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    FPBGA 26 Search Results

    FPBGA 26 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ispMACH M4A3

    Abstract: ISPGDX160A ispGAL22V10
    Text: 208-Ball fpBGA 256-Ball fpBGA 100-Ball caBGA 144-Ball fpBGA 49-Ball caBGA Fine Pitch BGA 7.00 x 7.00 mm 0.8 mm pitch 10.00 x 10.00 mm 0.8 mm pitch 13.00 x 13.00 mm 1.0 mm pitch 17.00 x 17.00 mm 1.0 mm pitch 23.00 x 23.00 mm 1.0 mm pitch BGA 27.00 x 27.00 mm


    Original     		PDF 208-Ball 256-Ball 100-Ball 49-Ball 144-Ball 100-Pin 128-Pin 48-Pin 44-Pin 144-Pin ispMACH M4A3 ISPGDX160A ispGAL22V10

    W3J128M72G-XPBX

    Abstract: w3j128m72
    Text: W3H32M72E-XSB2X 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm  54% I/O reduction vs FPBGA


    Original     		PDF W3H32M72E-XSB2X W3J128M72G-XPBX w3j128m72

    HL832nxa

    Abstract: VPP1552BFG HL832NX-A HL-832NXA HL832NXA-EX GE100LFCS HL832-NX-A HL832 KE1250LKDS HL832NX
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1004-04 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: DATE: 26-Jul-2010 15.0mm x 15.0mm x 1.7mm FPBGA-324


    Original     		PDF A1004-04 26-Jul-2010 FPBGA-324 VPP1552BFG VPP1552BFG8 26-Oct-2010 JESD22-A113 LBGA-167 JESD22-A118 JESD22-A104 HL832nxa VPP1552BFG HL832NX-A HL-832NXA HL832NXA-EX GE100LFCS HL832-NX-A HL832 KE1250LKDS HL832NX

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3E32M64S-XSBX PRELIMINARY* 32Mx64 DDR SDRAM FEATURES BENEFITS DDR SDRAM rate = 200, 250, 266, 333* 73% SPACE SAVINGS vs. TSOP Package: • 43% Space Savings vs FPBGA • 208 Plastic Ball Grid Array PBGA , 13 x 22mm Reduced part count


    Original     		PDF W3E32M64S-XSBX 32Mx64 333Mbs/166MHz PCN04019

    Untitled

    Abstract: No abstract text available
    Text: Restriction of Hazardous Substances RoHS Material Declaration: FPBGA 10 x 10 mm Package type: RoHS compliant: Package total weight grams (g): Termination base alloy: Component terminal plating/surface finish: Max. reflow temperature rating (degrees Celsius):


    Original     		PDF J-STD-020

    W3E32M72S-XSBX

    Abstract: No abstract text available
    Text: White Electronic Designs W3E32M72S-XSBX 32Mx72 DDR SDRAM FEATURES BENEFITS Data rate = 200, 250, 266, 333Mbs 73% Space Savings vs. TSOP Package: • 44% Space Savings vs FPBGA • 208 Plastic Ball Grid Array PBGA , 16 x 22mm Reduced part count 2.5V ±0.2V core power supply


    Original     		PDF W3E32M72S-XSBX 32Mx72 333Mbs 333Mbs W3E32M72S-XSBX

    LX128

    Abstract: No abstract text available
    Text: ispGDX2 Data Sheet Revision History Date Version Page Change Summary April, 2003 05 - Previous Lattice release Updated Data Sheet to reflect production release of the LX64 and LX128 devices. - AC/DC Specifications - 100- and 208-ball fpBGA Logic Signal Connections


    Original     		PDF LX128 208-ball LX64V/B/C 330MHz 360MHz.

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3E32M72S-XSBX 32Mx72 DDR SDRAM FEATURES BENEFITS Data rate = 200, 250, 266MHz 73% Space Savings vs. TSOP Package: • 44% Space Savings vs FPBGA • 208 Plastic Ball Grid Array PBGA , 16 x 22mm Reduced part count 2.5V ±0.2V core power supply


    Original     		PDF W3E32M72S-XSBX 32Mx72 266MHz

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3E32M72S-XSBX PRELIMINARY* 32Mx72 DDR SDRAM FEATURES BENEFITS Data rate = 200, 250, 266MHz 73% Space Savings vs. TSOP Package: • 44% Space Savings vs FPBGA • 208 Plastic Ball Grid Array PBGA , 16 x 22mm Reduced part count 2.5V ±0.2V core power supply


    Original     		PDF W3E32M72S-XSBX 32Mx72 266MHz

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3E32M64S-XSBX 32Mx64 DDR SDRAM FEATURES BENEFITS DDR SDRAM rate = 200, 250, 266, 333* 73% Space Savings vs. FPBGA Package: • 43% Space Savings vs TSOP • 208 Plastic Ball Grid Array PBGA , 13 x 22mm Reduced part count 2.5V ±0.2V core power supply


    Original     		PDF W3E32M64S-XSBX 32Mx64 PCN04019 333Mbs

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3E32M72S-XSBX 32Mx72 DDR SDRAM FEATURES BENEFITS Data rate = 200, 250, 266MHz 73% Space Savings vs. TSOP Package: • 44% Space Savings vs FPBGA • 208 Plastic Ball Grid Array PBGA , 16 x 22mm Reduced part count 2.5V ±0.2V core power supply


