TBF-2012-245-R1
Abstract: 10GHz bandpass filter 9th 2012 ATT1805-1830 TBF-2012-190-T1 TBF-2520-190-A1 TBF-2520-190-B1 TBF-2520-190-B3 TBF-2520-245-A1 TBF-2520-245-A2
Text: Thin Film Chip L,C filter Now under development Excellent loss characteristic Small size and low tap FEATURES Realized high performance LPF for GSM/DCS in chip size 1.0ϫ0.5ϫ0.3mm Example of application and its Characteristic Low-Pass Filter LPF for GSM
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LiNb03
75GHz,
25GHz,
00GHz,
50GHz,
50GHz)
99th/BAbsorptive)
TBF-2012-245-R1
10GHz bandpass filter
9th 2012
ATT1805-1830
TBF-2012-190-T1
TBF-2520-190-A1
TBF-2520-190-B1
TBF-2520-190-B3
TBF-2520-245-A1
TBF-2520-245-A2
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mt6611
Abstract: RFECA3216060A1T RFLPF1608060A0T RGCMF1210080M3T VZ1206M260AGT RFBPF1608070A0T RFCMF1220100M4T Diplexer RFANT7635110A1T RFBPB2012090A1T
Text: w w w. p a s s i v e c o m p o n e n t . c o m INDEX Subject Page ORDERING CODE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1~3 CHIP ANTENNA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4~9
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575GHz
VZ1206M380AGT
VZ1206M450AGT
VZ1206M560AGT
VZ1206M650AGT
VZ1206M850AGT
mt6611
RFECA3216060A1T
RFLPF1608060A0T
RGCMF1210080M3T
VZ1206M260AGT
RFBPF1608070A0T
RFCMF1220100M4T
Diplexer
RFANT7635110A1T
RFBPB2012090A1T
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gps 5350
Abstract: 0900BL18B100 0868AT43A0020 0896bm15a0001 0900BL18B200 2450dp15e5400 22J100 0915L 0910CF15B0100 5500bl15u0100
Text: Integrated Passive Components Johanson Technology has developed a line of small, highly reliable RF ceramic components manufactured with a proprietary LTCC low temperature co-fired ceramic process. These components operate over several bands from 900MHz to 6 GHz covering Cellular, DECT, WLAN,
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900MHz
39-1B
39-1C
39-1D
39-2B
39-3B
39-3C
gps 5350
0900BL18B100
0868AT43A0020
0896bm15a0001
0900BL18B200
2450dp15e5400
22J100
0915L
0910CF15B0100
5500bl15u0100
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RFLPF2012110A0T
Abstract: ltcc chip RFLPF LTCC X band
Text: Walsin Technology Corporation LTCC Multi Layer Chip Low Pass Filter For ISM Band 2.4GHz Application FEATURES Patent Pending CONSTRUCTION 3 Miniature footprint: 2.00 x 1.25 x 1.05 mm . Low Insertion loss 0.7 dB Typical 0.3dB@2.4GHz High attenuation on 2nd and 3rd harmonic suppressed
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RFLPF2012110A0T
RFLPF2012110A0T
ltcc chip
RFLPF
LTCC X band
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50S11
Abstract: RFBPF2520120A3T ltcc chip RFBPF RF LTCC Filter
Text: Walsin Technology Corporation LTCC Multi Layer Chip Band Pass Filter – RFBPF2520120A3T Series For ISM Band 2.4GHz Application FEATURES CONSTRUCTION 3 Miniature footprint: 2.5 X 2.0 X 1.2 mm . Low Insertion loss. High Rejection Rate nd High attenuation on 2
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RFBPF2520120A3T
900MHz
11b/g
RFBPF2520120A3T
50S11
ltcc chip
RFBPF
RF LTCC Filter
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Walsin Technology
Abstract: RFBPF2520120A2T RFBPF
Text: Walsin Technology Corporation LTCC Multi Layer Chip Band Pass Filter – RFBPF2520120A2T Series For ISM Band 2.4GHz Application FEATURES CONSTRUCTION 3 Miniature footprint: 2.5 X 2.0 X 1.2 mm . Low Insertion loss 1.5 dB typically. High Rejection Rate nd High attenuation on 2
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RFBPF2520120A2T
900MHz
11b/g
RFBPF2520120A2T
Walsin Technology
RFBPF
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RFBPF2520120A2T
Abstract: ltcc chip RFBPF filter Chip Low Pass 2450 MHz
Text: Walsin Technology Corporation LTCC Multi Layer Chip Band Pass Filter – RFBPF2520120A2T Series For ISM Band 2.4GHz Application FEATURES CONSTRUCTION 3 Miniature footprint: 2.5 X 2.0 X 1.2 mm . Low Insertion loss 1.5 dB typically. High Rejection Rate nd High attenuation on 2
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RFBPF2520120A2T
900MHz
11b/g
RFBPF2520120A2T
ltcc chip
RFBPF
filter Chip Low Pass 2450 MHz
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RFBPF2520120A1T
Abstract: RFBPF
Text: Walsin Technology Corporation LTCC Multi Layer Chip Band Pass Filter – RFBPF2520120A1T Series For ISM Band 2.4GHz Application FEATURES CONSTRUCTION 3 Miniature footprint: 2.5 X 2.0 X 1.2 mm . Low Insertion loss 1.5 dB typically. High Rejection Rate nd High attenuation on 2
