Untitled
Abstract: No abstract text available
Text: TaNFilm Flat Precision TaNFilm Flat Precision Resistor® Array Resistor Array SON Series Welwyn Components • Compatible with standard SOIC footprint 210 Series · temperature performance Tested for Applications •· Compatible withCOTS standard SOIC footprint (210 Series)
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MIL-PRF-83401
10kFB
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Untitled
Abstract: No abstract text available
Text: IRF7521D1 Description TM The new Micro8 package, with half the footprint area of the standard SO-8, provides the smallest footprint available in an SOIC outline. This makes the Micro8TM an ideal device for applications where printed circuit board space is at a premium.
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IRF7521D1
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LAN911x
Abstract: SMSC LAN911x TQFP100 footprint RX-3 -G AN1212 16 soic pcb footprint case A FOOTPRINTS led,1206 schema led table LAN9116
Text: AN 12.19 Designing For LAN9118 Family Footprint Compatibility 1 Introduction This application note will discuss forward and backward footprint compatibility among the LAN9118 family of Ethernet controllers. Various external component placement strap possibilities supporting
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LAN9118
LAN9118
an813
an125
an1212
LAN911x
SMSC LAN911x
TQFP100 footprint
RX-3 -G
16 soic pcb footprint
case A FOOTPRINTS
led,1206
schema led table
LAN9116
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18013
Abstract: No abstract text available
Text: SOIC-to-JEDEC TO Adapter FEATURES • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. IC now available only in 8-position SOIC packages, can be readily mounted on boards having JEDEC TO thru-hole footprints without having to
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C36000,
B16/B16M
B579-73
SAE-AMS-QQ-N-290
18013
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1109814
Abstract: No abstract text available
Text: SOIC-to-JEDEC TO Adapter FEATURES • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. IC now available only in 8-position SOIC packages, can be readily mounted on boards having JEDEC TO thru-hole footprints without having to
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C36000,
B16/B16M
B579-73
SAE-AMS-QQ-N-290
1109814
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Untitled
Abstract: No abstract text available
Text: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
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C36000
ASTM-B16-85.
MIL-T10727
MIL-P-81728
QQ-N-290.
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1109814
Abstract: No abstract text available
Text: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
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C36000
ASTM-B16-85.
MIL-T10727
MIL-P-81728
QQ-N-290.
1109814
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Untitled
Abstract: No abstract text available
Text: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
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C36000
ASTM-B16-00.
SAE-AMS-QQ-N-290.
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18012
Abstract: No abstract text available
Text: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
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C36000
ASTM-B16-85.
MIL-T10727
MIL-P-81728
QQ-N-290.
18012
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automotive eDP interface
Abstract: No abstract text available
Text: Buck Boost LDO LED Driver Charge Pump Load Switch POWER Greener, Smarter, Smaller Power Management Power Management Solutions Buck • High Efficiency • Fast Response • Smallest Footprint Boost • High Efficiency • Small Footprint LDO • Ultra-Low Dropout
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PM-SG-Q32014-US
automotive eDP interface
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1109814
Abstract: 8 soic pcb footprint 18012 ASTM-B16-85
Text: Part No. 1109814/4102-113-18 SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
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C36000
ASTM-B16-85.
MIL-P-81728
QQ-N-290.
1109814
8 soic pcb footprint
18012
ASTM-B16-85
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Untitled
Abstract: No abstract text available
Text: Part No. 1109814/1109902 SOIC TO to Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
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C36000
ASTM-B16-85.
MIL-P-81728
QQ-N-290.
003roducts
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Untitled
Abstract: No abstract text available
Text: Buck Boost LDO LED Driver Charge Pump Load Switch POWER Greener, Smarter, Smaller Power Management Power Management Solutions Buck • High Efficiency • Fast Response • Smallest Footprint Boost • High Efficiency • Small Footprint LDO • Ultra-Low Dropout
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PM-SG-Q32014-AG
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IPC 4101A
Abstract: IS410 4101A
Text: RoHs/WEEE-Compliant SOIC-to-JEDEC TO Adapter FEATURES • Pb-Free RoHs/WEEE-compliant • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without having to
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IS410
101A/26
C36000,
B16/B16M
MIL-G-45204
AMS-QQ-N-290
1109814-RC
18013RC
IPC 4101A
4101A
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Untitled
Abstract: No abstract text available
