Untitled
Abstract: No abstract text available
Text: HEATSINKS AH Series HEATSINKS Extrusion Heatsinks F E AT U R E S • Many other extrusion profiles available. Contact Ohmite with your requirements • Multiple finishes available • Modifications available: screw holes, bolt patterns, milling per customer specifications
|
Original
|
PDF
|
AH33000
AH54100
AH80126
AH17500
AH10564
AH10551
AH40000
AH29300
AH10719
AH67200
|
TO-268
Abstract: No abstract text available
Text: • Increased thermal performance up to 30% over bright copper heat sinks from improved radiation of the black finish • Increased surface areas by 3 times therefore thermal performance up to 300% over the aluminum stamped heat sinks on markets • Unique aluminum extrusion
|
Original
|
PDF
|
O-263)
O-268)
O-263
O-268
1-866-9-OHMITE
TO-268
|
BS138
Abstract: L00524B EN755 L00516D 0S527 extrusion Heatsinks 0SA36 0S509 BS005 heatsink catalogue aavid
Text: T H E M A X C L I P S YS T E M Clip and Rail Thermal Solutions for Power Semiconductors WWW.AAVIDTHERMALLOY.COM CONTENTS The Max Clip System™ Profiles . 2
|
Original
|
PDF
|
|
1-800-546-APEX
Abstract: Alpha Industries pin diodes TFT250-18 tw03 apex 0/72555
Text: HEATSINKS, MATING SOCKETS, WASHERS, VENDORS ACCESSORIES INFORMATION M I C R O T E C H N O L O G Y HTTP://WWW.APEXMICROTECH.COM 800 546-APEX (800) 546-2739 RECOMMENDATIONS FOR THERMALLY CONDUCTIVE WASHERS Apex TW03, TW05, and TW10 (which are available from
|
Original
|
PDF
|
546-APEX
HS01U
1-800-546-APEX
Alpha Industries pin diodes
TFT250-18
tw03 apex
0/72555
|
LOCTITE 384
Abstract: ECCOBOND 281 melcor 705TC Emerson Cuming tellurex abletherm E629 E710 mastersil
Text: ATE-A2 Cooling High Density, High Power Pin Electronics TEST AND MEASUREMENT PRODUCTS Overview With IC’s ever-increasing speeds and pin counts, the power density inside Automated Test Equipment is also increasing. Keeping the high-speed pin drivers and other
|
Original
|
PDF
|
|
concord ca 2100
Abstract: fagor 2201 HS01U 104 csk 3554M TFT250-18 FAGOR f 948 Concord Electronics MS04/CAGE
Text: HEATSINKS, MATING SOCKETS, WASHERS, VENDORS ACCESSORIES INFORMATION M I C R O T E C H N O L O G Y HTTP://WWW.APEXMICROTECH.COM RECOMMENDATIONS FOR THERMALLY CONDUCTIVE WASHERS Apex thermal washers are also available from Power Devices. “Thermstrate” is the material trade name for these
|
Original
|
PDF
|
546-APEX
HS01U
concord ca 2100
fagor 2201
104 csk
3554M
TFT250-18
FAGOR f 948
Concord Electronics
MS04/CAGE
|
intel Socket 775
Abstract: socket 775 fan intel socket 775
Text: S YSTIUM M ODEL 10312-00 L OW P ROFILE ACTIVE HEATSINK 38mm The Systium® Model 10312-00 heatsink was created for multiple environments, easy of use, superior cooling and long life. This heatsink is only 38mm high but with a solid copper core allows it to cool processors up to 65W. Most heatsinks have the
|
Original
|
PDF
|
26AWG)
12VDC
G-751
intel Socket 775
socket 775
fan intel socket 775
|
to-268
Abstract: No abstract text available
Text: D Series Heatsinks For SMT devices TO-263 D2 TO-268 (D3) 1.02" 1.22" 25.91mm 31.0mm 0.50" 12.7mm Note: order TO-263 for TO-252 devices 0.27" 6.86mm 0.44" (11.2mm) 0.56" (14.2mm) TO-263 (D2) 0.63" (16.1mm) 0.75" (19.1mm) TO-268 (D3) L a n d P a tt e r n H e a t D i ss i p a t i o n
|
Original
|
PDF
|
