TPD4163K
Toshiba Electronic Devices & Storage Corporation
Intelligent power device / VBB=600V / Iout=1A/ Through hole type / HDIP30
TPD4163F
Toshiba Electronic Devices & Storage Corporation
Intelligent power device / VBB=600V / Iout=1A/ Surface mount type / HSSOP31
7MPV4163-000
Renesas Electronics Corporation
SRAM MODULE
77314-163LF
Amphenol Communications Solutions
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Double Row, 12 Positions, 2.54 mm (0.100) Pitch.
10137924-1632LF
Amphenol Communications Solutions
Minitek® Pwr 3.0, Dual Row, Right Angle SMT Tails and Hold Down Header, 15u\\ Gold (Tin on Tails) plating, Black Color, 16 Positions, Non GW Compatible LCP.
