taiyo PSR4000
Abstract: Shipping Trays kostat 10 x 10 nitto hc100 Kostat tray PSR4000 aus5 EPAK EPAK TRAY JEDEC Kostat PSR4000 aus5
Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2
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fBGA package tray 12 x 19
Abstract: EPAK TRAY FBGA THICK TRAY fbga Substrate design guidelines JEDEC Kostat FBGA EPAK Kostat PSR4000 SLB128B AN-1125
Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2
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bga rework
Abstract: 39K200 39K100 39K165 39K30 39K50 WT2-56
Text: Family, Package, and Density Migration in Delta39K and Quantum38K™ CPLDs Introduction I. Family Migration The Delta39K™ and Quantum38K™ family of Complex Programmable Logic Devices CPLDs combine dense logic, embedded memory, and configurable I/O standards. Further design flexibility is added by the easy migration options available
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Delta39KTM
Quantum38KTM
bga rework
39K200
39K100
39K165
39K30
39K50
WT2-56
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MCP market
Abstract: No abstract text available
Text: Multi Chip Package MCP Flash Memory and SRAM Solutions Small footprint consistent packaging Succeed with Flash technology leadership from AMD Succeed with AMD’s industry-leading family of multi-chip package (MCP) Flash and SRAM memory solutions. AMD’s MCP solutions feature high-performance AMD Flash and the highest quality SRAM, in a single convenient
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5451A
MCP market
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TAIYO PSR 4000
Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).
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TAIYO PSR 4000
Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).
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transistor smd G46
Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm
Text: FBGA User’s Guide Version 4.2 -XO\ 7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG
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N32-2400
22142J
transistor smd G46
fluke 52 k/j Thermocouple
7512 pin diodes in micro semi data sheet
smd transistor marking ey
SMD MARKING CODE h5
MCP Technology Trend
BGA-64 pad
AMD reflow soldering profile BGA
SMD MARKING CODE l6
BGA Solder Ball 0.6mm
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BCM4750
Abstract: Broadcom bcm4750 broadcom sensitivity GPS broadcom Broadcom 4750 broadcom gps broadcom sensitivity BCM4750 Block diagram on gps receiver GPS receiver bcm4750
Text: BCM4750 Brief SINGLE-CHIP AGPS SOLUTION FEATURES SUMMARY OF BENEFITS • Single-chip solution—AGPS baseband and CMOS RF front- • Advanced low-power RFCMOS technology and low-power end integrated on a single-die—minimizing board space footprint <35 mm2 PCB area for a complete AGPS solution
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BCM4750
157-dBm
162-dBm
4750-PB02-R
BCM4750
Broadcom bcm4750
broadcom sensitivity
GPS broadcom
Broadcom 4750
broadcom gps
broadcom sensitivity BCM4750
Block diagram on gps receiver
GPS receiver bcm4750
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BCM84752
Abstract: BCM84846 BROADCOM 100-pin FBGA BCM8475 BCM84846A0KFSBG
Text: Broadcom B CM8 48 46 Dua l 10G BA SE-T Trans ce i ve r DUAL-PORT 10GBASE-T TRANSCEIVER Overview Highlights • The BCM84846 offers low power in this second-generation 40 nm 10GBASE-T device. • The small 21 mm package size reduces the footprint for 10GBASE-T, ideal for servers and
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10GBASE-T
BCM84846
10GBASE-T,
RJ-45
84846-PB01-R
BCM84752
BROADCOM 100-pin FBGA
BCM8475
BCM84846A0KFSBG
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Untitled
Abstract: No abstract text available
Text: Migration from 16 Megabit to 64 Megabit Flash Memory Devices Application Note This document will assist board-designers in creating a seamless migration path from AMD 16 Mb or 32 Mb low voltage LV flash and Simultaneous Read/Write (DL) devices to higher densities.
