a1684
Abstract: 4x12 B82476-A1103-M B82476-A1104-M B82476-A1102-M B82476-A1684-M B82476A1104M
Text: EPCOS SMT Power Inductor Product Family Name B82476-A. Date Version 18.05.2004 1.00 Construction Element Material group Materials CAS min if applicable Active Part Metals Copperwire enameled 7440-50-8 Compounds Ferrite Fe2O3/NiO/ZnO 12645-50-0 Metals
|
Original
|
PDF
|
B82476-A.
B82476-A1102-Mare
a1684
4x12
B82476-A1103-M
B82476-A1104-M
B82476-A1102-M
B82476-A1684-M
B82476A1104M
|
Untitled
Abstract: No abstract text available
Text: HM33-10040LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core Element Composition Iron III Oxide (Fe2O3) Manganese(II) Oxide (MnO) Zinc Oxide (ZnO) Phenolic Resin Phenolic Resin Wood Flour Magnesium Hydrate
|
Original
|
PDF
|
HM33-10040LF
3300LD-1
C13H14N2
|
a1684
Abstract: B82478-A1103-M B82478-A1104-M B82478-A1684-M B82478A1104M
Text: EPCOS SMT Power Inductor Product Family Name B82478-A. Date Version 29.10.2003 1.00 Construction Element Material group Materials CAS min if applicable Active Part Metals Copper wire enameled 7440-50-8 Compounds Ferrite Fe2O3/MnO/ZnO Metals Cu 7440-22-4
|
Original
|
PDF
|
B82478-A.
B82478-A1103-M
B8247are
a1684
B82478-A1103-M
B82478-A1104-M
B82478-A1684-M
B82478A1104M
|
Untitled
Abstract: No abstract text available
Text: HM100-251R0LF summary material content, BI Technologies Corporation Index Item Material Name E CORE Iron Powder I CORE Iron Powder 1 2 3 4 ADHESIVE COIL SOLDER Epoxy Resin Enamelled Copper Wire Lead Free Solder Element Composition CAS No Fe2O3 MnO ZnO Others
|
Original
|
PDF
|
HM100-251R0LF
|
B82472-G6
Abstract: B82472-G6102-M B82472-G6104-M B82472-G6105-M B82472G6105
Text: EPCOS SMT Power Inductor Product Family Name B82472-G6. Date Version 03.06.2004 1.00 Construction Element Material group Materials CAS min if applicable Active Part Metals Copperwire enamelled 7440-50-8 Compounds Ferrite Fe2O3/NiO/ZnO 12645-50-0 Metals
|
Original
|
PDF
|
B82472-G6.
B82472-G6102-M
B82472-G6104-M
B82472-G6
B82472-G6102-M
B82472-G6104-M
B82472-G6105-M
B82472G6105
|
A1105
Abstract: B82479-A1102-M B82479-A1103-M B82479-A1104-M B82479-A1105-M
Text: EPCOS SMT Power Inductor Product Family Name B82479-A. Date Version 19.04.2006 2.00 Construction Element Material group Materials CAS min if applicable Active Part Metals Copper 7440-50-8 Compounds Ferrite Fe2O3/NiO/ZnO 12645-50-0 Metals CuSn6 Metals
|
Original
|
PDF
|
B82479-A.
