0402 resistor ipc-7351
Abstract: ch-0505 resistors vishay ch0805 500R CHKIT-0402 CH1206
Text: CH Vishay Sfernice 50 GHz Thin Film Microwave Resistors FEATURES • SMD wraparound or flip chip resistor • Small size, down to 20 by 16 mils • Edged trimmed block resistors • Pure alumina substrate 99.5 % • Various terminations: • Pre-tinned over nickel barrier (wraparound or flip chip)
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2002/95/EC
18-Jul-08
0402 resistor ipc-7351
ch-0505
resistors vishay
ch0805
500R
CHKIT-0402
CH1206
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PDF
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0402 resistor ipc-7351
Abstract: ch-0505 500R CH1206 vishay 0603 SMD resistors ,vishay 0805 SMD resistors 0.050 ch0805
Text: CH Vishay Sfernice 50 GHz Thin Film Microwave Resistors FEATURES • SMD wraparound or flip chip resistor • Small size, down to 20 by 16 mils • Edged trimmed block resistors • Pure alumina substrate 99.5 % • Various terminations: • Pre-tinned over nickel barrier (wraparound (N) or flip
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Original
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2002/95/EC
18-Jul-08
0402 resistor ipc-7351
ch-0505
500R
CH1206
vishay 0603 SMD resistors
,vishay 0805 SMD resistors 0.050
ch0805
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PDF
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IPC-7351A
Abstract: resistor chip 0402 resistor ipc-7351
Text: CH Vishay Sfernice 50 GHz Thin Film Microwave Resistors FEATURES • SMD wraparound or flip chip resistor • Small size, down to 20 mils by 16 mils • Edged trimmed block resistors • Pure alumina substrate 99.5 % • Various terminations: • Pre-tinned over nickel barrier (wraparound (N) or flip
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2002/95/EC
18-Jul-08
IPC-7351A
resistor chip
0402 resistor ipc-7351
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PDF
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0603 footprint IPC
Abstract: 0402 land pattern
Text: CH Vishay Sfernice 50 GHz Thin Film Microwave Resistors FEATURES • SMD wraparound or flip chip resistor • Small size, down to 20 mils by 16 mils • Edged trimmed block resistors • Pure alumina substrate 99.5 % • Various terminations: • Pre-tinned over nickel barrier (wraparound (N) or flip
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2002/95/EC
2011/65/EU
2002/95/EC.
2011/65/EU.
12-Mar-12
0603 footprint IPC
0402 land pattern
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PDF
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IPC-7351a
Abstract: 0603 footprint IPC 500R 0402 land pattern 10R50
Text: CH Vishay Sfernice 50 GHz Thin Film Microwave Resistors FEATURES • SMD wraparound or flip chip resistor • Small size, down to 20 mils by 16 mils • Edged trimmed block resistors • Pure alumina substrate 99.5 % • Various terminations: • Pre-tinned over nickel barrier (wraparound (N) or flip
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2002/95/EC
11-Mar-11
IPC-7351a
0603 footprint IPC
500R
0402 land pattern
10R50
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PDF
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resistor 1005
Abstract: 500R CH0402
Text: CH Vishay Sfernice Thin Film Microwave Resistors FEATURES • Small size, down to 20 by 16 mils • Edged trimmed block resistors RoHS COMPLIANT • Pure alumina substrate 99.5 % • Various terminations: • Pre-tinned over nickel barrier (wraparound or flip chip)
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18-Jul-08
resistor 1005
500R
CH0402
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PDF
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Untitled
Abstract: No abstract text available
Text: CH Vishay Sfernice Thin Film Microwave Resistors FEATURES • Small size, down to 20 by 16 mils 0402 P • Edged trimmed block resistors • Pure alumina substrate (99.5%) • Various terminations: 02016 (P) • Pre-tinned over Nickel Barrier (wraparound or flip chip)
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100ppm/
20GHz.