    Original     		PDF W3E32M72S-XSBX 32Mx72 266MHz

    FPBGA

    Abstract: ga 25 diode M918 package diode
    Text: Tape and Reel Specification M918 Tape and Reel Option Fine Pitch Ball Grid Array Package GA 25 / 26 Ball W P Direction of Feed Package Suffix Package Type GA fpBGA 050708 Ball Count Tape Width (W) 25 12 26 16 (mm) Pocket Pitch (P) Reel Diameter Units per Reel


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: W3E32M64S-XB3X 256 – 32Mx64 DDR SDRAM FEATURES BENEFITS  DDR SDRAM rate = 200, 250, 266, 333*  73% Space Savings vs. FPBGA  Package: • 43% Space Savings vs TSOP • 208 Plastic Ball Grid Array PBGA , 13 x 22mm  Reduced part count


    Original     		PDF W3E32M64S-XB3X 32Mx64 cycle55Â

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3E32M72S-XSBX ADVANCED* 32Mx72 DDR SDRAM FEATURES BENEFITS Data rate = 200, 250, 266MHz 73% SPACE SAVINGS vs. TSOP Package: • • 208 Plastic Ball Grid Array PBGA , 16 x 22mm 44% Space Savings vs FPBGA Reduced part count 2.5V ±0.2V core power supply


    Original     		PDF W3E32M72S-XSBX 32Mx72 266MHz W3E32M72S-ESSB

    W3E32M72S-XSBX

    Abstract: Theta JC of FBGA
    Text: White Electronic Designs W3E32M72S-XSBX 32Mx72 DDR SDRAM FEATURES „ Data rate = 200, 250, 266, 333Mbs „ Package: BENEFITS „ • 44% Space Savings vs FPBGA • 208 Plastic Ball Grid Array PBGA , 16 x 22mm „ 2.5V ±0.2V core power supply „ 2.5V I/O (SSTL_2 compatible)


    Original     		PDF W3E32M72S-XSBX 32Mx72 333Mbs 333Mbs W3E32M72S-XSBX Theta JC of FBGA

    W3E32M72S-XSBX

    Abstract: No abstract text available
    Text: White Electronic Designs W3E32M72S-XSBX 32Mx72 DDR SDRAM FEATURES „ Data rate = 200, 250, 266, 333Mbs „ Package: BENEFITS „ • 44% Space Savings vs FPBGA • 208 Plastic Ball Grid Array PBGA , 16 x 22mm „ 2.5V ±0.2V core power supply „ 2.5V I/O (SSTL_2 compatible)


    Original     		PDF W3E32M72S-XSBX 32Mx72 333Mbs 333Mbs W3E32M72S-XSBX

    100-Pin Package Pin-Out Diagram

    Abstract: GS71024
    Text: GS71024T/U 64K x 24 1.5Mb Asynchronous SRAM TQFP, FPBGA Commercial Temp Industrial Temp Features 8, 10, 12, 15 ns 3.3 V VDD Fine Pitch BGA Bump Configuration • Fast access time: 8, 10, 12, 15 ns • CMOS low power operation: 190/160/130/110 mA at minimum cycle time.


    Original     		PDF GS71024T/U GS71024 GS71024Rev1 1999C 2/2000D 2/2000D; 100-Pin Package Pin-Out Diagram

    Untitled

    Abstract: No abstract text available
    Text: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		PDF W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB W3H64M72E-XSBXF SN63Pb37 SAC305 256MB"

    Untitled

    Abstract: No abstract text available
    Text: W3E32M64S-XSBX 32Mx64 DDR SDRAM FEATURES BENEFITS  DDR SDRAM rate = 200, 250, 266, 333*  73% Space Savings vs. FPBGA  Package: • 43% Space Savings vs TSOP • 208 Plastic Ball Grid Array PBGA , 13 x 22mm  Reduced part count  2.5V ±0.2V core power supply


    Original     		PDF W3E32M64S-XSBX 32Mx64

    Untitled

    Abstract: No abstract text available
    Text: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		PDF W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB

    Untitled

    Abstract: No abstract text available
    Text: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		PDF W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB with11,

    Untitled

    Abstract: No abstract text available
    Text: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		PDF W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB

    Untitled

    Abstract: No abstract text available
    Text: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  69% space savings vs. FPBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm


    Original     		PDF W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB

    PCI 9656 schematic

    Abstract: plx 9054 pci arbiter schematics 9656 PCI Motorola modem schematic diagram MPC8260 MPC860 RC32364
    Text: PCI 9056 Connectivity • 32-bit, 66MHz PCI r2.2 compliant ■ Motorola PowerQUICC and generic 32-bit, 66MHz local bus modes ■ 3.3V I/O, 5V tolerant bus interfaces ■ PICMG 2.1 r2.0 Hot Swap Silicon ■ 256-ball, 17 x 17 mm, 1.00 mm fine pitch PBGA FPBGA


    Original     		PDF 32-bit, 66MHz 256-ball, 32-bit 9056-SIL-PB-P1-1 PCI 9656 schematic plx 9054 pci arbiter schematics 9656 PCI Motorola modem schematic diagram MPC8260 MPC860 RC32364