B82479-A1102-M
24x18
A1105
B82479-A1102-M
B82479-A1103-M
B82479-A1104-M
B82479-A1105-M
|
Untitled
Abstract: No abstract text available
Text: MATERIAL DATA SHEET Material PMC1206 Product Line Chip Beads Date 2-Oct-2006 No. 1 Construction element Ceramic Body Material group Ferrite Powder Series Material Weight [g] 0.028261 if applicable Average mass [%] Fe2O3 1309-37-1 45~55 NiO 1313-99-1 5~7 ZnO
|
Original
|
PDF
|
PMC1206
2-Oct-2006
|
Untitled
Abstract: No abstract text available
Text: MATERIAL DATA SHEET Material PMC0402 Product Line Chip Bead Date 2-Oct-2006 No. 1 Construction element Ceramic Body Material group Ferrite Powder Series Material Weight [g] 0.001075 if applicable Average mass [%] Fe2O3 1309-37-1 45~55 NiO 1313-99-1 5~7 ZnO
|
Original
|
PDF
|
PMC0402
2-Oct-2006
|
Untitled
Abstract: No abstract text available
Text: HM28-25025LF summary material content, BI Technologies Corporation CAS No Material Mass mg Composition (mg) Fe2O3 MnO ZnO 1317-60-8 1344-43-0 1314-13-2 6750 4725 810 1215 Phenolic Resin Wood Flour Hexamethyene Tetramine Inorganic Filler Brominated Epoxy Resin
|
Original
|
PDF
|
HM28-25025LF
|
Untitled
Abstract: No abstract text available
Text: HM28-42051LF summary material content, BI Technologies Corporation CAS No Material Mass mg Composition (mg) Fe2O3 MnO ZnO 1317-60-8 1344-43-0 1314-13-2 25470 17829 3056.4 4584.6 Phenolic Resin Wood Flour Hexamethyene Tetramine Inorganic Filler Brominated Epoxy Resin
|
Original
|
PDF
|
HM28-42051LF
|
Untitled
Abstract: No abstract text available
Text: HM28-24015LF summary material content, BI Technologies Corporation CAS No Material Mass mg Composition (mg) Fe2O3 MnO ZnO 1317-60-8 1344-43-0 1314-13-2 5150 3605 618 927 Phenolic Resin Wood Flour Hexamethyene Tetramine Inorganic Filler Brominated Epoxy Resin
|
Original
|
PDF
|
HM28-24015LF
|
Untitled
Abstract: No abstract text available
Text: HM28-35040LF summary material content, BI Technologies Corporation CAS No Material Mass mg Composition (mg) Fe2O3 MnO ZnO 1317-60-8 1344-43-0 1314-13-2 11000 7700 1320 1980 Phenolic Resin Wood Flour Hexamethyene Tetramine Inorganic Filler Brominated Epoxy Resin
|
Original
|
PDF
|
HM28-35040LF
|
Untitled
Abstract: No abstract text available
Text: HM28-32022LF summary material content, BI Technologies Corporation CAS No Material Mass mg Composition (mg) Fe2O3 MnO ZnO 1317-60-8 1344-43-0 1314-13-2 5070 3549 608.4 912.6 Phenolic Resin Wood Flour Hexamethyene Tetramine Inorganic Filler Brominated Epoxy Resin
|
Original
|
PDF
|
HM28-32022LF
|
Untitled
Abstract: No abstract text available
Text: HM28-20001LF summary material content, BI Technologies Corporation CAS No Material Mass mg Composition (mg) Fe2O3 MnO ZnO 1317-60-8 1344-43-0 1314-13-2 3580 2506 429.6 644.4 Phenolic Resin Wood Flour Hexamethyene Tetramine Inorganic Filler Brominated Epoxy Resin
|
Original
|
PDF
|
HM28-20001LF
|
|
|
SM51108EL
Abstract: sn 0952 SM51108 SM51108E Mn-Zn fe2o3 mno zno
Text: MATERIAL DECLARATION SHEET Material SM51108EL Product Line 10/100 Transformer Date 16-February-2006 Rev. Date No. Construction element 1 Core Material group Mn-Zn FERRITE CORE Material weight [g] Materials 0.112 Fe2O3 CAS if applicable N/A MnO N/A 16 ZnO Sn
