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    FCBGA PACKAGE THERMAL RESISTANCE JC Search Results

    FCBGA PACKAGE THERMAL RESISTANCE JC Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    XPH13016MC Toshiba Electronic Devices & Storage Corporation P-ch MOSFET, -60 V, -60 A, 0.0099 Ω@-10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation

    FCBGA PACKAGE THERMAL RESISTANCE JC Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    TR6878

    Abstract: fcBGA PACKAGE thermal resistance EBGA672 FCBGA-160 BGA PACKAGE thermal profile FR4 GLASS EPOXY stiffener fbga 12 x 12 thermal resistance BGA-560P-M01 fine BGA thermal profile BGA-576
    Text: Packaging 11 fujitsu-fme.com FUJITSU MICROELECTRONICS EUROPE www.fujitsu www.fujitsu fme.com ASIC PACKAGE FAMILY 22 < FC-BGA : Electrical & Thermal-enhanced Solution with >1000-pin < TAB-BGA : Fine-pitch Bonding Solution < EBGA : Electrical & thermal-enhanced Solution


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    PDF 1000-pin FDH-BGA352 15MHz) TR6878 H1/1999 fcBGA PACKAGE thermal resistance EBGA672 FCBGA-160 BGA PACKAGE thermal profile FR4 GLASS EPOXY stiffener fbga 12 x 12 thermal resistance BGA-560P-M01 fine BGA thermal profile BGA-576

    diagrams hitachi ecu

    Abstract: SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog"
    Text: Renesas Semiconductor Packages General Catalog 2003.11 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble


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    PDF D-85622 REJ01K0003-0200Z diagrams hitachi ecu SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog"

    ipx2800

    Abstract: IXP2400 UL1439 foxconn motherboard JESD51-9 C23904-001 thermal test vehicle -intel jc INTEL fcBGA PACKAGE thermal resistance
    Text: Intel IXP2400 Network Processor Thermal and Mechanical Design Guideline Application Note March 2003 Document Number: 301148-001 IXP2400 Network Processor Thermal/Mechanical Design INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY


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    PDF IXP2400 ipx2800 UL1439 foxconn motherboard JESD51-9 C23904-001 thermal test vehicle -intel jc INTEL fcBGA PACKAGE thermal resistance

    1000-pin bga 0,8 mm

    Abstract: HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"
    Text: Renesas Semiconductor Packages General Catalog 2004.10 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble


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    PDF Unit2607 REJ01K0003-0300 1000-pin bga 0,8 mm HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"

    PES16NT16G2

    Abstract: 89H16NT16G2
    Text: 16-Lane 16-Port PCIe Gen2 System Interconnect Switch 89HPES16NT16G2 Data Sheet ® Device Overview • Dynamic port reconfiguration — downstream, upstream, non-transparent bridge • Dynamic migration of ports between partitions • Movable upstream port within and between switch partitions


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    PDF 16-Lane 16-Port 89HPES16NT16G2 PES16NT16G2 16-lane, 89H16NT16G2

    19x19mm

    Abstract: PES24T6G2 89HPES24T6G2 FCBGA676
    Text: 89HPES24T6G2 Data Sheet 24-Lane 6-Port Gen2 PCI Express Switch ® Device Overview The 89HPES24T6G2 is a member of IDT’s PRECISE family of PCI Express® switching solutions. The PES24T6G2 is a 24-lane, 6-port Gen2 peripheral chip that performs PCI Express base switching with a


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    PDF 24-Lane 89HPES24T6G2 PES24T6G2 24-lane, 324-ball 676-ball 19x19mm FCBGA676

    Untitled

    Abstract: No abstract text available
    Text: 32-Lane 8-Port PCIe Gen2 System Interconnect Switch 89HPES32NT8BG2 Datasheet ® Device Overview • All BARs support 32/64-bit base and limit address translation • Two BARs BAR2 and BAR4 support look-up table based address translation – 32 inbound and outbound doorbell registers


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    PDF 32-Lane 89HPES32NT8BG2 32/64-bit