O-263
O-268
O-263
O-252
O-252
to-268
|
to-268
Abstract: No abstract text available
Text: D Series Heatsinks For SMT devices TO-263 D2 TO-268 (D3) 1.02" 1.22" 25.91mm 31.0mm 0.50" 12.7mm Note: order TO-263 for TO-252 devices 0.27" 6.86mm 0.44" (11.2mm) 0.56" (14.2mm) TO-263 (D2) 0.63" (16.1mm) 0.75" (19.1mm) TO-268 (D3) L a n d P a tt e r n TO-263 (D2)
|
Original
|
PDF
|
O-263
O-268
O-263
O-252
to-268
|
heat exchanger process
Abstract: Ferraz Shawmut R-THETA
Text: Thermal Management Products Air and liquid cooled heatsinks and cooling solutions for power electronics Solutions to Meet Every Application Ferraz Shawmut is able to exploit a number of cooling technologies air, phase change, and liquid enabling us to meet every need
|
Original
|
PDF
|
K-001
heat exchanger process
Ferraz Shawmut
R-THETA
|
extrusion Heatsinks
Abstract: R-THETA Ferraz Shawmut SPD Ferraz Shawmut Heatsinks press-pack igbt industrial air cooler fin tube evaporator
Text: Thermal Management Products Air and liquid cooled heatsinks and cooling solutions for power electronics Solutions to Meet Every Application Ferraz Shawmut is able to exploit a number of cooling technologies air, phase change, and liquid enabling us to meet every need
|
Original
|
PDF
|
K-001
extrusion Heatsinks
R-THETA
Ferraz Shawmut SPD
Ferraz Shawmut
Heatsinks
press-pack igbt
industrial air cooler
fin tube evaporator
|
Untitled
Abstract: No abstract text available
Text: OPTIMUM DESIGN AND SELECTION OF HEAT SINKS ‘, Seri Lee Aavid Engineering Inc. Laconia, New Hampshire 0 3 2 4 7 Abstract An analytical simulation model has been developed for predicting and optimizing the thermal performance of bidirectional fin heat sinks in a partiaHy confined configuration. Sample calculations are carried out, and parametric
|
Original
|
PDF
|
|
W4DC105
Abstract: LP 8029 TR C458 w4dc162 W4DC132 NCT200 Thyristor w4dc162 w4dc162 pm W4DA250 w4da105
Text: Note: The data supplied in the enclosed tables is for general reference only. As data was collected from a number of sources, Richardson Electronics, Ltd. and its affiliates are not liable for its accuracy. Richardson Electronics, Ltd. and its affiliates reserve the right to make changes to the product s or information contained herein without notice. Richardson Electronics makes no warranty, representation or guarantee regarding
|
Original
|
PDF
|
comp70
90461435/WF5000/CR
W4DC105
LP 8029
TR C458
w4dc162
W4DC132
NCT200
Thyristor w4dc162
w4dc162 pm
W4DA250
w4da105
|
PE136627-4371-01F
Abstract: Intel socket 1366 PIN LAYOUT E29477-002 PT44L12-4101 foxconn LGA1366 FOXCONN fan PE136627 Z1ML005001 AVC fans pcie Design guide
Text: Intel Xeon® Processor 3500 Series Thermal / Mechanical Design Guide March 2009 Document Number: 321461-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS
|
Original
|
PDF
|
|
|
|
austerlitz
Abstract: Super-247 Package igbt clip extrusion Heatsinks igbt clip rail 20N-40N
Text: AN-997 v.Int Mounting Guidelines for the SUPER-247 by Andrew Sawle and Arthur Woodworth Introduction Born from the need to accommodate ever increasing amounts of silicon in smaller, space saving packages, the SUPER-247 now allows the same die sizes that can be put in a much larger TO-264. The SUPER-247
|
Original
|
PDF
|
AN-997
SUPER-247
SUPER-247
O-264.