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RFBPF2520120A1T
900MHz
Wire50
11b/g
RFBPF2520120A1T
RFBPF
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Untitled
Abstract: No abstract text available
Text: Multilayer Chip LC Filter Low pass – SLFL Series Operating Temp. : -40℃~+85℃ FEATURES z z z z z Small size, light weight Low insertion loss Inside shielding SMD chip based on LTCC technology Centre frequencies and responses are ready for customization
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-2R450G
0R847G
SLFL31-0R560G-01TF
400MHz
660MHz
3000MHz
560MHz
SLFL31-2R450G-E1TF
5500MHz
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212B245021
Abstract: BC3 csr CSR BC3 datasheet 212B 212C FI 212B245021 P438 2400-2500MHz bluetooth CSR bc3
Text: 高周波積層チップフィルタ HIGH FREQUENCY MULTILAYER CHIP FILTER OPERATING TEMP. ー30~+85℃ 特長 FEATURES ・Compact , Lower profile ・Low loss , High attenuation ・Stable temperature characteristics ・小型・低背 ・低ロス・高減衰
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LCB22G0205B3
Abstract: LCB22M2450B1 LCB22G0205A3 LCB10B2450K3 LCL10T2500A1 LTCC BPF LCB21B2450Q1 LCL10T3550A1 diplexer LTCC GHz
Text: LC Filter Chip LC filter made by our own RF design and LTCC fabrication technology has excellent products with low loss and good attenuation characteristics General Features High Attenuation, Low Insertion Loss Small and Thin size Lead free Applications
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MOBILE jammer circuit diagram
Abstract: No abstract text available
Text: TRF1115 www.ti.com SLWS174B – APRIL 2005 – REVISED SEPTEMBER 2006 2.5-GHz, High Dynamic Range, Low-Noise Down-Converter FEATURES • • • • • • 20 19 18 17 16 RFAGC MXRPB TRF1115 TOP VIEW MXRI • DEVICE INFORMATION GND • • Performs First Down-Conversion in MMDS /
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TRF1115
SLWS174B
MOBILE jammer circuit diagram
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BRF6300
Abstract: BC5 CSR CSR BC5 brf6150 P434 diplexer fi168l Bluetooth CSR BC5
Text: 当社製品に関するお断り 当社製品をご使用頂く際には事前に必ずお読み下さい。 注 意 • 当カタログの記載内容は2008年10月現在のものです。記載内容は改良などのために予告なく変更することがあります。従いま
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535458586106kPa
2657086106kPa
203560RH
BRF6300
BC5 CSR
CSR BC5
brf6150
P434
diplexer
fi168l
Bluetooth CSR BC5
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ASTX-11
Abstract: ABM11 ASDMB
Text: The Power of Linking Together CRYSTALS & RESONATORS OSCILLATORS FILTERS PRECISION TIMING MAGNETICS A BRA C ON COR POR AT ION PROD U CT C ATA LO G S E C T I O N P A G E CRYSTALS & RESONATORS .1
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ALPT-03
ALPT-04
ALPT-06
ASTX-11
ABM11
ASDMB
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AMBE software
Abstract: No abstract text available
Text: AMBE-3000F Vocoder Chip Users Manual Version 3.3 March, 2013 DVSI Confidential Proprietary AMBE-3000F™ Vocoder Chip Users Manual Version 3.3, March, 2013 AMBE-3000F™ Vocoder Chip Users Manual Version 3.3 March, 2013 The most up to date version of the manual is always available at www.dvsinc.com
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AMBE-3000Fâ
makes2012
PCM3500
AMBE software
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SWRU190
Abstract: cc2520 balun MSP430F2618 CC2520 CC2591EM TIMAC da000705 CC2520 CC2520EM CC2591 planar inverted f antenna
Text: Application Note AN065 Using CC2591 Front End with CC2520 By Charlotte Seem and Espen Slette Keywords • • • • • 1 • • • • 2.4 GHz IEEE 802.15.4 systems ZigBee systems Z-Stack TI-MAC Range Extender External PA External LNA CC2520 CC2591
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AN065
CC2591
CC2520
CC2591
CC2520
SWRU190
cc2520 balun
MSP430F2618 CC2520
CC2591EM
TIMAC
da000705
CC2520EM
planar inverted f antenna
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CSR BC5
Abstract: CSR BC4 BRF6150 brf6300 bluetooth module BC4 CSR BC4 bluetooth FI212P 212P089208 BC3 csr FI168B
Text: Notice for TAIYO YUDEN products Please read this notice before using the TAIYO YUDEN products. REMINDERS • Product information in this catalog is as of October 2010. All of the contents specified herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the latest information carefully before practical application or usage of the Products.
