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    FLOTHERM MOSFET Search Results

    FLOTHERM MOSFET Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MG800FXF1JMS3 Toshiba Electronic Devices & Storage Corporation N-ch SiC MOSFET Module, 3300 V, 800 A, iXPLV, High-side: SiC SBD、Low-side: SiC MOSFET Visit Toshiba Electronic Devices & Storage Corporation
    TK190U65Z Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 650 V, 15 A, 0.19 Ohm@10V, TOLL Visit Toshiba Electronic Devices & Storage Corporation
    TK7R0E08QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 64 A, 0.0070 Ohm@10V, TO-220AB Visit Toshiba Electronic Devices & Storage Corporation
    XPJ1R004PB Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 160 A, 0.001 Ω@10V, S-TOGL Visit Toshiba Electronic Devices & Storage Corporation
    TK4K1A60F Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 600 V, 2.0 A, 4.1 Ohm@10V, TO-220SIS Visit Toshiba Electronic Devices & Storage Corporation

    FLOTHERM MOSFET Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    BUK9K85-80E

    Abstract: LFPAK56D BUK9K25-40E BUK7K8R7-40E BUK9K13-60E BUK7K18-40E BUK9K5R1-30E BUK9K21-80E FLOTHERM MOSFET LFPAK56
    Text: NXP Automotive LFPAK56D MOSFETs High Reliability Dual Power-S08 for Automotive Applications LFPAK56D takes the initiative to further reduce the footprint size of the typical automotive electronics module. The migration from DPAK to LFPAK56 Power-S08 now continues to


    Original     		PDF LFPAK56D Power-S08 LFPAK56 Power-S08) LFPAK56D LFPAK56. BUK9K85-80E BUK9K25-40E BUK7K8R7-40E BUK9K13-60E BUK7K18-40E BUK9K5R1-30E BUK9K21-80E FLOTHERM MOSFET LFPAK56

    Untitled

    Abstract: No abstract text available
    Text: AN11470 Leadless Schottky diodes in a DC-to-DC step-up converter Rev. 1 — 22 April 2014 Application note Document information Info Content Keywords Schottky diode, boost converter, LED backlight, current source Abstract This application note discusses the application of DC-to-DC voltage up


    Original     		PDF AN11470

    Si7336ADP

    Abstract: FLOTHERM MOSFET
    Text: Tool Eases Modeling of Power MOSFETs By Kandarp Pandya, Senior Staff Application Engineer, Vishay Siliconix, Santa Clara, Calif. An online tool performs thermal simulation of vendor’s MOSFETs with high accuracy, but is faster and easier to use than programs based on


    Original     		PDF Si7336ADP FLOTHERM MOSFET

    Untitled

    Abstract: No abstract text available
    Text: AN11113 LFPAK MOSFET thermal design guide - Part 2 Rev. 2 — 16 November 2011 Application note Document information Info Content Keywords LFPAK, MOSFET, thermal analysis, design and performance, thermal considerations, thermal resistance, thermal vias, SMD, surface-mount,


    Original     		PDF AN11113 AN10874)

    Untitled

    Abstract: No abstract text available
    Text: AN11113 LFPAK MOSFET 热设计指南 - 第二部分 修订版：2 — 2011 年 11 月 16 日 应用笔记 文档信息 项目 内容 关键字 LFPAKMOSFET、热分析、设计与性能、散热考虑、热阻、散热孔、SMD、 表面贴装， PCB 设计、密封壳体、底部冷却、顶部冷却。


    Original     		PDF AN11113 AN10874ï

    CQ206

    Abstract: dual MOSFET Module TYCO module FLOTHERM MOSFET holman pro 469 Q206 U100 flotherm
    Text: Technical Note May 2002 An Evaluation of Board-Mounted Power Module Packages Contributed by: Frank Liang, Karl E. Wolf, V. Joseph Thottuvelil, and George Alameel This Technical Note is based on a paper presented at the Applied Power Electroncs Conference 2002


    Original     		PDF TN02-001EPS CQ206 dual MOSFET Module TYCO module FLOTHERM MOSFET holman pro 469 Q206 U100 flotherm

    EMC for PCB Layout

    Abstract: thermal analysis on pcb AN10874 LFPAK package pcb thermal Design guide JESD51-2
    Text: AN10874 LFPAK MOSFET thermal design guide Rev. 01 — 19 November 2009 Application note Document information Info Content Keywords LFPAK, MOSFET, thermal analysis, design and performance, thermal considerations, thermal resistance, junction to ambient, junction to


    Original     		PDF AN10874 JESD51, AN10874 EMC for PCB Layout thermal analysis on pcb LFPAK package pcb thermal Design guide JESD51-2

    EMC for PCB Layout

    Abstract: AN10874 thermal analysis on pcb JESD51-2
    Text: AN10874 LFPAK MOSFET thermal design guide Rev. 02 — 27 January 2011 Application note Document information Info Content Keywords LFPAK, MOSFET, thermal analysis, design and performance, thermal considerations, thermal resistance, junction to ambient, junction to


    Original     		PDF AN10874 JESD51, EMC for PCB Layout AN10874 thermal analysis on pcb JESD51-2

    Untitled

    Abstract: No abstract text available
    Text: AN10874 LFPAK MOSFET 热设计指南 版本 1 — 2011 年 3 月 31 日 应用笔记 文档信息 项目 内容 关键词 LFPAKMOSFET、热分析、设计与性能、散热考虑、热阻、结到环境、结 到底座、散热孔、 JESD51、 SMD、表面贴装、 PCB 设计。


    Original     		PDF AN10874 JESD51ã AN10874

    TLD5098

    Abstract: TLD5095 GCM32ER71H475KA55 switching power transistor for switching inductive coil audi 200 Infineon mosfet SMD led spice model Abstract schematic power transistor k 1423
    Text: Inf ineon P o w e r L E D D r i v e r TLD5095 / TLD5098 DC-DC Multitopology Controller IC Dimensioning and Stability Guideline - Theory and Practice Application Note Application Note V1.3, 2011-08-08 by Dieter Parth and Enrico Tonazzo Automotive Power TLD5095 / TLD5098


    Original     		PDF TLD5095 TLD5098 10-step GCM32ER71H475KA55 switching power transistor for switching inductive coil audi 200 Infineon mosfet SMD led spice model Abstract schematic power transistor k 1423

    sio lpc chip intel p4 motherboard

    Abstract: rdi-dmt-1206 980020 NAND RJMG-5312-11-01 Amphenol RJMG intel 810 MOTHERBOARD pcb CIRCUIT rdi DMT-1206 intel 810 MOTHERBOARD pcb CIRCUIT diagram c.i GD75232 smd 82801 g SCHEMATIC DIAGRAM
    Text: Intel 810 Chipset Design Guide June 1999 Order Number: 290657-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability


    Original     		PDF