    89H32NT8

    Abstract: 89H32NT8BG2
    Text: 32-Lane 8-Port PCIe Gen2 System Interconnect Switch 89HPES32NT8BG2 Data Sheet ® Device Overview • All BARs support 32/64-bit base and limit address translation • Two BARs BAR2 and BAR4 support look-up table based address translation – 32 inbound and outbound doorbell registers


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    PDF 32-Lane 89HPES32NT8BG2 PES32NT8BG2 32-lane, 89H32NT8 89H32NT8BG2

    Untitled

    Abstract: No abstract text available
    Text: 16-Lane 16-Port PCIe Gen2 System Interconnect Switch 89HPES16NT16G2 Datasheet ® Device Overview • Dynamic port reconfiguration — downstream, upstream, non-transparent bridge • Dynamic migration of ports between partitions • Movable upstream port within and between switch partitions


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    PDF 16-Lane 16-Port 89HPES16NT16G2 32/64-bit

    Untitled

    Abstract: No abstract text available
    Text: 12-Lane 12-Port PCIe Gen2 System Interconnect Switch 89HPES12NT12G2 Datasheet ® Device Overview Non-Transparent Bridging NTB Support – Supports up to 3 NT endpoints per switch, each endpoint can communicate with other switch partitions or external PCIe


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    PDF 12-Lane 12-Port 89HPES12NT12G2 32/64-bit

    89HPES32NT24BG2

    Abstract: 89H32NT 89H32NT24 PES32NT24BG2 89H32NT24BG2
    Text: 32-Lane 24-Port PCIe Gen2 System Interconnect Switch 89HPES32NT24BG2 Data Sheet ® Device Overview • Dynamic port reconfiguration — downstream, upstream, non-transparent bridge • Dynamic migration of ports between partitions • Movable upstream port within and between switch partitions


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    PDF 32-Lane 24-Port 89HPES32NT24BG2 PES32NT24BG2 32-lane, 24port 89H32NT 89H32NT24 89H32NT24BG2

    Untitled

    Abstract: No abstract text available
    Text: 32-Lane 8-Port PCIe Gen3 System Interconnect Switch 89HPES32H8G3 Data Sheet ® Device Overview – Per lane SerDes configuration • Full back channel equalization support • Rx, 5 tap DFE • Rx, single tap has pulse shaping • Rx CTLE compensates for up to 25db @ 4G/s


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    PDF 32-Lane 89HPES32H8G3 89HPES32H8G3 32-lane,

    89HPES24NT6AG2

    Abstract: 89H24NT6AG2 Single Root I/89HPES24NT6AG2
    Text: 24-Lane 6-Port PCIe Gen2 System Interconnect Switch 89HPES24NT6AG2 Data Sheet ® Device Overview • Two BARs BAR2 and BAR4 support look-up table based address translation – 32 inbound and outbound doorbell registers – 4 inbound and outbound message registers


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    PDF 24-Lane 89HPES24NT6AG2 PES24NT6AG2 24-lane, 89H24NT6AG2 Single Root I/89HPES24NT6AG2

    Untitled

    Abstract: No abstract text available
    Text: 24-Lane 6-Port PCIe Gen2 System Interconnect Switch 89HPES24NT6AG2 Datasheet ® Device Overview • Two BARs BAR2 and BAR4 support look-up table based address translation – 32 inbound and outbound doorbell registers – 4 inbound and outbound message registers


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    PDF 24-Lane 89HPES24NT6AG2 32-bit 64-bit

    PES24NT24G2

    Abstract: 89H24NT24 pci non-transparent bridge 89H24NT24G2 89HPES24NT24G2
    Text: 24-Lane 24-Port PCIe Gen2 System Interconnect Switch 89HPES24NT24G2 Data Sheet ® Device Overview • Movable upstream port within and between switch partitions Non-Transparent Bridging NTB Support – Supports up to 8 NT endpoints per switch, each endpoint can


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    PDF 24-Lane 24-Port 89HPES24NT24G2 PES24NT24G2 24-lane, 89H24NT24 pci non-transparent bridge 89H24NT24G2

    Untitled

    Abstract: No abstract text available
    Text: 24-Lane 24-Port PCIe Gen2 System Interconnect Switch 89HPES24NT24G2 Datasheet ® Device Overview • Movable upstream port within and between switch partitions Non-Transparent Bridging NTB Support – Supports up to 8 NT endpoints per switch, each endpoint can


