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    FOOTPRINT VFBGA Search Results

    FOOTPRINT VFBGA Result Highlights (1)

    Part ECAD Model Manufacturer Description Download Buy
    TW9920-BC1-GR Renesas Electronics Corporation Multi-Standard Video Decoder and Encoder, VFBGA, /Tray Visit Renesas Electronics Corporation

    FOOTPRINT VFBGA Datasheets Context Search

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    Untitled

    Abstract: No abstract text available
    Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of VFBGA48 package SOT1063-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


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    PDF VFBGA48 OT1063-1 OT1063-1

    VFBGA144

    Abstract: No abstract text available
    Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of VFBGA144 package SOT1078-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


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    PDF VFBGA144 OT1078-1 OT1078-1

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of VFBGA100 package SOT1087-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


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    PDF VFBGA100 OT1087-1 OT1087-1

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of VFBGA56 package SOT702-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


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    PDF VFBGA56 OT702-1 OT702-1

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of VFBGA81 package SOT1071-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


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    PDF VFBGA81 OT1071-1 OT1071-1

    CSR BC212

    Abstract: MDR741F CSR BLUECORE VIRTUAL MACHINE CSR BlueCore 4 Application Program Interface BlueCore 3 csr bluetooth csr BC02 BlueCore 2 External casira casira csr crystal trim kit BC212015ADN-E4
    Text: Product Data Sheet Device Features BlueCore 2-External Low power 1.8V operation TM Small footprint in 96-Ball VFBGA Package 6x6mm Single Chip Bluetooth System Fully qualified Bluetooth component Full speed class 2 Bluetooth operation with full 7 slave piconet support


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    PDF 96-Ball -40T105 BC212015-ds-001b CSR BC212 MDR741F CSR BLUECORE VIRTUAL MACHINE CSR BlueCore 4 Application Program Interface BlueCore 3 csr bluetooth csr BC02 BlueCore 2 External casira casira csr crystal trim kit BC212015ADN-E4

    Untitled

    Abstract: No abstract text available
    Text: CYWB0124AB West Bridge : Antioch™ USB/Mass Storage Peripheral Controller 1.0 Features • • • • DMA slave support Ultra low power, 1.8V core operation Low power modes Small footprint, 6x6mm VFBGA and less than 4x4mm WLCSP • Selectable clock input frequencies


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    PDF CYWB0124AB CYWB0124AB-FDXI CYWB0124ABX-FDXI

    CRC-16

    Abstract: USB3290 USB3290-FH
    Text: USB3290 Small Footprint Hi-Speed USB 2.0 Device PHY with UTMI Interface PRODUCT FEATURES „ „ „ „ „ „ „ „ „ „ „ „ „ Datasheet Available in a 40 ball lead-free RoHS compliant 4 x 4 x 0.9mm VFBGA package Interface compliant with the UTMI specification


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    PDF USB3290 60MHz, 480Mbps 12Mbps 24MHz 150mA VDD33 VDDA18 CRC-16 USB3290 USB3290-FH

    CSR BLUECORE VIRTUAL MACHINE

    Abstract: CSR BC212 BC212015BD CSR BLUECORE at command CSR BLUECORE 6 BCCMD Protocol MDR741F BlueCore BCCMD Commands BlueCore 3 csr CSR USB SPI converter csr BC212015
    Text: _äìÉ`çêÉ OJbñíÉêå~ä= qj Device Features Single Chip Bluetooth System „ Low power 1.8V operation „ Small footprint in 96-ball VFBGA and LGA packages 6x6mm 8x8mm and 10x10mm „ Fully qualified Bluetooth component „ 0.18µm CMOS technology „


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    PDF 96-ball 10x10mm) BC212013 BC212015 10x10 BC212015-ds-001f CSR BLUECORE VIRTUAL MACHINE CSR BC212 BC212015BD CSR BLUECORE at command CSR BLUECORE 6 BCCMD Protocol MDR741F BlueCore BCCMD Commands BlueCore 3 csr CSR USB SPI converter csr BC212015

    CRC-16

    Abstract: USB3290 USB3290-FH
    Text: USB3290 Small Footprint Hi-Speed USB 2.0 Device PHY with UTMI Interface PRODUCT FEATURES „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ Datasheet Available in a 40 ball lead-free RoHS compliant 4 x 4 x 0.9mm VFBGA package Interface compliant with the UTMI specification


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    PDF USB3290 60MHz, 480Mbps 12Mbps 24MHz 150mA CRC-16 USB3290 USB3290-FH

