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    FILM FRAME CARRIER PACKING Search Results

    FILM FRAME CARRIER PACKING Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    ADG1519BCPZ-RL7 Analog Devices 8-Lead Lead Frame Chip Scale P Visit Analog Devices Buy
    ADRV1CRR-FMC Analog Devices SDR Module Carrier/FMC Carrier Visit Analog Devices Buy
    ADPA7004CHIP-SX Analog Devices Sample Pack Visit Analog Devices Buy
    EV-SOMCRR-EZKIT Analog Devices SOM Carrier EZKIT Evaluation B Visit Analog Devices Buy
    ADL6010CHIPS-SX Analog Devices ADL6010 Chip Sample Pack Visit Analog Devices Buy

    FILM FRAME CARRIER PACKING Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    X3G-OH047

    Abstract: X3G-OH048 X3T-OH047 X3T-OH048 X3G_T_OH047_048 KMZ44 rp2 position sensor
    Text: X3G-OH047; X3T-OH047; X3G-OH048; X3T-OH048 Magnetic field sensor Rev. 1 — 4 April 2011 Product specification 1. Product profile 1.1 General description The X3G-OH047, X3G-OH048, X3T-OH047 and X3T-OH048 are sensitive magnetic field sensors, employing the magneto-resistive effect of thin film permalloy. The sensors


    Original     		PDF X3G-OH047; X3T-OH047; X3G-OH048; X3T-OH048 X3G-OH047, X3G-OH048, X3T-OH047 X3T-OH048 X3G-OH047 X3G-OH048 X3G_T_OH047_048 KMZ44 rp2 position sensor

    Untitled

    Abstract: No abstract text available
    Text: X3G-OH047; X3T-OH047; X3G-OH048; X3T-OH048 Magnetic field sensor Rev. 1 — 4 April 2011 Product specification 1. Product profile 1.1 General description The X3G-OH047, X3G-OH048, X3T-OH047 and X3T-OH048 are sensitive magnetic field sensors, employing the magneto-resistive effect of thin film permalloy. The sensors


    Original     		PDF X3G-OH047; X3T-OH047; X3G-OH048; X3T-OH048 X3G-OH047, X3G-OH048, X3T-OH047 X3T-OH048

    Silicon Controlled Rectifier Manual

    Abstract: jedec tray bare die JESD 49 JESD-49 AN-1060 Three bond soft solder die bonder AN1060
    Text: Application Note AN-1060 Bare Die: Handling and Storage By Richard Clark Table of Contents Page Introduction .1 Packing/Carrier Type .1


    Original     		PDF AN-1060 Silicon Controlled Rectifier Manual jedec tray bare die JESD 49 JESD-49 AN-1060 Three bond soft solder die bonder AN1060

    Sony ACF

    Abstract: IC 452 in pqc ADE407-001H ANISOLM induction cooker component list on pcb induction furnace hd66131 INCOMING RAW MATERIAL INSPECTION format induction heating cooker MARKING CODE N-CHANNEL MOS FIELD EFFECT TRANSISTOR
    Text: Hitachi LCD Controller/Driver DATA BOOK ADE407-001H 8/98 Hitachi Ltd. MC-Setsu Contents GENERAL INFORMATION Quick Reference Guide.


    Original     		PDF ADE407-001H August1998 Sony ACF IC 452 in pqc ADE407-001H ANISOLM induction cooker component list on pcb induction furnace hd66131 INCOMING RAW MATERIAL INSPECTION format induction heating cooker MARKING CODE N-CHANNEL MOS FIELD EFFECT TRANSISTOR

    digital watch circuit

    Abstract: JESD22-A114 JESD22-A115 PCA2000 PCA2001 PCA2002
    Text: PCA2002 32 kHz watch circuit with programmable output period and pulse width Rev. 07 — 5 October 2010 Product data sheet 1. General description The PCA2002 is a CMOS1 integrated circuit for battery operated wrist watches with a 32 kHz quartz crystal as the timing element and a bipolar stepping motor. The quartz


