Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    FABRICATION PROCESS STEPS Search Results

    FABRICATION PROCESS STEPS Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    TMP89FS60AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP64-P-1010-0.50E Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS63AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP52-P-1010-0.65 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS60BFG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/P-LQFP64-1414-0.80-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS63BUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/P-LQFP52-1010-0.65-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS62AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP44-P-1010-0.80A Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS62BUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/P-LQFP44-1010-0.80-003 Visit Toshiba Electronic Devices & Storage Corporation

    FABRICATION PROCESS STEPS Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ASL3C

    Abstract: ALVCH16245 151x24
    Text: TEXAS INSTRUMENTS Initial Notification for the ASL3C Process with Retrograde Well to the Freising, Germany Wafer Fabrication Site November 19, 1998 Abstract Texas Instrument’s Friesing, Germany Wafer Fabrication Facility is qualifying the ALS3C process with retrograde well. This process change will affect all products in the ALVCH product family.


    Original
    PDF 100ical PCN5349 ASL3C ALVCH16245 151x24

    68LC060

    Abstract: F98S Motorola Mil Std. 883 xpc860 A113 J24A XPC850
    Text: Reliability Report for Networking Communication Microprocessors XPC850 Rev 0.3 XPC860 XPC860T 0.42m Single Poly Wafer Fabrication Process Revision: 5/99 1.0 Purpose and Description This report summarizes the reliability data for Motorola communication microprocessors fabricated on the 0.42m single polysilicon process in our wafer


    Original
    PDF XPC850 XPC860 XPC860T 68LC060 F98S Motorola Mil Std. 883 xpc860 A113 J24A XPC850

    Untitled

    Abstract: No abstract text available
    Text: TM September 2013 • What are Semiconductor Devices? • How Semiconductors are Made − Front-End Process − Back-End Process • Fabrication Facility and Equipment Issues • Business Aspects of Supplying Semiconductors TM 2 TM 4 A conductor carries electricity like a pipe


    Original
    PDF

    F98S

    Abstract: xpc860 68LC060 A113 J24A XPC850 Motorola, HBM, 1kv
    Text: Freescale Semiconductor, Inc. Reliability Report for Freescale Semiconductor, Inc. Networking Communication Microprocessors XPC850 Rev 0.3 XPC860 XPC860T 0.42m Single Poly Wafer Fabrication Process Revision: 5/99 For More Information On This Product, Go to: www.freescale.com


    Original
    PDF XPC850 XPC860 XPC860T F98S xpc860 68LC060 A113 J24A XPC850 Motorola, HBM, 1kv

    ed28 smd diode

    Abstract: hv 102 mos fet transistor diagram of high frequency pvc welding machine schematic diagram of electric cookers Ultrasonic Cleaner schematic engel injection machines TEG 2423 40khz ULTRASOUND CLEANER ultrasonic generator 40khz for cleaning schematic of trigger 555 n-mosfet
    Text: FAILURE MECHANISMS OF SEMICONDUCTOR DEVICES III. FAILURE MECHANISMS OF SEMICONDUCTOR DEVICES 1. INTRODUCTION 2. FAILURE MECHANISMS AND SCREENING 3. FAILURE MECHANISMS ATTRIBUTED TO WAFER FABRICATION PROCESS 3.1 HOT CARRIER 3.3.1.1 INTRODUCTION 3.3.1.2 HOT CARRIER MECHANISM


    Original
    PDF ED-4701-1 C-113: ed28 smd diode hv 102 mos fet transistor diagram of high frequency pvc welding machine schematic diagram of electric cookers Ultrasonic Cleaner schematic engel injection machines TEG 2423 40khz ULTRASOUND CLEANER ultrasonic generator 40khz for cleaning schematic of trigger 555 n-mosfet

    Untitled

    Abstract: No abstract text available
    Text: APEX 20KC Programmable Logic Device April 2002 ver. 2.1 Features. Data Sheet • ■ Programmable logic device PLD manufactured using a 0.15-µm alllayer copper-metal fabrication process – 25 to 35% faster design performance than APEXTM 20KE devices


    Original
    PDF 4001000CF33C8 EP20K1000CF33C9 EP20K1000C EP20K1000CF672C7 EP20K1000CF672C8 EP20K1000CF672C9 EP20K1000CF33I8 EP20K1000C

    Untitled

    Abstract: No abstract text available
    Text: APEX 20KC Programmable Logic Device March 2002 ver. 2.0 Features. Data Sheet • ■ Programmable logic device PLD manufactured using a 0.15-µm alllayer copper-metal fabrication process – 25 to 35% faster design performance than APEXTM 20KE devices


