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Abstract: No abstract text available
Text: 40303.06 FSWLD 3/11/02 3:45 PM Page 229 The Furseweld Process Exothermic Welding Equipment is used by some of the world’s most demanding customers. By adding Furseweld to the Thomas & Betts product offering, T&B is now the only manufacturer that can offer exothermic welding, as well as
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Abstract: No abstract text available
Text: T&B Catalog Number: UPC Number: Description: Status: 5410402T 78621085546 Exothermic Welding reusable graphite mold for Cable to Cable Connection. Type CC7 - Parallel Splice, #2 solid to #2 Wire Size, 65RTB Welding Powder Size, Handle Clamp HCPK4. Active General
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5410402T
65RTB
E9809
3B-50
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burndy YGHC-C
Abstract: burndy gstud-hy burndy grounding terminal burndy YGIB UL-96 UL-96A Burndy y750bh Burndy burndy GROUNDING CONNECTORS Y700DC-1B
Text: 2006 Hyground Ref. Guide Standards and Codes NEC Article 250, Section 250-81 “It shall be permitted to splice the grounding electrode conductor by means of irreversible compression-type connectors listed for the purpose or by the exothermic welding process.”
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Ultrasonic welding circuit
Abstract: tantalum capacitors
Text: KEMET T E C H T O P I C S … T H E L E A D I N G E D G E VOL. 1, NO. 3 y PUBLISHED BY KEMET ELECTRONICS CORP. y P. O. BOX 5928 y GREENVILLE, SC 29606 y 864 963-6300 y JUNE 1991 This edition of Tech Topics…The Leading Edge is devoted to KEMET’s design of a fused surface mount tantalum
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burndy Y750
Abstract: burndy Y35 Burndy Y35 hypress IEEE-837 burndy* YA Lug Burndy burndy Y39 STR 5634 kpb 1313 B455 E20
Text: BURNDY Grounding TABLE OF CONTENTS HYGROUND® IRREVERSIBLE COMPRESSION GROUNDING AND INSTALLATION TOOLING ® HYGROUND Features Type YGIB . . . . . . . . . . E-20 - E-21 and Benefits . . . . . . . . . E-5 - E-6 E-1 Type YGL-C . . . . . . . . . . . . . . . . E-7
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KC22J12T13,
EQC632C,
B38-0330-00
burndy Y750
burndy Y35
Burndy Y35 hypress
IEEE-837
burndy* YA Lug
Burndy
burndy Y39
STR 5634
kpb 1313
B455 E20
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Text: KEMET Electronics Corp. Conductive Polymer Capacitors for Lead Free Processing 260°C The conductive polymer capacitor is a solid-state device in which the cathode material of Tantalum-MnO2 is replaced with a conductive polymer coating (Figure 1). This replacement was initialized as the polymer affords a higher
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J-STD-020C
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Abstract: No abstract text available
Text: 403030.05BB 3/12/02 9:10 AM Page 193 Grounding GROUNDING Product Overview . . . . . . . . . . . . . . . . . . . . . 194-196 E-Z Ground Compression Connectors . . . . . . . . . . . . . . . . . 197-203, 205-209 Cast Copper Connectors for Grounding . . . . . . . . . . . . . . . . . . . . . . . . . 204, 210
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mechanics blue msds
Abstract: amp quality crimping handbook soil "electrical conductivity" underground power cable book GUIDE INSTALLATION rbs 2111 UL486A BURNDY split bolt UL467 Aluminum alloys physical properties ASTM nut and bolt
Text: $22.00 BURNDY PRODUCTS www.fciconnect.com CALL 1-800-346-4175 FOR YOUR LOCAL SALES REPRESENTATIVE Connector Theory and Application Experience. Technology. Answers. Customer Service Dept. 7 Aviation Park Drive Londonderry, NH 03053 1-800-346-4175 Quebec & Eastern Ontario
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ca capacitor
Abstract: AVX Tantalum chamberlain MIL-PRF-55365 schematic diagram welding device kyocera 4m
Text: A New Low ESR Fused Solid Tantalum Capacitor A B S T R A C T : Solid tantalum capacitors are extremely reliable due to the nature of their materials and construction. The construction allows for small DC leakage sites within the device to become isolated electrochemically and
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S-STC00M407-N
ca capacitor
AVX Tantalum
chamberlain
MIL-PRF-55365
schematic diagram welding device
kyocera 4m
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Mn2O3
Abstract: Abstract ignition T510 T520 circuit diagram and abstract for timing bell system F3223 T491 solid tantalum chip capacitor", KEMET kemet cap mica
Text: New Tantalum Capacitors in Power Supply Applications 1998 IEEE Industry Applications Society Annual Meeting John D. Prymak KEMET Electronics Corp. P. O. Box 5928 Greenville, SC 29606 864 963-6300 Abstract — Capacitors used in various applications are usually selected for the usage by the type of capacitor. This
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F-3223;
AP-253;
Mn2O3
Abstract ignition
T510
T520
circuit diagram and abstract for timing bell system
F3223
T491 solid tantalum chip capacitor", KEMET
kemet cap mica
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LGA voiding
Abstract: CCGA APD-SCC-201 IBM ccga 67F4333 ceramic rework 810E N100 cte table flip chip substrate cte table epoxy
Text: CLASP CERAMIC COLUMN GRID ARRAY TECHNOLOGY FOR FLIP CHIP CARRIERS S. Ray, M. Interrante, L. Achard * , M. Cole, I. DeSousa(*), L. Jimarez, G. Martin, and C. Reynolds, IBM Microelectronics Division Hopewell Jct., NY (*) IBM Canada, Bromont, QUE Biography Sudipta Ray is a Senior Engineer in Interconnections
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67F4333,
F52977,
APD-SCC-201
LGA voiding
CCGA
IBM ccga
67F4333
ceramic rework
810E
N100
cte table flip chip substrate
cte table epoxy
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Mn2O3
Abstract: Ta2O5 MnO2