    Original     		PDF PCA2002 PCA2002 digital watch circuit JESD22-A114 JESD22-A115 PCA2000 PCA2001

    induction furnace

    Abstract: induction cooker component list on pcb induction furnace manual cmos microcircuit catalog ANISOLM induction heating cooker IC 452 in pqc induction heating furnace MATSUSHITA OSCILLATOR EF INCOMING RAW MATERIAL INSPECTION procedure
    Text: LCD Controller Driver Data Book Application Note 9/1/98 Notice When using this document, keep the following in mind: 1• This document may, wholly or partially, be subject to change without notice. 2• All rights are reserved: No one is permitted to reproduce or duplicate, in any form, the whole or part of


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: PCA2000; PCA2001 32 kHz watch circuit with programmable adaptive motor pulse Rev. 9 — 24 November 2011 Product data sheet 1. General description The PCA2000 and PCA2001 are CMOS1 integrated circuits for battery operated wrist watches with a 32 kHz quartz crystal as timing element and a bipolar 1 Hz stepping motor.


    Original     		PDF PCA2000; PCA2001 PCA2000 PCA2001

    Untitled

    Abstract: No abstract text available
    Text: PCA2000; PCA2001 32 kHz watch circuit with programmable adaptive motor pulse Rev. 9 — 24 November 2011 Product data sheet 1. General description The PCA2000 and PCA2001 are CMOS1 integrated circuits for battery operated wrist watches with a 32 kHz quartz crystal as timing element and a bipolar 1 Hz stepping motor.


    Original     		PDF PCA2000; PCA2001 PCA2000 PCA2001

    Untitled

    Abstract: No abstract text available
    Text: PCA2002 32 kHz watch circuit with programmable output period and pulse width Rev. 8 — 25 November 2011 Product data sheet 1. General description The PCA2002 is a CMOS1 integrated circuit for battery operated wrist watches with a 32 kHz quartz crystal as the timing element and a bipolar stepping motor. The quartz


    Original     		PDF PCA2002 PCA2002

    Untitled

    Abstract: No abstract text available
    Text: PCA2002 32 kHz watch circuit with programmable output period and pulse width Rev. 8 — 25 November 2011 Product data sheet 1. General description The PCA2002 is a CMOS1 integrated circuit for battery operated wrist watches with a 32 kHz quartz crystal as the timing element and a bipolar stepping motor. The quartz


    Original     		PDF PCA2002 PCA2002

    mpx2010 schematic

    Abstract: No abstract text available
    Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA MPX2010 MPXT2010 SERIES 10 kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors Motorola Preferred Device The MPX2010/MPXT2010 series silicon piezoresistive pressure sensors provide a very accurate and linear voltage output — directly proportional to the applied pressure.


    Original     		PDF MPX2010/MPXT2010 MPX2010D MPX2012D MPX2010DP MPX2012DP MPX2012DP MPXT2010G7U mpx2010 schematic

    MOA8

    Abstract: Mifare MOB6 module package mifare classic 1k Contactless smart card module specification MOA8 MF1S503x MOB6 Package MIFARE Type Identification Procedure - Application note, BU-ID Document number 0184 MF1S5035DUH clrc632 antenna e purse
    Text: MF1S503x MIFARE Classic 1K - Mainstream contactless smart card IC for fast and easy solution development Rev. 3.1 — 21 February 2011 194031 Product data sheet PUBLIC 1. General description NXP Semiconductors has developed the MIFARE MF1S503x to be used in a contactless


    Original     		PDF MF1S503x MF1S503x MOA8 Mifare MOB6 module package mifare classic 1k Contactless smart card module specification MOA8 MOB6 Package MIFARE Type Identification Procedure - Application note, BU-ID Document number 0184 MF1S5035DUH clrc632 antenna e purse

    Manifold Absolute Pressure sensor

    Abstract: manifold pressure sensor
    Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA MPX4101A Integrated Silicon Pressure Sensor MPXT4101A SERIES Manifold Absolute Pressure Sensor On-Chip Signal Conditioned, INTEGRATED PRESSURE SENSOR 15 to 102 kPa 2.18 to 14.8 psi 0.25 to 4.95 V Output Temperature Compensated