03-Apr-03
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PDF
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1206 pads layout
Abstract: 500R R017 R 1206 resistor
Text: CH Vishay Sfernice Thin Film Microwave Resistors FEATURES • Small size, down to 20 by 16 mils 0402 P • Edged trimmed block resistors • Pure alumina substrate (99.5%) • Various terminations: 02016 (P) • Pre-tinned over Nickel Barrier (wraparound or flip chip)
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100ppm/
20GHz.
-Apr-03
03-Apr-03
1206 pads layout
500R
R017
R 1206 resistor
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PDF
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150 R resistor
Abstract: 500R R5005 CH0402
Text: CH Vishay Sfernice Thin Film Microwave Resistors FEATURES • Small size, down to 20 by 16 mils • Edged trimmed block resistors 0402 P RoHS COMPLIANT • Pure alumina substrate (99.5 %) • Various terminations: • Pre-tinned over Nickel Barrier (wraparound or flip chip)
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08-Apr-05
150 R resistor
500R
R5005
CH0402
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PDF
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Untitled
Abstract: No abstract text available
Text: CH Vishay Sfernice Thin Film Microwave Resistors FEATURES • Small size, down to 20 by 16 mils 0402 P • Edged trimmed block resistors • Pure alumina substrate (99.5%) • Various terminations: 02016 (P) • Pre-tinned over Nickel Barrier (wraparound or flip chip)
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100ppm/
20GHz.
03-Jul-03
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PDF
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resistor 1000W
Abstract: R-017
Text: CH Vishay Sfernice Thin Film Microwave Resistors FEATURES • Small size, down to 20 by 16 mils 0402 P • Edged trimmed block resistors • Pure alumina substrate (99.5%) • Various terminations: 02016 (P) • Pre-tinned over Nickel Barrier (wraparound or flip chip)
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Original
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100ppm/
20GHz.
01-Mar-04
resistor 1000W
R-017
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PDF
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R-017
Abstract: R017
Text: CH Vishay Sfernice Thin Film Microwave Resistors FEATURES • Small size, down to 20 by 16 mils 0402 P • Edged trimmed block resistors • Pure alumina substrate (99.5%) • Various terminations: 02016 (P) • Pre-tinned over Nickel Barrier (wraparound or flip chip)
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100ppm/
20GHz.
13-Apr-04
R-017
R017
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PDF
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Dupont 9476
Abstract: No abstract text available
Text: ASIC FLIP CHIPS Application Note ASIC Flip Chips: Manufacture and Use By Barbara L. Gibson, Applications Engineer plastic encapsulated device: wire bonds and wire damage during assembly, are avoided. By attaching directly to the substrate without being mounted on a lead frame or
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Untitled
Abstract: No abstract text available
Text: Order this document by MCCF33095/D MCCF33095 MC33095 Advance Information Integral Alternator Regulator The MCCF33095 Flip–Chip and MC33095 (Surface Mount) are regulator control integrated circuits designed for use in automotive 12 V alternator charging systems. Few external components are required for full
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MCCF33095/D
MCCF33095
MC33095
MCCF33095/D*
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vacuum cleaner circuit diagram
Abstract: MC33095 Ultrasonic cleaner circuit diagram Dupont 9476 MC33095D MCCF33095 photoresist proportional control alternator thermal shock Solder Paste Dupont
Text: Order this document by MCCF33095/D MCCF33095 MC33095 Advance Information Integral Alternator Regulator The MCCF33095 Flip–Chip and MC33095 (Surface Mount) are regulator control integrated circuits designed for use in automotive 12 V alternator charging systems. Few external components are required for full
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MCCF33095/D
MCCF33095
MC33095
MCCF33095/D*
vacuum cleaner circuit diagram
MC33095
Ultrasonic cleaner circuit diagram
Dupont 9476
MC33095D
MCCF33095
photoresist
proportional control
alternator thermal shock
Solder Paste Dupont
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PDF
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process flow diagram
Abstract: ignition module MC33095 MC33095D MCCF33095 TDD 1605
