AMD socket s1
Abstract: Foxconn socket amd "socket s1" socket s1 BGA638 638 amd foxconn z638 amd socket s1 mechanical
Text: SPECIFICATIONS BGA638 Socket BGA Series CPU Socket Vertical, SMT Type 1.27 mm [.05”] Pitch 638 Pos. Mechanical Socket Engagement/Disengagement Force: 3.3Kg max. Durability: 30 Cycles min. Socket Retention Force: 65g/Pos. min. Solder Ball Shear Force: 750g min.
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BGA638
65g/Pos.
1000M
AMD socket s1
Foxconn socket amd
"socket s1"
socket s1
638 amd
foxconn
z638
amd socket s1 mechanical
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foxconn
Abstract: Foxconn Technology Group EIA-364-23 "DC Power" Foxconn dvi connector EIA-364-C QH11121-DB0 EIA-364-46 dvi connector foxconn EIA-364-41
Text: DVI Connector Specification Foxconn International 6125 Phyllis Drive Cypress, CA 90630 Phone: 714 890-8628 Fax: (714) 892-8668 PERFORMANCE CHARACTERISTICS OF DIGITAL VISUAL INTERFACE (DVI) CONNECTORS AND CABLE ASSEMBLIES Release A June 27, 2000 Summary This document defines the performance characteristics of Foxconn DVI plugs, receptacles and
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Untitled
Abstract: No abstract text available
Text: SPECIFICATIONS mPGA700 Socket BG A Se ries CPU Socket Ve rtical, S M T Type 1.27mm [.050”] Pitc h 700 Pos. Mechanical Contact Retention Force: 0.065Kg min. Durability: 50 Cycles Electrical Contact Resistance: 35mΩ max. Dielectric Withstanding Voltage: 400V RMS min.
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mPGA700
065Kg
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Socket 754
Abstract: foxconn
Text: SPECIFICATIONS Socket 754 BGA Series CPU Socket Vertical, SMT Type 1.27mm [.050”] Pitch 754 Pos. Mechanical Contact Retention Force: 0.13Kg min. Durability: 50 Cycles Electrical Low Level Circuit Resistance LLCR : 20mΩ max. Insulation Resistance: 1000MΩ min.
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1000M
29x29
Socket 754
foxconn
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amp pga socket
Abstract: Foxconn pga socket
Text: ZIF PGA Socket Series 5/7 Page 1 of 3 Socket 5/7 Contents: l l l l Key Features Materials/Finishes Specifications Order Information Key Features FEATURES l l l l l l Insertion Force: zero Frame Style: open Grid Size: 19 x 19 Grid Spacing: Interstital .050 × .100 [1.27×2.54]
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socket57
amp pga socket
Foxconn pga socket
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BGA775
Abstract: CPU 775 PE0775 foxconn 94V-0 LG
Text: SPECIFICATIONS LGA/BGA 775 DT LG A/ BG A CPU Socket LG A SM T Type 1,09X1.17mm[0.043X.046”] Pitch 775 Pos. Mechanical Socket Engagement Force: 3.9kgf max. Socket Disengagement Force: 1kgf max. Durability: 20 Cycles min. Solder Ball Shear Force: 500gf min.
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500gf
12pin/chian)
33X30
15X14
BGA775
CPU 775
PE0775
foxconn
94V-0 LG
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94V-0 LG
Abstract: socket 775 Foxconn BGA775
Text: SPECIFICATIONS LGA/BGA 775 DT LG A/ BG A CPU Socket LG A SM T Type 1,09X1.17mm[0.043X.046”] Pitch 775 Pos. Mechanical Socket Engagement Force: 3.9kgf max. Socket Disengagement Force: 1kgf max. Durability: 20 Cycles min. Solder Ball Shear Force: 500gf min.
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500gf
12pin/chian)
33X30
15X14
94V-0 LG
socket 775 Foxconn
BGA775
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Untitled
Abstract: No abstract text available
Text: NGFF Socket SPECIFICATIONS AS Series 8.5mm Height SM T Type 0.50mm Pitch 75 Pos. Mechanical Contact Retention Force: 0.10kg min. Durability : 60 Cycles Electrical Voltage Rating: 50V Current Rating: 0.5A Contact Resistance: 55mΩ max. Dielectric Withstanding Voltage: 300V AC/1 min.