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LV320
LV640U
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understanding test option
Abstract: TN-00-20
Text: TN-00-20: Understanding the Value of SI Testing Introduction Technical Note Understanding the Value of Signal Integrity Testing Introduction Historically, design engineers have used signal integrity SI testing as a key part of the design and development of new systems and for sustaining qualifications. While SI
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TN-00-20:
09005aef8172701b/Source:
09005aef81726ffc
TN0020
understanding test option
TN-00-20
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OF4337
Abstract: 90CR288A 90CR288 DS101087-6 90CR287 DS90CR287MTD
Text: DS90CR287/DS90CR288A +3.3V Rising Edge Data Strobe LVDS 28-Bit Channel Link-85 MHZ General Description Features The DS90CR287 transmitter converts 28 bits of LVCMOS/ LVTTL data into four LVDS Low Voltage Differential Signaling data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link.
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DS90CR287/DS90CR288A
28-Bit
Link-85
DS90CR287
DS90CR288A
DS90CR288ASLC
5-Dec-2000]
OF4337
90CR288A
90CR288
DS101087-6
90CR287
DS90CR287MTD
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BCM4750
Abstract: Broadcom bcm4750 GPS chip BCM4750 Broadcom 4750 Broadcom broadcom gps Broadcom RECEIVER broadcom sensitivity AGPS receiver spi GPS broadcom
Text: BCM4750 Brief SINGLE-CHIP AGPS SOLUTION FEATURES SUMMARY OF BENEFITS • Single-chip solution—AGPS baseband and CMOS RF front- • Advanced low-power RFCMOS technology and low-power end integrated on a single-die—minimizing board space footprint <35 sq mm 2 PCB area for a complete AGPS
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BCM4750
157-dBm
4750-PB01-R
BCM4750
Broadcom bcm4750
GPS chip BCM4750
Broadcom 4750
Broadcom
broadcom gps
Broadcom RECEIVER
broadcom sensitivity
AGPS receiver spi
GPS broadcom
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Untitled
Abstract: No abstract text available
Text: DS90CR287/DS90CR288A +3.3V Rising Edge Data Strobe LVDS 28-Bit Channel Link-85 MHZ General Description Features The DS90CR287 transmitter converts 28 bits of LVCMOS/ LVTTL data into four LVDS Low Voltage Differential Signaling data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link.
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DS90CR287/DS90CR288A
28-Bit
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DS90CR287
DS90CR288A
U\recode\DS90CR288A
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Untitled
Abstract: No abstract text available
Text: DS90CR287/DS90CR288A +3.3V Rising Edge Data Strobe LVDS 28-Bit Channel Link-85 MHZ General Description Features The DS90CR287 transmitter converts 28 bits of LVCMOS/ LVTTL data into four LVDS Low Voltage Differential Signaling data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link.
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DS90CR287/DS90CR288A
28-Bit
Link-85
DS90CR287
DS90CR288A
DS90CR287MTD
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NATIONAL RX F2
Abstract: No abstract text available
Text: DS90C383/DS90CF384 +3.3V Programmable LVDS Transmitter 24-Bit Flat Panel Display FPD Link— 65 MHz, +3.3V LVDS Receiver 24-Bit Flat Panel Display (FPD) Link— 65 MHz General Description Features The DS90C383 transmitter converts 28 bits of CMOS/TTL data into four LVDS (Low Voltage Differential Signaling) data
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DS90C383/DS90CF384
24-Bit-Color
24-Bit
DS90C383
DS90CF384
DS90CF384SLC
DS90CF384SLCX
AN-1085:
NATIONAL RX F2
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Untitled
Abstract: No abstract text available
Text: DS90C383/DS90CF384 +3.3V Programmable LVDS Transmitter 24-Bit Flat Panel Display FPD Link— 65 MHz, +3.3V LVDS Receiver 24-Bit Flat Panel Display (FPD) Link— 65 MHz General Description Features The DS90C383 transmitter converts 28 bits of CMOS/TTL data into four LVDS (Low Voltage Differential Signaling) data
