FBGA SUBSTRATE DESIGN GUIDELINES Search Results

FBGA SUBSTRATE DESIGN GUIDELINES Result Highlights (5)

Part	Manufacturer	Description
DE6B3KJ151KA4BE01J	Murata Manufacturing Co Ltd	Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive
DE6B3KJ471KB4BE01J	Murata Manufacturing Co Ltd	Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive
DE6E3KJ152MN4A	Murata Manufacturing Co Ltd	Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive
DE6B3KJ101KA4BE01J	Murata Manufacturing Co Ltd	Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive
DE6B3KJ331KB4BE01J	Murata Manufacturing Co Ltd	Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive

FBGA SUBSTRATE DESIGN GUIDELINES Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
fbga Substrate design guidelines Abstract: FR4 substrate epoxy dielectric constant 4.4 FR4 substrate with dielectric constant 4.4 relative permittivity of fr4 FR4 epoxy dielectric constant 4.2 FR4 4.9 dielectric constant FR4 epoxy dielectric constant 4.4 FR4 dielectric constant 4.9 FR4 dielectric constant and loss tangent at 2.4 G EP2S15 Text: Section VI. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Stratix II devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:	Original	PDF
CMOS handbook Abstract: error 41 barrier EPM1270 EPM2210 EPM240 EPM240G EPM240Z EPM570 fbga Substrate design guidelines BGA PACKAGE OUTLINE Text: Section II. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for MAX II devices. It contains the required printed circuit board PCB layout guidelines, device pin tables, and package specifications.	Original	PDF
TAIYO PSR 4000 Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).	Original	PDF
TAIYO PSR 4000 Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100 Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).	Original	PDF
taiyo PSR4000 Abstract: Shipping Trays kostat 10 x 10 nitto hc100 Kostat tray PSR4000 aus5 EPAK EPAK TRAY JEDEC Kostat PSR4000 aus5 Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2	Original	PDF
fBGA package tray 12 x 19 Abstract: EPAK TRAY FBGA THICK TRAY fbga Substrate design guidelines JEDEC Kostat FBGA EPAK Kostat PSR4000 SLB128B AN-1125 Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2	Original	PDF
fbga Substrate design guidelines Abstract: CS281 ACTEL FBGA PACKAGE DRAWING AC243 CS81 fine BGA thermal profile pcb thermal Design guide pcb trace fbga PCB footprint thermal pcb guidelines MO-195 Text: Application Note AC243 Assembly and PCB Layout Guidelines for Chip-Scale Packages Introduction The Chip-Scale Package CSP is a dual- or multi-layer plastic encapsulated BT-Epoxy type substrate with copper signal and plain layers. The small form factor allows for enhanced conduction of heat to the PCB	Original	PDF	AC243 fbga Substrate design guidelines CS281 ACTEL FBGA PACKAGE DRAWING AC243 CS81 fine BGA thermal profile pcb thermal Design guide pcb trace fbga PCB footprint thermal pcb guidelines MO-195
csp defects Abstract: handling damage LGA socket MANUAL PCB Samsung MCP 1mm pitch BGA socket air handling unit CRACK pcb substrate HCFC141B Text: USER’S MANUAL Chip Scale Package • To make a win-win situation for CSP products supplier and customer, Samsung provides the information of CSP package’s characteristics and manuals to maintain high quality so that the problems of customer process can be minimized or prevented	Original	PDF	150um) 20mils x20mil csp defects handling damage LGA socket MANUAL PCB Samsung MCP 1mm pitch BGA socket air handling unit CRACK pcb substrate HCFC141B