    Original
    PDF 40033C8 EP20K1000CF33C9 EP20K1000C EP20K1000CF672C7 EP20K1000CF672C8 EP20K1000CF672C9 EP20K1000CF33I8 EP20K1000C

    verilog prbs generator

    Abstract: prbs pattern generator using vhdl AOI gate d flip flop
    Text: ASIC Design Guidelines Introduction The Atmel ASIC Design Guidelines constitute a general set of recommendations intended for use by designers when preparing circuits for fabrication by Atmel. The guidelines are independent of any particular CAD tool or silicon process. They are


    Original
    PDF 12/99/xM verilog prbs generator prbs pattern generator using vhdl AOI gate d flip flop

    EP20K1000EFI672-2X

    Abstract: EP20K100ETC144 EP20K100EFC324-3 EP20K100FC324-3V EP20K400EFC672-3
    Text: APEX 20KC Programmable Logic Device April 2002 ver. 2.1 Features. Data Sheet • ■ Programmable logic device PLD manufactured using a 0.15-µm alllayer copper-metal fabrication process – 25 to 35% faster design performance than APEXTM 20KE devices


    Original
    PDF EP20K* EP20K400GC655-1 EP20K400GC655-2 EP20K400GC655-3 EP20K1000EFI672-2X EP20K100ETC144 EP20K100EFC324-3 EP20K100FC324-3V EP20K400EFC672-3

    EP20K1000C

    Abstract: EP20K200C EP20K400C EP20K600C EPC16 FA12 APEX 20ke development board sram
    Text: APEX 20KC Programmable Logic Device February 2004 ver. 2.2 Features. Data Sheet • ■ Programmable logic device PLD manufactured using a 0.15-µm alllayer copper-metal fabrication process – 25 to 35% faster design performance than APEXTM 20KE devices


    Original
    PDF

    EP20K1000C

    Abstract: EP20K200C EP20K400C EP20K600C EPC16 FA12 ep20k apex board
    Text: APEX 20KC Programmable Logic Device February 2002 ver. 2.0 Features. Data Sheet • ■ Programmable logic device PLD manufactured using a 0.15-µm alllayer copper-metal fabrication process – 25 to 35% faster design performance than APEXTM 20KE devices


    Original
    PDF

    EP20K1000C

    Abstract: EP20K1500C EP20K200C EP20K400C EP20K600C EPC16
    Text: APEX 20KC Programmable Logic Device October 2001, ver. 1.2 Features. Data Sheet • ■ Programmable logic device PLD manufactured using a 0.15-µm alllayer copper-metal fabrication process – 25 to 35% faster design performance than APEXTM 20KE devices


    Original
    PDF

    Untitled

    Abstract: No abstract text available
    Text: APEX 20KC Programmable Logic Device February 2004 ver. 2.2 Features. Data Sheet • ■ Programmable logic device PLD manufactured using a 0.15-µm alllayer copper-metal fabrication process – 25 to 35% faster design performance than APEXTM 20KE devices


    Original
    PDF 1000CB652C8 EP20K1000CB652C9 EP20K1000CF33C7 EP20K1000CF33C8 EP20K1000CF33C9 EP20K1000C EP20K1000CF672C7 EP20K1000CF672C8 EP20K1000CF672C9

    EP20K1000C

    Abstract: EP20K200C EP20K400C EP20K600C EPC16 FA12
    Text: APEX 20KC Programmable Logic Device March 2002 ver. 2.0 Features. Data Sheet • ■ Programmable logic device PLD manufactured using a 0.15-µm alllayer copper-metal fabrication process – 25 to 35% faster design performance than APEXTM 20KE devices


    Original
    PDF

    digital clock using logic gates

    Abstract: EP20K1000C EP20K100C EP20K1500C EP20K200C EP20K400C EP20K600C EPC16 epc1 configuration device
    Text: APEX 20KC Programmable Logic Device April 2001, ver. 1.1 Data Sheet • Features. Preliminary Information ■ Programmable logic device PLD manufactured using a 0.15-µm alllayer copper-metal fabrication process – 25 to 35% faster design performance than APEXTM 20KE devices


