transistor smd G46
Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm
Text: FBGA User’s Guide Version 4.2 -XO\ 7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG
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N32-2400
22142J
transistor smd G46
fluke 52 k/j Thermocouple
7512 pin diodes in micro semi data sheet
smd transistor marking ey
SMD MARKING CODE h5
MCP Technology Trend
BGA-64 pad
AMD reflow soldering profile BGA
SMD MARKING CODE l6
BGA Solder Ball 0.6mm
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MD300-10A
Abstract: QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA
Text: CHAPTER 4 CHAPTER 4 4.1 PACKING STYLES AND NOTES 4.1.1 Packing Styles 4.1.2 Notes on Handling 4.2 PACKING OF IC PACKAGES 4.2.1 List of Packing 1 DIP (2) SIP, V-DIP, ZIP (3) QUIP, Piggyback (4) PGA (5) SOP, SSOP (6) TSOP (I) (II) (7) QFP, QFP (FP) (8) SVP
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S64F1-CA1
S108S1-YHC
P116S1-YJC
S144S1-YKC
S176S1-2C
S224S1-3C-1
S304S1-6C
S256N7-B6
S352N7-F6-1
S420N7-F6
MD300-10A
QFN tray
tray datasheet bga
SIP 400B
TSOP TRAY 40 PIN
BGA package tray 64
NEC A39A 240
TSOP package tray
6-tsop
TRAY DIMENSIONS 132 PGA
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21x21
Abstract: MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1
Text: 検索ツール 1. ツールバーの アイコンをクリックしてください。 2. [検索]のダイアログ・ボックスが表示されます。 3. 検索したいパッケージのNECコードを入力して, 検索 F をクリックしてください。
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P22C100300A1
P8C-100-300B
P8CT-100-300B2-1
P8C-100-300A-1
P-DIP8-0300-2
MD300-2A
MD300-1A
MD300-09A
21x21
MM554
tray bga
45x45 bga
X13769XJ2V0CD00
CPGA132
LA010
P14DH-100-300A2-1
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MD300-10A
Abstract: P32C-100-600A p20d100 C-PGA176-S15U-2 CDIP28 LA-0543A tray bga P-TQFP100-14X20-0 0x20010 P14DH-100-300A2-1
Text: Find tool 1. Click button in the Toolbar. 2. Search dialog box is displayed. 3. Enter a NEC code to be searched and click Find . Caution Don't use the wild card *) when entering a NEC code. Ex.) Find Find What P22C-100-300A-1 Match Whole Word Only Match Case
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P22C-100-300A-1
P8C-100-300B
P-DIP8-0300-2
MD300-2A
P8CT-100-300B2-1
MD300-1A
P8C-100-300A-1
X13769XJ2V0CD00
MD300-10A
P32C-100-600A
p20d100
C-PGA176-S15U-2
CDIP28
LA-0543A
tray bga
P-TQFP100-14X20-0
0x20010
P14DH-100-300A2-1
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EP4CE6 package
Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
Text: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead
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DS-PKG-16
EP4CE6 package
EP4CE40
Altera EP4CE6
EP4CE55
5M240Z
5M1270Z
QFN148
5m570z
5M40
5M80
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EP4CE15
Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
Text: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead
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DS-PKG-16
EP4CE15
MS 034
BGA and QFP Altera Package mounting
Altera pdip top mark
jedec package MO-247
SOIC 20 pin package datasheet
QFN "100 pin" PACKAGE thermal resistance
Theta JC of FBGA
QFN148
EP4CE22
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AN-1126
Abstract: AN-1205 land pattern BGA 0.75 TMCL ACLV MO-151 fbga Substrate design guidelines bga Shipping Trays pcb warpage after reflow Epoxy, glass laminate gold embrittlement
Text: Table of Contents Introduction . 2 Package Overview . 3
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AN-1126
AN-1126
AN-1205
land pattern BGA 0.75
TMCL ACLV
MO-151
fbga Substrate design guidelines
bga Shipping Trays
pcb warpage after reflow
Epoxy, glass laminate
gold embrittlement
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TMPRFE2G5
Abstract: MARS2G5 bey34 DIODE BA40 LVTTL25
Text: Hardware Design Guide September 8, 2004 MARS2G5 P-VC-XTRM TMPRFE2G5 Datamapper 2488/622/155 Mbits/s SONET/SDH x 10/100/1000 Mbits/s Ethernet 1 Introduction The documentation package for the Datamapper device consists of the following documents, available on a password protected website:
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DS04-011MPIC
TMPRFE2G5
MARS2G5
bey34
DIODE BA40
LVTTL25
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interfacing cpld xc9572 with keyboard