Text: RoHs/WEEE-Compliant SOIC-to-JEDEC TO Adapter FEATURES • Pb-Free RoHs/WEEE-compliant • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without having to
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IS410
101A/26
C36000,
B16/B16M
MIL-G-45204
AMS-QQ-N-290
1109814-RC
18013RC
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import cadstar schematic capture 7.2
Abstract: orcad orcad pcb footprint 16 soic pcb footprint CR5000 eagle arm pcb schematic MATRIX DISPLAY FOOTPRINT PCB AN01 LM3S6965
Text: Using Schematic Part Libraries and PCB Footprint Libraries for Stellaris Microcontrollers Application Note AN01 256 -0 2 Co pyrigh t 2 008– 200 9 Te xas In strumen ts Application Note Using Schematic Part Libraries and PCB Footprint Libraries for Stellaris® Microcontrollers
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SFH6315T
Abstract: SFH6316T SFH6343 SFH6343T
Text: VISHAY SFH6315T/ SFH6316T/ SFH6343T Vishay Semiconductors High Speed Optocoupler, 1 MBd, Transistor Output SFH6315/6 Features • Surface Mountable • Industry Standard SOIC-8 Footprint • Compatible with Infrared Vapor Phase Reflow and Wave Soldering Processes
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SFH6315T/
SFH6316T/
SFH6343T
SFH6315/6
SFH6343)
SFH6315T-HCPL0500
SFH6316T-HCPL0501
SFH6343T-HCPL0453
2002/95/EC
2002/96/EC
SFH6315T
SFH6316T
SFH6343
SFH6343T
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SFH6315T
Abstract: SFH6316T SFH6343 SFH6343T ozone generator circuit 4 kv ac
Text: VISHAY SFH6315T/ SFH6316T/ SFH6343T Vishay Semiconductors High Speed Optocoupler, 1 MBd, Transistor Output SFH6315/6 Features • Surface Mountable • Industry Standard SOIC-8 Footprint • Compatible with Infrared Vapor Phase Reflow and Wave Soldering Processes
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SFH6315T/
SFH6316T/
SFH6343T
SFH6315/6
SFH6343)
SFH6315T-HCPL0500
SFH6316T-HCPL0501
SFH6343T-HCPL0453
2002/95/EC
2002/96/EC
SFH6315T
SFH6316T
SFH6343
SFH6343T
ozone generator circuit 4 kv ac
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MIL-PRF-83401
Abstract: ns7a N997 precision film RESISTOR ARRAY 229R resistor array 1 k
Text: TaNFilm Flat Precision Resistor Array Welwyn Components SON Series • Compatible with standard SOIC footprint 210 Series • Superior temperature performance • Tested for COTS Applications • Absolute tolerances to ±0.05% • Ratio tolerances to ±0.01%
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MIL-PRF-83401d
100ppm/
50ppm/
25ppm/
MIL-PRF-55342
MIL-PRF-83401
10kFB
MIL-PRF-83401
ns7a
N997
precision film RESISTOR ARRAY
229R
resistor array 1 k
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OZ 9966
Abstract: ci573 C4493 c5588 JS-05(N)K 16 soic pcb footprint MIL-T-10727 soic footprint 8 soic pcb footprint IT43
Text: 300 RRIES Electronics Europe Tel: + 4 4 1 9 0 8 2 6 0 0 0 7 Unit 3, Furtho Court Towcesler Road, Old Stratford Milton Keynes MK19 6AQ F a x : + 441908 2 6 0 0 0 8 SOIC to DIP Adapters Converts SOIC footprint to DIL footprint ^ 8 to 28 pins 'S 8 to 24 pin version is Universal,
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XX-350000-10
00r2S
OZ 9966
ci573
C4493
c5588
JS-05(N)K
16 soic pcb footprint
MIL-T-10727
soic footprint
8 soic pcb footprint
IT43
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6343 SOIC-8
Abstract: 6316T
Text: SFH6315T SFH6316T SFH6343T *•— Infineon technologies High Speed Optocoupler FEATURES • Surface Mountable • Industry Standard SOIC-8 Footprint • Compatible with Infrared Vapor Phase Reflow and Wave Soldering Processes • Isolation Voltage, 3000 VRMS
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SFH6315T
SFH6316T
SFH6343T
SFH6315/6
SFH6343)
SFH6315T--
HCPL0500
SFH6316T--
HCPL0501
SFH6343T--
6343 SOIC-8
6316T
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VDE011
Abstract: 6343 opto
Text: SFH6315 SFH6316 SFH6343 SIEMENS HIGH SPEED OPTOCOUPLER FEATURES Surface Mountable Industry Standard SOIC«8 Footprint Compatible with Infrared Vapor Phase Reflow and Wave Soldering Processes Isolation Voltage, 2500 V RMg Very High Common Mode Transient Immunity:
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SFH6343)
SFH6315--
HCPL0S00
SFH6316--
HCPL0501
SFH6343--
HCPL0453
SFH6315
SFH6316
SFH6343
VDE011
6343 opto
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6316 optocoupler
Abstract: No abstract text available
Text: SFH6315 SFH6316 SFH6343 SIEMENS HIGH SPEED OPTOCOUPLER FEATURES Surface Mountable Industry Standard SOIC-8 Footprint Com patible with Infrared Vapor Phase Reflow and Wave Soldering Processes Isolation Voltage, 2500 VRMS Very High Common M odeTransient Immunity:
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PDF
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SFH6343)
SFH6315--
HCPL0500
SFH6316--
HCPL0501
SFH6343--
HCPL0453
SFH6315
SFH6316
SFH6343
6316 optocoupler
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soic8 footprint
Abstract: K0452 6N135 6N136 E55361 HCPL-0452 HCPL-0453 HCPL-0500 HCPL-0501 HCPL-45
Text: Whn\ HEWLETT PACKARD Small Outline High Speed Optocouplers Technical Data Features • Surface Mountable • Industry Standard SOIC-8 Footprint • Compatible with Infrared Vapor Phase Reflow and Wave Soldering Processes • Very High Common Mode Transient Immunity:
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HCPL-0500
HCPL-0501
HCPL-0452
HCPL-0453
HCPL-0453)
E55361)
soic8 footprint
K0452
6N135
6N136
E55361
HCPL-45
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