    BlueCore 3 csr

    Abstract: btm 110 bluetooth csr BlueCore 4 RFCOMM Stack CSR BLUECORE spp CSR BlueCore 4 API CSR BLUECORE SPI CSR BLUECORE spp protocol BLUECORE serial BlueCore 4 csr BC215
    Text: Product Data Sheet Device Features Low power 1.8V operation 0.18µm CMOS technology Small footprint in 6 x 6 mm package BlueCore 2-ROM TM Single Chip Bluetooth System Advance Information Data Sheet Fully qualified Bluetooth component April 2002 Scatternet support


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    PDF CT105 BC213015A-ds-001c BlueCore 3 csr btm 110 bluetooth csr BlueCore 4 RFCOMM Stack CSR BLUECORE spp CSR BlueCore 4 API CSR BLUECORE SPI CSR BLUECORE spp protocol BLUECORE serial BlueCore 4 csr BC215

    Untitled

    Abstract: No abstract text available
    Text: USB3290 Small Footprint Hi-Speed USB 2.0 Device PHY with UTMI Interface PRODUCT FEATURES „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ Data Brief Available in a 40 ball lead-free RoHS compliant 4 x 4 x 0.9mm VFBGA package Interface compliant with the UTMI specification


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    PDF USB3290 60MHz, 480Mbps 12Mbps 24MHz 150mA USB3290 USB3290-FH

    nrzi

    Abstract: USB3290 USB3290-FH nrzi encoding in usb footprint vfbga
    Text: USB3290 Small Footprint Hi-Speed USB 2.0 Device PHY with UTMI Interface PRODUCT FEATURES „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ Data Brief Available in a 40 ball lead-free RoHS compliant 4 x 4 x 0.9mm VFBGA package Interface compliant with the UTMI specification


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    PDF USB3290 60MHz, 480Mbps 12Mbps 24MHz 150mA USB3290 USB3290-FH nrzi nrzi encoding in usb footprint vfbga

    BlueCore 3 csr

    Abstract: BSC COMPUTER SCIENCE digital logic design Notes CSR BLUECORE SPI CSR BLUECORE application note BlueCore 4 BlueCore 5 BlueCore 01b CSR BLUECORE SPI APPLICATION BC01B-USB-TR CSR BLUECORE application
    Text: Product Data Sheet Device Features BlueCore 01b TM Compliant to Bluetooth specification V1.1 TM Small footprint in 8mm x 8mm 81-ball BGA Single Chip Bluetooth Device Product Data Sheet For: USB V1.1 compliant BC01b-URT UART only version (BGA Packaging) Qualified Bluetooth firmware included


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    PDF 81-ball BC01b-URT BC01bv-URT BlueCore01b bco1b-ds-003d bc01b-ds-003a bc01b-ds-003b bc01b-ds-003c bc01b-ds-003d bc01bv BlueCore 3 csr BSC COMPUTER SCIENCE digital logic design Notes CSR BLUECORE SPI CSR BLUECORE application note BlueCore 4 BlueCore 5 BlueCore 01b CSR BLUECORE SPI APPLICATION BC01B-USB-TR CSR BLUECORE application

    Untitled

    Abstract: No abstract text available
    Text: ARM-based Embedded MPU SAM9G25 DATASHEET Description Based on the ARM926EJ-S core, the SAM9G25 is an embedded microprocessor unit, running at 400 MHz and featuring connectivity peripherals, a high data bandwidth architecture and a small footprint package option, making it an optimized solution for


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    PDF SAM9G25 ARM926EJ-Sâ SAM9G25 12-bit

    Untitled

    Abstract: No abstract text available
    Text: AT91SAM ARM-based Embbedded MPU SAM9G25 DATASHEET Description Based on the ARM926EJ-S core, the SAM9G25 is an embedded microprocessor unit, running at 400 MHz and featuring connectivity peripherals, a high data bandwidth architecture and a small footprint package option, making it an optimized solution for


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    PDF AT91SAM SAM9G25 ARM926EJ-Sâ SAM9G25 12-bit

    Untitled

    Abstract: No abstract text available
    Text: AT91SAM ARM-based Embedded MPU SAM9G25 SUMMARY DATASHEET Description Based on the ARM926EJ-S core, the SAM9G25 is an embedded microprocessor unit, running at 400 MHz and featuring connectivity peripherals, a high data bandwidth architecture and a small footprint package option, making it an optimized solution for


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    PDF AT91SAM SAM9G25 ARM926EJ-Sâ SAM9G25 12-bit

    vFBGA* 96 bALL

    Abstract: Amkor Wafer level mold compound amkor cabga thermal resistance BGA 256 PACKAGE thermal resistance Amkor Technology CABGA CTBGA MO-195 BGA PACKAGE thermal resistance amkor cabga
    Text: LAMINATE data sheet CABGA/CTBGA/CVBGA Features: ChipArray Packages: ChipArray® BGA CABGA / LFBGA Thin ChipArray® BGA (CTBGA / TFBGA) Very Thin ChipArray® BGA (CVBGA / VFBGA) Amkor’s ChipArray® packages are laminatebased Ball Grid Array (BGA) packages that are


