S ix 1 28K X 32 CMOS STATIC RAM MODULE \ y Integrated Device Technology, Inc. IDT7MP4095 FEATURES: DESCRIPTION: • High density 4 m egabit static RAM m odule The IDT7MP4095 is a 128K x 32 static RAM module constructed on an epoxy laminate FR-4 substrate using four
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IDT7MP4095
IDT7MP4095
P4095
64-pin
ide90
DD1772fl
7MP4095
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