    Original
    PDF

    EP20K1000C

    Abstract: EP20K1500C EP20K200C EP20K400C EP20K600C EPC16
    Text: APEX 20KC Programmable Logic Device October 2001, ver. 1.2 Features. Data Sheet • Preliminary Information ■ Programmable logic device PLD manufactured using a 0.15-µm alllayer copper-metal fabrication process – 25 to 35% faster design performance than APEXTM 20KE devices


    Original
    PDF

    ep20k160ebc

    Abstract: ep20k400ef EP20K100F EP20K160EQ EP20K100EFC324-3 EP20K100FC324-3V EP20K200RC ep20k400CF672 EP20K100QI208-2
    Text: APEX 20KC Programmable Logic Device March 2001, ver. 1.0 Data Sheet • Features. Preliminary Information ■ Programmable logic device PLD manufactured using a 0.15-µm alllayer copper-metal fabrication process – 25 to 35% faster design performance than APEXTM 20KE devices


    Original
    PDF

    Strain gage report

    Abstract: with or without underfill flip SMT Texas "Strain Gage" ENIG strain rate texas instruments automotive flip chip underfill Texas alternative ENIG
    Text: Application Report SPRAA55 - August 2004 Use and Handling of Semiconductor Packages with ENIG Pad Finishes Eddie Moltz DSP Packaging ABSTRACT Electroless Nickel/Immersion Gold plating, or ENIG, is a versatile process and enables fabrication of high-density flip chip BGA substrates needed for high-performance IC chips.


    Original
    PDF SPRAA55 Strain gage report with or without underfill flip SMT Texas "Strain Gage" ENIG strain rate texas instruments automotive flip chip underfill Texas alternative ENIG

    Untitled

    Abstract: No abstract text available
    Text: 5410 series VCXO Module ICs with Built-in Varicap OVERVIEW The 5410 series are VCXO module ICs supported 20MHz to 62MHz fundamental oscillation. They employ a recently developed varicap diode fabrication process at fixation communication usage that provides a low phase noise characteristic and a wide frequency pulling


    Original
    PDF 20MHz 62MHz 150ppm 40MHz 140ppm 44MHz ND12007-E-02

    Untitled

    Abstract: No abstract text available
    Text: 5077 series VCXO Module ICs with Built-in Varicap OVERVIEW The 5077 series are LV-PECL output VCXO ICs that provide a wide frequency pulling range. They employ bipolar oscillator circuit and recently developed varicap diode fabrication process that provides a low phase noise characteristic and a wide frequency pulling range


    Original
    PDF 170MHz ND12024-E-03

    Untitled

    Abstract: No abstract text available
    Text: 5420 series VCXO Module ICs with Built-in Varicap OVERVIEW The 5420 series are LV-PECL output VCXO ICs that provide a wide frequency pulling range. They employ bipolar oscillator circuit and recently developed varicap diode fabrication process that provides a low phase noise characteristic and a wide frequency pulling range


    Original
    PDF 250MHz ND14003-E-00

    KOWA

    Abstract: 2014n J0123 vitramon 10C
    Text: STYLE V J 0 4 0 2 M onolithic C eram ic Chip C apacitors _ FEATURES Vttramon* proprietary "wet fabrication* process lor manufacturing ceramic chip capacitors results in maximum capacitance per unit area. A full range of dielectrics and voltage ratings is available in


    OCR Scan
    PDF VJ0402 BP113 F-41102 MIL-C-5568' KOWA 2014n J0123 vitramon 10C

    itr 9009

    Abstract: R/Vitramon J0603 marking code k4t KOWA specification CECC 3009 VJ0603Y104KXXMT
    Text: _ STYLE V J 0 6 0 3 M onolithic C eram ic Chip C apacitors Igtl Ji FEATURES Vitramon* proprietary "wet fabrication' process or manufacturing ceramic crup capacitors results in maximum capacitance per unit area. A full range ot dielectrics and voltage ratings is available in industry


    OCR Scan
    PDF VJ0603 J0603 11-4D-7191-8140 BP11S F-41102 C-55661. itr 9009 R/Vitramon marking code k4t KOWA specification CECC 3009 VJ0603Y104KXXMT

    Vendome

    Abstract: No abstract text available
    Text: STYLE V J0 80 5 M onolithic C eram ic Chip C ap acitors FEATURES VHram on* proprietary "W et fabrication* process for m anufacturing ceram ic chip capacitors results in maximum capacitance per unit area. A fu ll range of dielectrics and voltage ratings is available in


    OCR Scan
    PDF VJ0805 BP113 F-41102 3-5423-54i 011-33-IM80-2092 ILC-65681 Vendome