O-247
austerlitz
Super-247 Package
igbt clip
extrusion Heatsinks
igbt clip rail
20N-40N
|
Super-247 Package
Abstract: extrusion mounted clip 20N-40N igbt clip Kool pad igbt clip rail
Text: Application Note AN-997 Mounting Guidelines for the Super-247 By Andrew Sawle and Arthur Woodworth Table of Contents Page Introduction .1 A Breakdown of System Thermal Resistance .1
|
Original
|
PDF
|
AN-997
Super-247TM
SUPER-247
Super-247 Package
extrusion mounted clip
20N-40N
igbt clip
Kool pad
igbt clip rail
|
Power supply in The air suction fan
Abstract: No abstract text available
Text: 10/08 PADA ENGINEERING S.r.l. Via G.B. Pirelli 11 I – 61030 Saltara PU - Italy Tel. +39 0721 899555 Fax +39 0721 897064 Email: pada@pada.it Web: www.pada.it SuperPower Developed in 1996 by our R & D, SuperPower is the solution for medium - high power electronic systems
|
Original
|
PDF
|
4212NN
LP6Y/240
300mm
LP6Y/160
Power supply in The air suction fan
|
redpoint 50
Abstract: extrusion Heatsinks AN-1000 AN997 AN1000
Text: Application Note AN-1000 Mounting Guidelines for the SUPER-220 By Andrew Sawle and Arthur Woodworth Table of Contents Page Thermal Resistance and Its Effects on System Performance. 2 Clip Mounting of the Super-220 Package. 3
|
Original
|
PDF
|
AN-1000
SUPER-220
Super-220TM
25-50N
redpoint 50
extrusion Heatsinks
AN-1000
AN997
AN1000
|
865GV
Abstract: 865PE 865g Motherboard 865g Motherboard 82865GV GMCH 865P foxconn 865g Intel reflow soldering profile BGA 865PE Intel 865G/865GV/865PE/865P Chipset intel 865gv chipset
Text: R Intel 865G/865GV/865PE/865P Chipset Thermal Design Guide For the Intel 82865G/82865GV Graphics and Memory Controller Hub GMCH and Intel 82865PE/82865P Memory Controller Hub (MCH) September 2003 Document Number: 252519-002 R INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR
|
Original
|
PDF
|
865G/865GV/865PE/865P
82865G/82865GV
82865PE/82865P
865G/865GV/865PE/865P
865GV
865PE 865g Motherboard
865g Motherboard
82865GV GMCH
865P
foxconn 865g
Intel reflow soldering profile BGA
865PE
Intel 865G/865GV/865PE/865P Chipset
intel 865gv chipset
|
Wakefield Engineering
Abstract: 647-15ABP AR285
Text: Wakefield Engineering m Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEATSINKS Labor-Saving SpeedClip Heat Sinks for Vertical Board Mounting 667 S E R IE S Standard P/N Standoff Pin Plain Pin Height Above PC Board “A” in. mm 667-1OABSP A
|
OCR Scan
|
PDF
|
667-1OABSP
667-10ABPP
667-15ABSP
667-15ABPP
667-20ABSP
667-20ABPP
667-25ABSP
667-25ABPP
MODEL647-ioABP
Wakefield Engineering
647-15ABP
AR285
|
Redpoint
Abstract: PF527 AV17 PF515 PF523 Scans-00808 3mc-17 j452 AV16 PF516
Text: redpoint Telephone: 0793 537861 Telex: 449543 Fax: 0793 615396 S PF515 PF516 Heatsink -T 03 Space saving design together with good thermal efficiency. Available in two fin heights. Finish: Black anodised. HEATSINK PERFORM ANCE TYPE 515-516 LOCAL AIR SPEED M/si
|
OCR Scan
|
PDF
|
PF515
PF516
PF523
PF526
PF527
Redpoint
AV17
Scans-00808
3mc-17
j452
AV16
|
Untitled
Abstract: No abstract text available
Text: Available Heatsinks Heatsink SEM IPA C K Length* Weight* Cooling mode Them lai resist,ance hea tsink air "Ithha °C /W SK K D 40 F S K M D 4 0 F SK K D 42 F SKM D 42 F SKNO 42 F SK K D 50 E SKND5Û E S K K D 105 F SKM D 105 F S K N D 1 0 5 F S K K D 115 F
|
OCR Scan
|
PDF
|
35KKD
SKFT150
|
FAGOR f 948
Abstract: SIP12 package pacifitek 56597
Text: H E A T S IN K S , M A T IN G S O C K E T S , W A S H E R S , V E N D O R S ACCESSORIES INFORMATION A P É X H T T P ://W W W .A P E X M IC R O T E C H .C O M M I C R O T E C H N O L O G Y 800 5 46-A PE X RECOMMENDATIONS FOR THERMALLY Apex therm al washers are also available from Power De
|
OCR Scan
|
PDF
|
|
ic marking hs01
Abstract: 1702M apex pa26 fagor f 948
Text: HEATSINKS, MATING SO C K E T S, W A SH ERS, VENDORS ACCESSORIES INFORMATION HTTP://W WW .APEXMICROTECH.COM 800 RECOMMENDATIONS FOR THERMALLY Apex thermal w ashers are also available from Power De vices. “Therm strate" is the material trade name for these
|
OCR Scan
|
PDF
|
546-APEX
HS01U
ic marking hs01
1702M
apex pa26
fagor f 948
|