Abstract: VERIFY 93K template 34992 XC95288XL evaluation board schematic XCR3032C XcxxX xilinx logicore core dds XC2S15-VQ100 creative labs model 3400 FXS-100
Text: The Programmable Logic Data Book 2000 R R , XC2064, NeoCAD PRISM, XILINX Block Letters , XC-DS501, NeoROUTE, XC3090, FPGA Architect, XC4005, FPGA Foundry, XC5210, Timing Wizard, NeoCAD, TRACE, NeoCAD EPIC, XACT are registered trademarks of Xilinx, Inc. , all XC-prefix product designations, AllianceCore, Alliance Series, BITA, CLC, Configurable Logic Cell, CoolRunner, Dual Block, EZTag, Fast CLK, FastCONNECT,
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XC2064,
XC-DS501,
XC3090,
XC4005,
XC5210,
interfacing cpld xc9572 with keyboard
VERIFY 93K template
34992
XC95288XL evaluation board schematic
XCR3032C
XcxxX
xilinx logicore core dds
XC2S15-VQ100
creative labs model 3400
FXS-100
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Texas Instruments Power Management Guide
Abstract: TPS53312 TPS65168 Samsung Exynos 5 TPS65178 ips 500w circuit diagram 500w push-pull power tl598 schematic diagram Acid Battery charger 48 volt circuit tl494 UCC25600 application note Buck-boost TL494
Text: Power Management Guide www.ti.com/power 2013 Power Management Guide Introduction and Contents Texas Instruments TI offers complete power solutions with a full line of highperformance products. These products, which range from standard linear regulators to highly efficient DC/DC
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com/power2013
Texas Instruments Power Management Guide
TPS53312
TPS65168
Samsung Exynos 5
TPS65178
ips 500w circuit diagram
500w push-pull power tl598 schematic diagram
Acid Battery charger 48 volt circuit tl494
UCC25600 application note
Buck-boost TL494
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BQ24153
Abstract: schematic diagram TCON lcd samsung tps51631 LG 21 color tv Circuit Diagram schematics ultraslim UCD90120 TPS65175 tps65642 LM2740 INA230 QFN 10 2x2 footprint
Text: Power Management Guide Power Management Guide 2014 2014 www.ti.com/power www.ti.com/power Power Management Guide Introduction and Contents Texas Instruments TI offers complete power solutions with a full line of highperformance products. These products, which range from standard linear
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2057 LED dot matrix display 5x7
Abstract: BQ24153 TPS65175 tps59620 TPS51624 LM2585 36 V - 72 V to 24 V LM5045 lm3630 lm5160 schematic diagram TCON lcd samsung
Text: Power Management Guide Power Management Guide 2015 www.ti.com/power www.ti.com/power 2015 Power Management Guide Introduction and Contents Texas Instruments TI offers complete power solutions with a full line of highperformance products. These products, which range from standard linear
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Untitled
Abstract: No abstract text available
Text: S25FL116K 16-Mbit 2-Mbyte CMOS 3.0-Volt Flash Non-Volatile Memory Serial Peripheral Interface (SPI) with Multi-I/O and Industrial Temperature Data Sheet (Advance Information) S25FL116K Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion
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S25FL116K
16-Mbit
S25FL116K
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S25FL164K
Abstract: S25FL164 S25FL116K S25FL132K S25FL132 S25FL116 S25FL-P FAC024 S25FL-K footprint USON-8
Text: S25FL116K 16-Mbit 2-Mbyte CMOS 3.0-Volt Flash Non-Volatile Memory Serial Peripheral Interface (SPI) with Multi-I/O and Industrial Temperature Data Sheet (Advance Information) S25FL116K Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion
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S25FL116K
16-Mbit
S25FL116K
S25FL164K
S25FL164
S25FL132K
S25FL132
S25FL116
S25FL-P
FAC024
S25FL-K
footprint USON-8
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S25FL116K
Abstract: No abstract text available
Text: S25FL116K 16-Mbit 2-Mbyte CMOS 3.0-Volt Flash Non-Volatile Memory Serial Peripheral Interface (SPI) with Multi-I/O and Industrial Temperature Data Sheet (Advance Information) S25FL116K Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion
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S25FL116K
16-Mbit
S25FL116K
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JESD216