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    PDF 24-Lane 24-Port 89HPES24NT24G2 32/64-bit

    Untitled

    Abstract: No abstract text available
    Text: 32-Lane 8-Port PCIe Gen2 System Interconnect Switch 89HPES32NT8AG2 Datasheet ® Device Overview • All BARs support 32/64-bit base and limit address translation • Two BARs BAR2 and BAR4 support look-up table based address translation – 32 inbound and outbound doorbell registers


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    PDF 32-Lane 89HPES32NT8AG2 32/64-bit

    Untitled

    Abstract: No abstract text available
    Text: 32-Lane 24-Port PCIe Gen2 System Interconnect Switch 89HPES32NT24BG2 Datasheet ® Device Overview • Dynamic port reconfiguration — downstream, upstream, non-transparent bridge • Dynamic migration of ports between partitions • Movable upstream port within and between switch partitions


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    PDF 32-Lane 24-Port 89HPES32NT24BG2 32/64-bit

    MO-235 FOOTPRINT

    Abstract: die bond MO-235 SC-100 JEDEC 784-pin QFP PACKAGE thermal resistance LFPAK footprint mo204 ED-7311-15 fcBGA PACKAGE thermal resistance jc
    Text: Products LQFP Low Profile Quad Flat Package High reliability, Standard Lead type Packages with rich line-ups • High pin-count, ideal for high-functionality, high-I/Ocount LSIs • Small size, allowing high-density mounting • Thin QFP LQFP with package mounting height of


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    PDF SC-100 MO-235 MO-235 FOOTPRINT die bond MO-235 SC-100 JEDEC 784-pin QFP PACKAGE thermal resistance LFPAK footprint mo204 ED-7311-15 fcBGA PACKAGE thermal resistance jc

    Untitled

    Abstract: No abstract text available
    Text: 48-Lane 12-Port PCIe Gen3 System Interconnect Switch 89HPES48H12G3 Data Sheet ® Device Overview – Autonomous and software managed link width and speed control – Per lane SerDes configuration • Full back channel equalization support • Rx, 5 tap DFE


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    PDF 48-Lane 12-Port 89HPES48H12G3 89HPES48H12G3 48-lane,

    89H48H12

    Abstract: 89H48H12G3
    Text: 48-Lane 12-Port PCIe Gen3 System Interconnect Switch 89HPES48H12G3 Data Sheet ® Device Overview – Autonomous and software managed link width and speed control – Per lane SerDes configuration • Full back channel equalization support • Rx, 5 tap DFE


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    PDF 48-Lane 12-Port 89HPES48H12G3 48-lane, 89H48H12 89H48H12G3

    Untitled

    Abstract: No abstract text available
    Text: 48-Lane 12-Port PCIe Gen3 System Interconnect Switch 89HPES48H12G3 Data Sheet ® Device Overview – Autonomous and software managed link width and speed control – Per lane SerDes configuration • Full back channel equalization support • Rx, 5 tap DFE


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    PDF 48-Lane 12-Port 89HPES48H12G3 89HPES48H12G3 48-lane,

    Untitled

    Abstract: No abstract text available
    Text: 32-Lane 24-Port PCIe Gen2 System Interconnect Switch 89HPES32NT24AG2 Datasheet ® Device Overview • Dynamic port reconfiguration — downstream, upstream, non-transparent bridge • Dynamic migration of ports between partitions • Movable upstream port within and between switch partitions


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    PDF 32-Lane 24-Port 89HPES32NT24AG2 32/64-bit

    89HPES16T4AG2

    Abstract: No abstract text available
    Text: 16-Lane 4-Port Gen2 PCI Express Switch 89HPES16T4AG2 Data Sheet ® Device Overview The 89HPES16T4AG2 is a member of IDT’s PRECISE family of PCI Express® switching solutions. The PES16T4AG2 is a 16-lane, 4port Gen2 peripheral chip that performs PCI Express Base switching


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    PDF 16-Lane 89HPES16T4AG2 PES16T4AG2 16-lane, 324-ball 16T4A 89HPES16T4AG2ZCAL