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1R014
Abstract: C3604 C17300 COPPER C3604
Text: RF Coaxial Connector SPECIFICATIONS Mechanical Gauge Retention Force For resilient center contact :0.27 N min MCX R/ A J ACK PCB RF CONN. Durability: 500 Cycles Electrical Nominal Impedance: 75Ω Frequency Range: 0-6GHz Insulation Resistance: 1000MΩ min.
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1000M
C3604)
C17300)
KF83111-1R01-4F
1R014
C3604
C17300
COPPER C3604
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SOCKET MXM
Abstract: No abstract text available
Text: SPECIFICATIONS MXM Socket AS Series 7.8 mm Height SMT Type 0.50mm [.0 197”] Pitch 230 Pos. Mechanical Contact Retention Force: 0.10kg min. Durability : 25 Cycles Electrical Voltage Rating: 50V Current Rating: 0.3A Contact Resistance: 250mΩ max. Dielectric Withstanding Voltage: 500V AC/1 min.
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Untitled
Abstract: No abstract text available
Text: SPECIFICATIONS Mechanical Contact Retention Force: 0.45kg min. Insertion Force: 300g max. Withdrawal Force: 25g min. Durability: 30 Cycles Socket Connector SL56 Series Right Angle, SMT Type Dual Row Receptacle 2.00mm x 2.00mm Grid [.0 79” x .079” ] 44 Pos.
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Untitled
Abstract: No abstract text available
Text: MXM 3.0 Socket SPECIFICATIONS AS Series 4.3mm&5.5mm& 7.8mm Height SM T Type 0.50mm Pitch 314 Pos. Mechanical Contact Retention Force: 0.10kg min. Durability : 25 Cycles Electrical Voltage Rating: 25V Current Rating: 0.5A Contact Resistance: 55mΩ max. Dielectric Withstanding Voltage: 200V AC/1 min.
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314Pos.
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Untitled
Abstract: No abstract text available
Text: SPECIFICATIONS Mechanical Contact Retention Force: 0.45kg min. Insertion Force: 300g max. Withdrawal Force: 25g min. Durability: 30 Cycles Socket Connector SL56 Series R i g h t A n g l e , T /H Type Dual Row Receptacle 2.00mm x 2.00mm Grid [.0 79” x .079” ]
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Untitled
Abstract: No abstract text available
Text: SPECIFICATIONS Burn-In & Test Socket Burn-In Socket Series BGA Type, Clamshell 1.00 mm [.039”] Pitch 900 Pos. Mechanical Durability: 10’000 cycles min. Actuation force: 1.5kgf max. DUT Heat Dissipation: 70W max. under 6 CFM. Electrical Current Rating: 1Amp/pin min.
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2Q134537-2210-10N
2Q101737-2210-10N
2Q09003R-22
0-10N
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Untitled
Abstract: No abstract text available
Text: NGFF Socket SPECIFICATIONS AS Series 2.2mm Height SM T+ T/H Type 0.50mm Pitch 75 Pos. Mechanical Contact Retention Force: 0.10kg min. Durability : 60 Cycles Electrical Voltage Rating: 50V Current Rating: 0.5A Contact Resistance: 55mΩ max. Dielectric Withstanding Voltage: 300V AC/1 min.
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75Pos.
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Untitled
Abstract: No abstract text available
Text: NGFF Socket SPECIFICATIONS AS Series 3.2mm Height SM T Type 0.50mm Pitch 75 Pos. Mechanical Contact Retention Force: 0.10kg min. Durability : 60 Cycles Electrical Voltage Rating: 50V Current Rating: 0.5A Contact Resistance: 55mΩ max. Dielectric Withstanding Voltage: 300V AC/1 min.