Abstract: No abstract text available
Text: S25FL116K 16-Mbit 2-Mbyte CMOS 3.0-Volt Flash Non-Volatile Memory Serial Peripheral Interface (SPI) with Multi-I/O and Industrial and Automotive Temperature Data Sheet (Preliminary) S25FL116K Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion
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S25FL116K
16-Mbit
S25FL116K
JESD216
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JESD21
Abstract: No abstract text available
Text: S25FL116K 16-Mbit 2-Mbyte CMOS 3.0-Volt Flash Non-Volatile Memory Serial Peripheral Interface (SPI) with Multi-I/O and Industrial Temperature Data Sheet (Preliminary) S25FL116K Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion
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S25FL116K
16-Mbit
S25FL116K
JESD21
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S25FL164
Abstract: S25FL164K S25FL116K S25FL132 S25FL132K JESD94 FL116K WND008 S25FL1-K S25FL116
Text: S25FL116K 16-Mbit 2-Mbyte CMOS 3.0-Volt Flash Non-Volatile Memory Serial Peripheral Interface (SPI) with Multi-I/O and Industrial Temperature Data Sheet (Advance Information) S25FL116K Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion
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S25FL116K
16-Mbit
S25FL116K
S25FL164
S25FL164K
S25FL132
S25FL132K
JESD94
FL116K
WND008
S25FL1-K
S25FL116
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Untitled
Abstract: No abstract text available
Text: S25FL132K and S25FL164K S25FL132K – 32 Mbit 4 Mbyte S25FL164K – 64 Mbit (8 Mbyte) CMOS 3.0-Volt Flash Non-Volatile Memory Serial Peripheral Interface (SPI) with Multi-I/O Industrial and Automotive Temperature S25FL132K and S25FL164K Cover Sheet Data Sheet (Preliminary)
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S25FL132K
S25FL164K
S25FL132K
S25FL164K
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S25FL164K
Abstract: JESD21 SOIC 8 208mils pcb pattern
Text: S25FL132K and S25FL164K S25FL132K – 32 Mbit 4 Mbyte S25FL164K – 64 Mbit (8 Mbyte) CMOS 3.0-Volt Flash Non-Volatile Memory Serial Peripheral Interface (SPI) with Multi-I/O Industrial and Automotive Temperature S25FL132K and S25FL164K Cover Sheet Data Sheet (Preliminary)
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S25FL132K
S25FL164K
S25FL132K
S25FL164K
JESD21
SOIC 8 208mils pcb pattern
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S25FL164K
Abstract: No abstract text available
Text: S25FL132K and S25FL164K S25FL132K – 32 Mbit 4 Mbyte S25FL164K – 64 Mbit (8 Mbyte) CMOS 3.0-Volt Flash Non-Volatile Memory Serial Peripheral Interface (SPI) with Multi-I/O Industrial and Automotive Temperature S25FL132K and S25FL164K Cover Sheet Data Sheet (Preliminary)
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S25FL132K
S25FL164K
S25FL132K
S25FL164K
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SOIC 8 208mils pcb pattern
Abstract: No abstract text available
Text: S25FL132K and S25FL164K S25FL132K – 32 Mbit 4 Mbyte S25FL164K – 64 Mbit (8 Mbyte) CMOS 3.0-Volt Flash Non-Volatile Memory Serial Peripheral Interface (SPI) with Multi-I/O Industrial and Automotive Temperature S25FL132K and S25FL164K Cover Sheet Data Sheet (Preliminary)
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S25FL132K
S25FL164K
S25FL132K
S25FL164K
SOIC 8 208mils pcb pattern
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Untitled
Abstract: No abstract text available
Text: S25FL132K and S25FL164K S25FL132K - 32 Mbit 4 Mbyte S25FL164K - 64 Mbit (8 Mbyte) CMOS 3.0-Volt Flash Non-Volatile Memory Serial Peripheral Interface (SPI) with Multi-I/O Industrial and Automotive Temperature S25FL132K and S25FL164K Cover Sheet Data Sheet (Advance Information)
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S25FL132K
S25FL164K
S25FL164K
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Untitled
Abstract: No abstract text available
Text: S25FL1-K S25FL116K — 16 Mbit 2 Mbyte S25FL132K — 32 Mbit (4 Mbyte) S25FL164K — 64 Mbit (8 Mbyte) CMOS 3.0-Volt Flash Non-Volatile Memory Serial Peripheral Interface (SPI) with Multi-I/O Industrial and Extended Temperature S25FL1-K Cover Sheet Data Sheet
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S25FL1-K
S25FL116K
S25FL132K
S25FL164K
S25FL1-K
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