    Original     		PDF MPX4101A MPX4101A/MPXT4101A MPX4101AP MPX4101AS MPX4101ASX MPX4101A Manifold Absolute Pressure sensor manifold pressure sensor

    6C15

    Abstract: Icode antenna design str 6707 diagram guide ICODE Coil design guide IBIS wafer map format -250/IBIS wafer map format
    Text: INTEGRATED CIRCUITS SL1 ICS31 01 Bumped I•CODE1 Label IC 97pF (IC with Bumps) Chip Specification Product Specification Revision 1.3 Public Philips Semiconductors January 2005 1 Contents 1 CONTENTS 2 2 DEFINITIONS 4 2.1 2.2 Life Support Applications . 4


    Original     		PDF ICS31 6C15 Icode antenna design str 6707 diagram guide ICODE Coil design guide IBIS wafer map format -250/IBIS wafer map format

    Mifare MOB6 module package

    Abstract: mob6 package mifare classic 1k MIFARE Card Coil Design Guide nxp MOB6 MIFARE Classic Command SOT500-2 package outline Contactless Smart Card Module Specification MOB6 MIFARE Card IC Coil Design Guide MOA4 package specification
    Text: MF1S503x MIFARE Classic 1K - Mainstream contactless smart card IC for fast and easy solution development Rev. 3.0 — 2 December 2010 194030 Product data sheet PUBLIC 1. General description NXP Semiconductors has developed the MIFARE MF1S503x to be used in a contactless


    Original     		PDF MF1S503x MF1S503x Mifare MOB6 module package mob6 package mifare classic 1k MIFARE Card Coil Design Guide nxp MOB6 MIFARE Classic Command SOT500-2 package outline Contactless Smart Card Module Specification MOB6 MIFARE Card IC Coil Design Guide MOA4 package specification

    ICS30

    Abstract: "reset quiet bit" 6C15 ICODE1 Label ICs
    Text: INTEGRATED CIRCUITS SL1 ICS30 01 Bumped I•CODE1 Label IC IC with Bumps Chip Specification Product Specification Revision 2.2 Public Philips Semiconductors January 2005 1 Chip Specification Rev. 2.2 January 2005 1 Contents 1 CONTENTS 2 2 DEFINITIONS 4 2.1


    Original     		PDF ICS30 "reset quiet bit" 6C15 ICODE1 Label ICs

    ELECTROGLAS APPLICATIONS - WAFER TEST DATA FILE

    Abstract: ICODE1 Label ICs wafer map
    Text: INTEGRATED CIRCUITS SL1 ICS30 01 Bumped I•CODE1 Label IC IC with Bumps Chip Specification Product Specification Revision 2.1 Public Philips Semiconductors April 2000 I•CODE1 Chip Specification Rev. 2.1 April 2000 1 Contents 1 CONTENTS 2 2 DEFINITIONS


    Original     		PDF ICS30 ELECTROGLAS APPLICATIONS - WAFER TEST DATA FILE ICODE1 Label ICs wafer map

    ed28 smd diode

    Abstract: hv 102 mos fet transistor diagram of high frequency pvc welding machine schematic diagram of electric cookers Ultrasonic Cleaner schematic engel injection machines TEG 2423 40khz ULTRASOUND CLEANER ultrasonic generator 40khz for cleaning schematic of trigger 555 n-mosfet
    Text: FAILURE MECHANISMS OF SEMICONDUCTOR DEVICES III. FAILURE MECHANISMS OF SEMICONDUCTOR DEVICES 1. INTRODUCTION 2. FAILURE MECHANISMS AND SCREENING 3. FAILURE MECHANISMS ATTRIBUTED TO WAFER FABRICATION PROCESS 3.1 HOT CARRIER 3.3.1.1 INTRODUCTION 3.3.1.2 HOT CARRIER MECHANISM