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    LV 1084 73

    Abstract: LV 373A BGA PACKAGE thermal profile LV 1084 land pattern for tvSOP 90 ball VFBGA micro pitch BGA VA244 VFBGA LVTH2245
    Text: Application Report SZZA028A - November 2001 8-Bit Linear and Logic Families in 20-Ball, 0.65-mm Pitch, Very-Thin, Fine-Pitch BGA VFBGA Packages Frank Mortan and Mark Frimann Standard Linear & Logic ABSTRACT Texas Instruments 20-ball MicroStar Jr. package is a standardized JEDEC VFBGA


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    PDF SZZA028A 20-Ball, 65-mm 20-ball LV 1084 73 LV 373A BGA PACKAGE thermal profile LV 1084 land pattern for tvSOP 90 ball VFBGA micro pitch BGA VA244 VFBGA LVTH2245

    48 ball VFBGA

    Abstract: 90 ball VFBGA LVTH162 micro pitch BGA tSSOP 56 socket TSSOP YAMAICHI SOCKET 48-PIN 56-PIN ALVCH16373 LVCH16244A
    Text: Application Report SZZA029B - May 2002 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch, Very Thin Fine-Pitch BGA VFBGA Packages Frank Mortan and Mark Frimann Standard Linear & Logic ABSTRACT TI’s 56-ball MicroStar Jr. package, registered under JEDEC MO-225, has demonstrated


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    PDF SZZA029B 16-Bit 56-Ball, 65-mm 56-ball MO-225, 48-pin 56-pin 48 ball VFBGA 90 ball VFBGA LVTH162 micro pitch BGA tSSOP 56 socket TSSOP YAMAICHI SOCKET ALVCH16373 LVCH16244A

    Untitled

    Abstract: No abstract text available
    Text: Competitive Package Cross-Reference: NXP Logic Products Package Image width x length x height mm Pitch (mm) NXP 0.5 GX 0.3 GN TI Fairchild ON Toshiba CMX fsV MicroPak 0.8 x 0.8 x 0.35 MicroPak 1.0 x 0.9 x 0.35 MicroPak GF FHX 0.35 1.0 x 1.0 x 0.5 GF 1.0 x 1.0 x 0.35 GS


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    PDF OT902 OT833 OT891 OT1089 OT1202/3 OT1115/6 OT1226 OT353 OT363 OT753

    S71VS

    Abstract: S71VS128RC0AHK4L S71VS128RB0 SWM064D108M1R swm032d108m1r pSRAM_39 SWM128D108M1R Chamfer Designation s71vs064rb0 S29VS064R
    Text: S71VS/XS-R Memory Subsystem Solutions MirrorBit 1.8 Volt-Only Simultaneous Read/Write, Burst Mode Multiplexed Flash Memory and Burst Mode pSRAM 256/128/64 Mb 16/8/4 Mb x 16-bit Flash, 128/64/32 Mb (8/4/2 Mb x 16-bit) pSRAM S71VS/XS-R Memory Subsystem Solutions Cover Sheet


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    PDF S71VS/XS-R 16-bit) S71VS S71VS128RC0AHK4L S71VS128RB0 SWM064D108M1R swm032d108m1r pSRAM_39 SWM128D108M1R Chamfer Designation s71vs064rb0 S29VS064R

    NXP PN544 user manual

    Abstract: PN544 user manual NXP PN544 PN544 PN544 NFC controller data sheet nfc PN544 NXP PN544 Antenna Design Guide PN544 NFC controller nxp pn544 antenna design PN544 hardware design guide
    Text: Application guide Portable devices and mobile handsets Introduction Your partner for portable devices and mobile handsets NXP Semiconductors is a recognized leader in portable and mobile applications. We offer a comprehensive portfolio of best-in-class solutions


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    S71VS256RD0AHK3M

    Abstract: No abstract text available
    Text: S71VS/XS-R Memory Subsystem Solutions MirrorBit 1.8 Volt-Only Simultaneous Read/Write, Burst Mode Multiplexed Flash Memory and Burst Mode pSRAM 256/128/64 Mb 16/8/4 Mb x 16-bit Flash, 128/64/32 Mb (8/4/2 Mb x 16-bit) pSRAM S71VS/XS-R Memory Subsystem Solutions Cover Sheet


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    PDF S71VS/XS-R 16-bit) S71VS256RD0AHK3M