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foxconn socket 7
Abstract: No abstract text available
Text: 7 3 4 IDEAS GENERATED DRAWING, DO NOT CHANGE BY HAND. & © LOAD ING MODULE PART NO. PT 4 4 A 2 5 - 6 4 0 1 REF. DETAIL : PAGE 2 & 3 C D E 1 o 3 4 5 6 7 REV . EON, NO. APPD . A BC -11-00 1 2 5 4 0 D . Huang B BC -11- 0038964 D . Huang A NOT ES: 1. ASSEMBLY PROCEDURE
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PT44P15-6401
foxconn socket 7
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Untitled
Abstract: No abstract text available
Text: IDEAS GENERATED DRAWING, DO NOT CHANGE BY HAND. NOTES: A A A A 6. D IM E N SIO N IN G M ATERIAL FOXCONN SOCK ET DA TE 7 . PLEASE SCREW CARBON IS IS IS LOCA TED LO CA TED LOCA TED MA TERIA L C O M P LI ANT PER ASME Y 1 4 . 5 M - 1 9 9 4 . CARBON PET, LOGO
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PT44L61-6411
Abstract: PT44L61
Text: IDEAS GENERATED DRAWING, REV. DD NOT CHANGE BY HAND. PART NO, R EF. PT44L61-6411 D ETA IL © PART NO. « A B C i PAGE ECN. NO. APPD. BC-11-0018338 BC-11-0040455 BC-11-004805* D. Huang D. Huang D. Huang 2 BACK PLATE PT44P1*~6401 cy> o J REF, DETAIL i PAGE 3°
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PT44L61-6411
BC-11-0018338
BC-11-0040455
BC-11-004805*
PT44P1*
PT44A68â
PT44A69â
PT44L61-6411
PT44L61
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PE12070
Abstract: No abstract text available
Text: ID E A S G EN ER ATED D R A W IN G , REV. DO NOT CHANGE B Y H A N D . A ECN. NO. HC060728 APPD. D ickie B BC 097062406 Nick Lin C BC10 0 1 5 0 7 0 0 Nick Lin D BC11 00 14454 Nick Lin E BC-12-0013955 D ickie F BC-12-0017717 D ickie NOTES: 1. ALL DIMENSIONS
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HC060728
BC-12-0013955
BC-12-0017717
5M-1994.
UL94V-0;
PE12070
-3742-01N
PE12072B-3742-01F
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Foxconn socket amd
Abstract: RS-364-28 rs tube
Text: MATERIAL Q’TY ITEM DESCRIPTION THERMOPLASTIC, GLASS FILLED POLYESTER, UL94V-0. SEE BELOW HOUSING I SAME AS NO. OF POSITIONS (SEE BELOW) CONTACT TREATMENT REMARK SEE REMARK PHOSPHOR BRONZE 30u”~5 0 u ” NICKEL SOLDER PLATING, CONTACT AND TAIL AREA PLATING SEE BELOW
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UL94V-0.
RS-364-32A,
MIL-STD-1344A,
MIL-STD-202F,
IIC959/4
Foxconn socket amd
RS-364-28
rs tube
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LGA+1155+Socket+PIN+diagram
Abstract: 1155 lga socket
Text: ID EA S GENERATED DRAWING, DO NOT CHANGE BY HAND. D BC-11-0035559 D . Huang REV . E BC-11-0054449 D . Huang A BC -10 - 0 0 8 6 2 2 0 D . Huang B BC -10 - 0 1 2 8 4 6 4 D . Huang C B C -11-0006981 To ny NOTES: 1. D I M E N S IO N IN G AND TOLERANCING PER ASME Y 1 4 . 5 M - 1 9 9 4 .
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BC-11-0035559
BC-11-0054449
LGA+1155+Socket+PIN+diagram
1155 lga socket
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Untitled
Abstract: No abstract text available
Text: o 3 4 6 5 REV. IDEAS GENERATED DRAWING, DO NOT CHANGE BY HAND. NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994. A MATERIAL SOCKET BODY LCP , UL9 4V -0 ; CONTACT Cu/Ni COPPER ALLOY; PLAT ING 15u " MIN. Au PLATING ON CONTACT AREA;
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5M-1994.
UL94V-Q;
LGA2011
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Untitled
Abstract: No abstract text available
Text: IDEAS GENERATED DRAWING, DO NOT CHANGE BY HAND. NOTES: 1. D IM E N S IO N IN G AND TOLERANCING PER ASME Y 1 4 . 5 M - 1 9 9 4 . A MA TE RI AL : LOAD PLATE S T A IN L E S S STEE L; CARBON S TE EL ; FRAME S T A IN L E S S STEE L; LEVER I NSULATOR THERMOPLASTIC .HALOGEN FREE;
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