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FI325P
Abstract: FI325P120057 168P245010 168P157519 212P089213 168p1 chipfilter01 FI212B 212P085912 212P089208
Text: Notice for TAIYO YUDEN products Please read this notice before using the TAIYO YUDEN products. REMINDERS • Product information in this catalog is as of October 2011. All of the contents specified herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the latest information carefully before practical application or usage of the Products.
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Untitled
Abstract: No abstract text available
Text: NO.MLPGE10033 SPECIFICATIONS HIGH FREQUENCY MULTILAYER CHIP FILTER FI 212C245051-T TAIYO YUDEN CO., LTD. Date: 20.0ct.2010 HIGH FREQUENCY MULTILAYER CHIP FILTER Table of Contents 1. Scope 2. Part Numbering System 3. Electrical specification 3-1 Electrical Characteristics
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MLPGE10033
212C245051-T
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Untitled
Abstract: No abstract text available
Text: No. MLPGE11006 PRODUCT SPECIFICATION P /N : FI 212C 245034-T T yp e : M ULTILAYER FILTER Soldering : R eflow only Issue date: 14.Feb.2011 A pplicable products to RoHS restriction TAIYO YUDEN CO., LTD. MULTILAYER FILTER Table of Contents 1. Scope 2. Part Numbering System
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MLPGE11006
245034-T
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Untitled
Abstract: No abstract text available
Text: No. MLPGE11004 PRODUCT SPECIFICATION P/N: FI 212C245032-T Type: MULTILAYER FILTER Soldering: Reflow only Issue date: 14.Feb.2011 Applicable products to RoHS restriction TAIYO YUDEN CO., LTD. MULTILAYER FILTER Table of Contents 1. Scope 2. Part Numbering System
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MLPGE11004
212C245032-T
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Untitled
Abstract: No abstract text available
Text: NO.MLPGE10011 SPECIFICATIONS H IG H F R E Q U E N C Y M U L T IL A Y E R C H IP F IL T E R FI 212B245027-T T A IY O Y U D E N C O ., LTD . Date: 30.Apr.2010 HIGH FREQUENCY MULTILAYER CHIP FILTER Table of Contents 1. Scope 2. Part Numbering System 3. Electrical specification
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MLPGE10011
212B245027-T
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Untitled
Abstract: No abstract text available
Text: NO.MLPGE10008 SPECIFICATIONS HIGH FREQUENCY MULTILAYER CHIP FILTER FI 168B245001-T TAIYO YUDEN CO., LTD. Date: 9.Mar.2010 HIGH FREQUENCY MULTILAYER CHIP FILTER Table of Contents 1. Scope 2. Part Numbering System 3. Electrical specification 3-1 Electrical Characteristics
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MLPGE10008
168B245001-T
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LTF3216L
Abstract: FR90A LTF3216L-F2R4G LTF3216L-FR90G LTF3216L-F1R3G HP8719D LTF3216L-FR90gl FR90
Text: TYPE 54 Multilayer Chip Low-Pass Fitter LTF3216L-F Series 7 8tl * y r*? i I:' TYPE LTF3216L-F Series L INPUT MARKING TOKO NUMBER 2R4 ¡D IM E N S IO N S / L mm W (mm) T (mm) a (mm) b (mm) 3.2±0.3 1.6 + 0.3 1. 4 + 0.2 0.5+ 0.3 0.8 ±0.3 Top View Side View
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LTF3216L-F
800MHz
500MHz
LTF3216L-F
LTF3216L-FR90G
LTF3216L-F1
LTF3216L-F2R4G
LTF3216L
FR90A
LTF3216L-F1R3G
HP8719D
LTF3216L-FR90gl
FR90
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