|
Original
|
PDF
|
SM51108EL
16-February-2006
SM51108EL
sn 0952
SM51108
SM51108E
Mn-Zn fe2o3 mno zno
|
Untitled
Abstract: No abstract text available
Text: MATERIAL DATA SHEET Material PMC0805 Product Line Chip Bead Date No. 1 2-Oct-2006 Construction element Ceramic Body Material group Ferrite Powder Series Material Weight [g] 0.01032 if applicable Average mass [%] Fe2O3 1309-37-1 45~55 NiO 1313-99-1 5~7 ZnO
|
Original
|
PDF
|
PMC0805
2-Oct-2006
|
Untitled
Abstract: No abstract text available
Text: BHCL 322522 summary material content, BI Technologies Corporation Index 1 Item CORE Material Name Element Composition CAS No Material Mass mg Composition (mg) 11.00 6.490 1.320 0.990 2.200 Ferrite Fe2O3 NiO CuO ZnO 1309-37-1 1313-99-1 1317-38-0 1314-13-2
|
Original
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: MATERIAL DATA SHEET Material PMA1206H Product Line Chip Beads Date 2-Oct-2006 No. 1 Construction element Ceramic Body Material group Ferrite Powder Series Material Weight [g] 0.028261 if applicable Average mass [%] Fe2O3 1309-37-1 45~55 NiO 1313-99-1 5~7 ZnO
|
Original
|
PDF
|
PMA1206H
2-Oct-2006
7440-50-8ody
|
Untitled
Abstract: No abstract text available
Text: BHCL 453232 summary material content, BI Technologies Corporation Index 1 Item CORE Material Name Element Composition CAS No Material Mass mg Composition (mg) 25.00 14.750 3.000 2.250 5.000 Ferrite Fe2O3 NiO CuO ZnO 1309-37-1 1313-99-1 1317-38-0 1314-13-2
|
Original
|
PDF
|
|
transistor 431 smd
Abstract: caco3
Text: MATERIAL DECLARATION SHEET Material Number SRF0602 series Product Line SMD Line Filter Compliance Date 1-8-2009 RoHS Compliant Yes No. Construction Element subpart MSL Homogeneous Material 1 Material weight [g] Homogeneous Material\ Substances Iron oxide (Fe2O3)
|
Original
|
PDF
|
SRF0602
transistor 431 smd
caco3
|
Untitled
Abstract: No abstract text available
Text: MATERIAL DATA SHEET Material PMH1206 Product Line Chip Beads Date 2-Oct-2006 No. 1 Construction element Ceramic Body Material group Ferrite Powder Series Material Weight [g] 0.028261 if applicable Average mass [%] Fe2O3 1309-37-1 45~55 NiO 1313-99-1 5~7 ZnO
|
Original
|
PDF
|
PMH1206
2-Oct-2006
|
Untitled
Abstract: No abstract text available
Text: MATERIAL DATA SHEET Material PMA1206L Product Line Chip Beads Date 2-Oct-2006 No. 1 Construction element Ceramic Body Material group Ferrite Powder Series Material Weight [g] 0.028261 if applicable Average mass [%] Fe2O3 1309-37-1 45~55 NiO 1313-99-1 5~7 ZnO
|
Original
|
PDF
|
PMA1206L
2-Oct-2006
|
Untitled
Abstract: No abstract text available
Text: HM69-10R025LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE NP2 2 COIL Copper Strip 3 SOLDER Lead Free Solder Element Composition CAS No Material Mass Composition g (g) Fe2O3 Mn3O4 ZnO 1309-37-1 1317-35-7 1314-13-2
|
Original
|
PDF
|
HM69-10R025LF
HM69-20R050LF
HM69-80R30LF
|
Untitled
Abstract: No abstract text available
Text: MATERIAL DATA SHEET Material PMC0603 Product Line Chip Bead Date No. 1 2-Oct-2006 Construction element Ceramic Body Material group Ferrite Powder Series Material Weight [g] 0.004959 if applicable Average mass [%] Fe2O3 1309-37-1 45~55 NiO 1313-99-1 5~7 ZnO
|
Original
|
PDF
|
PMC0603
2-Oct-2006
|