    Original     		PDF ED-4701-1 C-113: ed28 smd diode hv 102 mos fet transistor diagram of high frequency pvc welding machine schematic diagram of electric cookers Ultrasonic Cleaner schematic engel injection machines TEG 2423 40khz ULTRASOUND CLEANER ultrasonic generator 40khz for cleaning schematic of trigger 555 n-mosfet

    sem 2106 inverter diagram

    Abstract: induction cooker schematic diagram automatic brake failure indicator and engine heating alarm working principles of dc fan in toshiba air conditioner atm with an eye seminar report sem 2106 inverter transistor smd marking mx ODOMETER transistor 9015 c sem 2106 manual
    Text: This version: Jan. 1998 Previous version: Nov. 1996 E2S0001-27-Y3 Introduction Thank you for supporting OKI Semiconductor products. In the rapidly advancing electronics industry, types of semiconductor applications are diversified, and customer demands for


    Original     		PDF E2S0001-27-Y3 MIL-STD-883 MIL-STD-202 sem 2106 inverter diagram induction cooker schematic diagram automatic brake failure indicator and engine heating alarm working principles of dc fan in toshiba air conditioner atm with an eye seminar report sem 2106 inverter transistor smd marking mx ODOMETER transistor 9015 c sem 2106 manual

    pressure sensor MPX

    Abstract: schematic sensor mpx2200 344C 10 pin MPX2202gp
    Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA 200 kPa On-Chip Temperature Compensated & Calibrated Pressure Sensors MPX2202 MPXV2202G SERIES The MPX2202/MPXV2202G device series is a silicon piezoresistive pressure sensor providing a highly accurate and linear voltage output — directly proportional to the


    Original     		PDF MPX2202/MPXV2202G MPX2202 MPX2202A MPX2202D MPX2202DP MPX2202AP MPX2202GP MPX2202ASX MPX2202GSX MPX2202GVP pressure sensor MPX schematic sensor mpx2200 344C 10 pin

    344D

    Abstract: MPX 1,45 psi
    Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA 100 kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors The MPX2102/MPXV2102G series device is a silicon piezoresistive pressure sensor providing a highly accurate and linear voltage output — directly proportional to the


    Original     		PDF MPX2102/MPXV2102G MPX2102 MPX2102A MPX2102D MPX2102DP MPX2102AP MPX2102GP MPX2102ASX MPX2102GSX MPX2102GVP 344D MPX 1,45 psi

    Untitled

    Abstract: No abstract text available
    Text: MOTOROLA Freescale Semiconductor, Inc. SEMICONDUCTOR TECHNICAL DATA Freescale Semiconductor, Inc. 100 kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors The MPX2102/MPXV2102G series device is a silicon piezoresistive pressure sensor


    Original     		PDF MPX2102/MPXV2102G MPX2102A MPX2102D MPX2102DP MPX2102AP MPX2102GP MPX2102ASX MPX2102GSX MPX2102GVP

    SMD Hall sensors

    Abstract: surface mount circuit board "bond pad" conductor
    Text: OPTEK TECHNOLOGY INC 4ÔE D M ^ÔSÔO 0DD12fll CHb • OT* - T 'H Z S I OPTO HYBRID FEATURES Chip-on-board design can provide several advantages: SIZE: Used where the function cannot be accomplished with conventional through hole, leaded components. Space savings can be as much as 80% as compared with discrete packaged parts.


    OCR Scan     		PDF

    rkm 34 transistor

    Abstract: RKM 24 sm transistor rkm 21 transistor diode t95 mark J5 SOT-89 CRB20 T95 Diode sot36 rkm 45 transistor TS11
    Text: Packing Monolithic ICs P ackage SOP QFP 2 Taping package SOP8 - 28 pin) P ackaging type Tube A rranged in pla stic tu b e s (antistatic treated) Taping (8 - 28 pins only) SOP ICs adh e re d to a tape and w ound on a reel Pallet H oused in individual cells on stacked


    OCR Scan     		PDF 20pin 24pin 28pin 4x280 5x400 QFP32. 44pin SQFP56pin QFP64, 80pin rkm 34 transistor RKM 24 sm transistor rkm 21 transistor diode t95 mark J5 SOT-89 CRB20 T95 Diode sot36 rkm 45 transistor TS11