Untitled Abstract: No abstract text available Text: CY7C1381D CY7C1383D CY7C1383F 18-Mbit 512 K x 36/1 M × 18 Flow-Through SRAM 18-Mbit (512 K × 36/1 M × 18) Flow Through SRAM Features Functional Description • Supports 133 MHz bus operations ■ 512 K × 36 and 1 M × 18 common I/O ■ 3.3 V core power supply (VDD)	Original	PDF	CY7C1381D CY7C1383D CY7C1383F 18-Mbit CY7C1381D/CY7C1383D/CY7C1383F
WLCSP smt Abstract: EIA-481-D-2008 Cu OSP and Cu SOP qfn tray pocket size 5 x 6 SUF1577-15 WLCSP stencil design without underfill SAC396 cte table flip chip substrate SAC 2.3 Ag bump composition Text: AN69061 Design, Manufacturing, and Handling Guidelines for Cypress Wafer-Level Chip Scale Packages WLCSP Author: Wynces Silvoza, Bo Chang Associated Project: No Associated Part Family: All Cypress WLCSP products Software Version: None Associated Application Notes: None	Original	PDF	AN69061 AN69061 WLCSP smt EIA-481-D-2008 Cu OSP and Cu SOP qfn tray pocket size 5 x 6 SUF1577-15 WLCSP stencil design without underfill SAC396 cte table flip chip substrate SAC 2.3 Ag bump composition
Untitled Abstract: No abstract text available Text: CY7C1380D CY7C1380F CY7C1382D 18-Mbit 512 K x 36/1 M × 18 Pipelined SRAM 18-Mbit (512 K × 36/1 M × 18) Pipelined SRAM Features Functional Description • Supports bus operation up to 250 MHz ■ Available speed grades are 250, 200, and 167 MHz ■ Registered inputs and outputs for pipelined operation	Original	PDF	CY7C1380D CY7C1380F CY7C1382D 18-Mbit CY7C1380D/CY7C1380F/CY7C1382D
Loctite 3567 Abstract: underfill Kester FDZ202P fbga Substrate design guidelines reflow hot air BGA fine BGA thermal profile reball INTEL underfill SMT Text: Application Note 7001 March 2002 Guidelines for Mounting Fairchild’s BGA Packages Dennis Lang, Applications Engineer Introduction The development of MOSFETs in BGA packages was a technology breakthrough, producing a device that combined excellent thermal transfer characteristics, high-current handling capability, ultra-low profile	Original	PDF
underfill Abstract: rework reflow hot air BGA Loctite PCB design for very fine pitch csp package thick bga die size Loctite 3567 Intel BGA Solder FDZ202P Fairchild, BGA fbga Substrate design guidelines Text: Application Note 7001 March 2004 Guidelines for Using Fairchild’s BGA Packages Dennis Lang, Applications Engineer Introduction The development of MOSFETs in Chip Scale Package BGA packages was a technology breakthrough, producing a device that combined excellent thermal transfer characteristics, high-current handling	Original	PDF
AN-1126 Abstract: AN-1205 land pattern BGA 0.75 TMCL ACLV MO-151 fbga Substrate design guidelines bga Shipping Trays pcb warpage after reflow Epoxy, glass laminate gold embrittlement Text: Table of Contents Introduction . 2 Package Overview . 3	Original	PDF	AN-1126 AN-1126 AN-1205 land pattern BGA 0.75 TMCL ACLV MO-151 fbga Substrate design guidelines bga Shipping Trays pcb warpage after reflow Epoxy, glass laminate gold embrittlement