Text: by John D. Prymak KEMET Electronics Corp. P. O. Box 5928 Greenville, SC 29650 864 963-6300 Www.kemet.com Abstract The solid tantalum capacitor was born at the same time as the invention of the transistor, in the same Bell
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Ta2O5
Abstract: T510 materials T495
Text: Tantalum Capacitors in Power Supply Applications John D. Prymak Tantalum Applications Manager Kemet Electronics Corporation Abstract The capacitance range for tantalum capacitors spans from singular microfarads uFd through a thousand microfarads. It is an electrolytic type of capacitor that can utilize either a liquid type of electrolyte or a solid
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Tantalum in Power Supply Applications
Abstract: Mn2O3 F211 Ta2O5 T510 Chip Tantalum Capacitor CAP materials T495 PCIM+177
Text: Tantalum in Power Supply Applications 1998 PCIM by John Prymak Applications Manager P.O. Box 5928 Greenville, SC 29606 Phone 864 963-6300 Fax (864) 963-66521 www.kemet.com F2115 12/04 Tantalum Capacitors in Power Supply Applications John D. Prymak Tantalum Applications Manager
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F2115
Tantalum in Power Supply Applications
Mn2O3
F211
Ta2O5
T510
Chip Tantalum Capacitor CAP
materials T495
PCIM+177
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Untitled
Abstract: No abstract text available
Text: Optically Clear Epoxy Encapsulating & Potting Compound 8321C Technical Data Sheet 8321C Description The 8321C Optically Clear Epoxy, Encapsulating and Potting Compound, is an electronic grade, optically clear epoxy. It cures at room temperature or by heat curing.
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8321C
8321C
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Abstract: No abstract text available
Text: High Temperature Epoxy Encapsulating & Potting Compound 832HT Technical Data Sheet 832HT Description The 832HT High Temperature Epoxy Encapsulating and Potting Compound is an electronic grade epoxy designed for high temperature environments. It is also an ideal encapsulant for very chemically aggressive
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832HT
832HT
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Abstract: No abstract text available
Text: Black Epoxy Encapsulating & Potting Compound 832B Technical Data Sheet 832B Description The 832B Black Epoxy Encapsulating and Potting Compound is an electric grade epoxy. It is simple to mix and easy to use. This two parts black epoxy provides great insulation and protection value.
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Abstract: No abstract text available
Text: Thermally Conductive Epoxy Encapsulating & Potting Compound 832TC Technical Data Sheet 832TC Description The 832TC Thermally Conductive Epoxy, Encapsulating and Potting Compound, is an electric grade epoxy. It uses high purity aluminum oxide to provide excellent thermal conductivity at reasonable costs. This two
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Abstract: No abstract text available
Text: Flame Retardant Epoxy Encapsulating & Potting Compound 833FRB Technical Data Sheet 833FRB Encapsulating and Potting Epoxy Description The 833FRB Flame Retardant Epoxy Encapsulating and Potting Compound is a UL 94V-0 recognized electric grade epoxy in the QMFZ2 category. This two-part epoxy provides a black, self-extinguishing finish
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833FRB
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fuse d type
Abstract: No abstract text available
Text: 893D Vishay Sprague Solid Tantalum Chip Capacitors TANTAMOUNT , Built-In-Fuse Miniature, Molded-Case FEATURES • Molded case available in three case codes. • Compatible with "High Volume" automatic pick and place Pb-free Available RoHS* • Electrically activated internal fuse.
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535BAAC
QC300801/
US0001.
EIA-481-1.
18-Aug-05
fuse d type
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893D226X
Abstract: 893D 893D105X
Text: 893D Vishay Sprague Solid Tantalum Chip Capacitors TANTAMOUNT , Built-In-Fuse Miniature, Molded-Case FEATURES • Molded case available in three case codes. • Compatible with "High Volume" automatic pick and place equipment. • Electrically activated internal fuse.
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535BAAC
QC300801/
US0001.
330mm]
178mm]
EIA-481-1.
05-Jan-04
893D226X
893D
893D105X
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Untitled
Abstract: No abstract text available
Text: 893D Vishay Sprague Solid Tantalum Chip Capacitors TANTAMOUNT , Built-In-Fuse Miniature, Molded-Case FEATURES • Molded case available in three case codes. • Compatible with "High Volume" automatic pick and place Pb-free Available RoHS* • Electrically activated internal fuse.
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535BAAC
QC300801/
US0001.
08-Apr-05
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893D
Abstract: No abstract text available
Text: 893D Vishay Sprague Solid Tantalum Chip Capacitors TANTAMOUNT , Built-In-Fuse Miniature, Molded-Case FEATURES • Molded case available in three case codes. • Compatible with "High Volume" automatic pick and place equipment. • Electrically activated internal fuse.
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535BAAC
QC300801/
US0001.
330mm]
178mm]
EIA-481-1.
04-Feb-03
893D
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893D
Abstract: No abstract text available
Text: 893D Vishay Sprague Solid Tantalum Chip Capacitors TANTAMOUNT , Built-In-Fuse Miniature, Molded-Case FEATURES • Molded case available in three case codes. • Compatible with "High Volume" automatic pick and place equipment. • Electrically activated internal fuse.
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535BAAC
QC300801/
US0001.
EIA-481-1.
330mm]
178mm]
02-Mar-05
893D
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