Text: Freescale Semiconductor, Inc. Order this document by MCCF33095/D MCCF33095 MC33095 Freescale Semiconductor, Inc. Advance Information Integral Alternator Regulator The MCCF33095 Flip–Chip and MC33095 (Surface Mount) are regulator control integrated circuits designed for use in automotive 12 V
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MCCF33095/D
MCCF33095
MC33095
MCCF33095/D*
process flow diagram
ignition module
MC33095
MC33095D
MCCF33095
TDD 1605
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PDF
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NATIONAL SEMICONDUCTOR ink MARKING
Abstract: Die Attach epoxy stamping cte table flip chip substrate cte table ic bga JESD 49 gold wire bond failures due to ultrasonic cleaning Aluminum alloys physical properties FLIP CHIP PRODUCTS micro machine thermal conductivity coefficient of thermal expansion of thermal conductive pressure sensitive adhesive
Text: September 2000 Die Products Business Unit as watches, calculators and smart cards as well as leading edge multiple die applications like cellular handsets and digital cameras. Better device performance utilizing die show up in processor modules for computers, workstations and servers as
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EP4CE6 package
Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
Text: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead
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DS-PKG-16
EP4CE6 package
EP4CE40
Altera EP4CE6
EP4CE55
5M240Z
5M1270Z
QFN148
5m570z
5M40
5M80
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PDF
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capture and electronic packaging
Abstract: Flip Chip Substrate tolerance thermal conductivity of substrate chip pads layout dram layout structure Pb210
Text: Designing for Cost Effective Flip Chip Technology Jack Bogdanski White Electronic Designs Corp. Designing for Cost Effective Flip Chip Technology Designing For Cost Effective Flip Chip Technology Bump and flip approaches to semiconductor packaging have gained acceptance
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EP4CE15
Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
Text: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead
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DS-PKG-16
EP4CE15
MS 034
BGA and QFP Altera Package mounting
Altera pdip top mark
jedec package MO-247
SOIC 20 pin package datasheet
QFN "100 pin" PACKAGE thermal resistance
Theta JC of FBGA
QFN148
EP4CE22
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PDF
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Pb210
Abstract: flip chip substrate tolerance
Text: Designing for Cost Effective Flip Chip Technology Application Note DESIGNING FOR COST EFFECTIVE FLIP CHIP TECHNOLOGY Bump and flip approaches to semiconductor packaging have gained acceptance in the industry. For the designer to take full advantage of this technology, attention to bump
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AN0039
Pb210
flip chip substrate tolerance
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PDF
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srf 1714
Abstract: PV22-3
Text: El PV SERIES Piconics PV series has gold plated contact areas for bonding interconnecting leads. The bottom of the ceramic chip has a heavy gold plating for bonding the coil to a substrate. Please note that the PV series can be made with special substrate geometries for flip chip bonding. The core is slide tuned and may be fixed
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OCR Scan
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M83446
M83446/17.
MIL-STD-202,
srf 1714
PV22-3
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PDF
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Flip Chip Substrate
Abstract: Dupont 9476
Text: ASIC Flip Chips: Manufacture and Use ! ir i v i t : ì I>mmi . Introduction Application specific integrated circuits ASICs have been available and widely used for almost two decades. On the other hand, the surface mount technology known as "Flip Chip” has been available, but not widely known outside of
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OCR Scan
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17ces
Flip Chip Substrate
Dupont 9476
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PDF
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it1338
Abstract: Solder Paste Dupont
Text: ASIC Flip Chips: Manufacture and Use fôv H . i r b t i r a I . i i h s o n , A p p l i c a t i o n s F n i» i iu 't * i Introduction plastic encapsulated device: wire bonds and wire damage during assembly, are avoided. By attaching directly to the substrate without being mounted on a lead frame or
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PDF
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