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DS90C383/DS90CF384
24-Bit-Color
24-Bit
DS90C383
DS90CF384
AN-1085:
11-Sep-2000]
24-Jun-99
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Untitled
Abstract: No abstract text available
Text: DS90CF384A/DS90CF364A +3.3V LVDS Receiver 24-Bit Flat Panel Display FPD Link—65 MHz, +3.3V LVDS Receiver 18-Bit Flat Panel Display (FPD) Link—65 MHz General Description The DS90CF384A receiver converts the four LVDS data streams (Up to 1.8 Gbps throughput or 227 Megabytes/sec
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DS90CF384A/DS90CF364A
24-Bit-Color
Link--65
18-Bit-Color
24-Bit
18-Bit
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90CF386
Abstract: No abstract text available
Text: DS90CF386/DS90CF366 +3.3V LVDS Receiver 24-Bit Flat Panel Display FPD Link—85 MHz, +3.3V LVDS Receiver 18-Bit Flat Panel Display (FPD) Link—85 MHz General Description The DS90CF386 receiver converts the four LVDS data streams (Up to 2.38 Gbps throughput or 297.5 Megabytes/
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DS90CF386/DS90CF366
24-Bit-Color
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18-Bit-Color
24-Bit
18-Bit
90CF386
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Untitled
Abstract: No abstract text available
Text: DS90CF386/DS90CF366 +3.3V LVDS Receiver 24-Bit Flat Panel Display FPD Link—85 MHz, +3.3V LVDS Receiver 18-Bit Flat Panel Display (FPD) Link—85 MHz General Description The DS90CF386 receiver converts the four LVDS data streams (Up to 2.38 Gbps throughput or 297.5 Megabytes/
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DS90CF386/DS90CF366
24-Bit-Color
Link--85
18-Bit-Color
24-Bit
18-Bit
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S71WS256PC0HH3
Abstract: S71WS512PD0HH3 SWM032D spansion date code marking TRAY FBGA 11X13 S71WS256PD0HH3 S71WS256PC0HH3YR SWM064D133S1R S71WS256PC0HF3
Text: S71WS-P based MCP Products 1.8 Volt-only x16 Simultaneous Read/Write, Burst Mode Flash Memory with CellularRAM Data Sheet S71WS-P based MCP Products Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion
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S71WS-P
S71WS256PC0HH3
S71WS512PD0HH3
SWM032D
spansion date code marking
TRAY FBGA 11X13
S71WS256PD0HH3
S71WS256PC0HH3YR
SWM064D133S1R
S71WS256PC0HF3
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DS90C365MTD
Abstract: DS90C385
Text: DS90C385/DS90C365 +3.3V Programmable LVDS Transmitter 24-Bit Flat Panel Display FPD Link-85 MHz, +3.3V Programmable LVDS Transmitter 18-Bit Flat Panel Display (FPD) Link-85 MHz General Description The DS90C385 transmitter converts 28 bits of LVCMOS/ LVTTL data into four LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link.
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DS90C385/DS90C365
24-Bit
Link-85
18-Bit
DS90C365MTD
DS90C385
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sx08a
Abstract: ATQ100 SX32a RTSX16
Text: A p p l i c a t i on N o t e SX to SX-A Design Migration In t ro d u c t i o n • Configurable Output State During Power-Up: All outputs can be programmed to either weak resistor pull-up or weak resistor pull-down for output tri-state. Actel’s newest line of antifuse FPGAs, SX-A, is fabricated
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ADA17
Abstract: No abstract text available
Text: Advance information •■ I l AS7C3256K36Z AS7C3256K32Z A 3.3V 2 5 6 K x 32/36 synchronous burst SRAM with ZBT1 Features Multiple packaging options - Economical 100-pin TQFP package - Chip-scale fBGA package for smallest footprint Byte write enables Qock enable for operation hold
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AS7C3256K36Z
AS7C3256K32Z
100-pin
00000DID1DDDD
5M-1982.
IPC-SM-782
ADA17
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