thick bga die size Abstract: fbga Substrate design guidelines Text: The SuperCSPTM: A Novel Molding Process Technique to Achieve Wafer Scale Packaging Michelle M. Hou Product Marketing Manager Advanced Packaging Technology Package Subcontractng Services Fujitsu; San Jose, CA I. Introduction The mobile cellular phone manufacturers	Original	PDF	30ppm/deg 120ps 160cm 10MPa 150sec thick bga die size fbga Substrate design guidelines
LF1152 Abstract: EP4SE360 ep4sgx180 EP4SGX290 EP4SGX360 EP4SGX70 HIV51001-2 EP4SE530H35 "Stratix IV" Package layout footprint HC4GX35 Text: Section I. Device Core This section provides a complete overview of all features relating to the HardCopy IV device family. HardCopy IV devices are Altera’s latest generation of low-cost, high-performance, low power ASICs with pin-outs, densities, and	Original	PDF
HC335FF1152 Abstract: HC325FF780 HC335 EP3SE110F1152 EP3SE110F Text: Section I. Device Core This section provides a complete overview of all features relating to the HardCopy III device family. HardCopy III devices are Altera’s latest generation of low-cost, high-performance, low power ASICs with pin-outs, densities, and	Original	PDF
MICRON BGA PART MARKING Abstract: RTT120 MT44K64M18 MT44K RLDRAM 3 MT44K32M36 Text: 1Gb: x18, x36 TwinDie RLDRAM 3 Features TwinDie RLDRAM 3 MT44K64M18 – 2 Meg x 18 x 16 Banks x 2 Ranks MT44K32M36 – 2 Meg x 36 x 16 Banks Features Options Marking • 168-ball FBGA package – 1.25ns and tRCmin = 10ns RL3-1600 – 1.25ns and tRCmin = 12ns (RL3-1600)	Original	PDF	MT44K64M18 MT44K32M36 576Mb MT44K32M18 MT44K64M18 MT44K32M36. MT44K32M36RCT-125 MICRON BGA PART MARKING RTT120 MT44K RLDRAM 3 MT44K32M36
sn63pb37 solder SPHERES Abstract: J-STD-020 SAC305 JEDEC J-STD-020d.1 Altera Flip Chip BGA warpage reflow profile SAC305 bga ALTERA AN81 sn63pb37 solder wire sn63pb37 solder wire shelf life pcb warpage in ipc standard J-STD-020D Text: SMT Board Assembly Process Recommendations AN-353-4.0 Application Note This application note describes the board assembly process used in surface-mount technology SMT and focuses on the SMT component-to-board reflow soldering process and rework soldering if you are removing or replacing individual	Original	PDF	AN-353-4 AN-353 AN-81. sn63pb37 solder SPHERES J-STD-020 SAC305 JEDEC J-STD-020d.1 Altera Flip Chip BGA warpage reflow profile SAC305 bga ALTERA AN81 sn63pb37 solder wire sn63pb37 solder wire shelf life pcb warpage in ipc standard J-STD-020D
22B2 DIODE Abstract: A54SX08A A54SX16A A54SX32A A54SX72A PQ208 TQ100 TQ144 TQ176 Text: v5.2 SX-A Family FPGAs u e Leading-Edge Performance • • • 250 MHz System Performance 350 MHz Internal Performance • • • Specifications • • • • • • 12,000 to 108,000 Available System Gates Up to 360 User-Programmable I/O Pins Up to 2,012 Dedicated Flip-Flops	Original	PDF
22B2 DIODE Abstract: RTSX-S datasheet SX FPGAs A54SX08A A54SX16A A54SX32A A54SX72A PQ208 TQ100 TQ144 Text: v5.1 SX-A Family FPGAs Leading-Edge Performance • • • 250 MHz System Performance 350 MHz Internal Performance • • • Specifications • • • • • • 12,000 to 108,000 Available System Gates Up to 360 User-Programmable I/O Pins Up to 2,012 Dedicated Flip-Flops	Original	PDF
diode 2U 66 Abstract: No abstract text available Text: v5.1 SX-A Family FPGAs Leading-Edge Performance • • • 250 MHz System Performance 350 MHz Internal Performance • • • Specifications • • • • • • 12,000 to 108,000 Available System Gates Up to 360 User-Programmable I/O Pins Up to 2,012 Dedicated Flip-Flops	Original	PDF
sAMSUNG CK 5081 T MANUAL Abstract: 64 bit carry-select adder verilog code intel 915 MOTHERBOARD pcb CIRCUIT diagram inverter PURE SINE WAVE schematic diagram mercury motherboards regulator ic intel 775 motherboard diagram TRANSISTOR SUBSTITUTION DATA BOOK 1993 AW 55 IC vhdl code for cordic matlab code using 8 point DFT butterfly Text: Stratix Device Handbook, Volume 1 101 Innovation Drive San Jose, CA 95134 408 544-7000 http://www.altera.com S5V1-1.2 Copyright 2003 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and	Original	PDF	00-mm sAMSUNG CK 5081 T MANUAL 64 bit carry-select adder verilog code intel 915 MOTHERBOARD pcb CIRCUIT diagram inverter PURE SINE WAVE schematic diagram mercury motherboards regulator ic intel 775 motherboard diagram TRANSISTOR SUBSTITUTION DATA BOOK 1993 AW 55 IC vhdl code for cordic matlab code using 8 point DFT butterfly
22B2 DIODE Abstract: Theta JC of FBGA A54SX08A A54SX16A A54SX32A A54SX72A PQ208 TQ100 TQ144 TQ176 Text: v5.3 SX-A Family FPGAs u e Leading-Edge Performance • • • 250 MHz System Performance 350 MHz Internal Performance • • • Specifications • • • • • • 12,000 to 108,000 Available System Gates Up to 360 User-Programmable I/O Pins Up to 2,012 Dedicated Flip-Flops	Original	PDF

FBGA SUBSTRATE DESIGN GUIDELINES Search Results

FBGA SUBSTRATE DESIGN GUIDELINES Result Highlights (5)

FBGA SUBSTRATE DESIGN GUIDELINES Datasheets Context Search

fbga Substrate design guidelines

CMOS handbook

TAIYO PSR 4000

TAIYO PSR 4000

taiyo PSR4000

fBGA package tray 12 x 19

fbga Substrate design guidelines

csp defects

Untitled

WLCSP smt

Untitled

Loctite 3567

underfill

AN-1126

thick bga die size

LF1152

HC335FF1152

MICRON BGA PART MARKING

sn63pb37 solder SPHERES

22B2 DIODE

22B2 DIODE

diode 2U 66

sAMSUNG CK 5081 T MANUAL

22B2 DIODE