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    ESEC 3018 Search Results

    ESEC 3018 Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    XAL6030-182MEC Coilcraft Inc General Purpose Inductor, 1.8uH, 20%, 1 Element, Composite-Core, SMD, 2526, CHIP, 2526 Visit Coilcraft Inc
    LPS5030-183MRC Coilcraft Inc General Purpose Inductor, 18uH, 20%, 1 Element, Ferrite-Core, SMD, 1919, CHIP, 1919, HALOGEN FREE AND ROHS COMPLIANT Visit Coilcraft Inc
    XAL6030-182MEB Coilcraft Inc General Purpose Inductor, 1.8uH, 20%, 1 Element, Composite-Core, SMD, 2526, CHIP, 2526 Visit Coilcraft Inc
    SER3018H-472KE Coilcraft Inc General Purpose Inductor, 4.7uH, 10%, Ferrite-Core, Visit Coilcraft Inc
    LPS5030-185MRC Coilcraft Inc General Purpose Inductor, 1800uH, 20%, 1 Element, Ferrite-Core, SMD, 1919, CHIP, 1919, HALOGEN FREE AND ROHS COMPLIANT Visit Coilcraft Inc
    XPL7030-182MLB Coilcraft Inc General Purpose Inductor, 1.8uH, 20%, 1 Element, SMD, ROHS COMPLIANT Visit Coilcraft Inc

    ESEC 3018 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


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    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


    Original     		PDF

    esec 3018 operation

    Abstract: pulse amplitude modulation using 555 esec 3018 E2580 TCMD0110G
    Text: Advanced Data Sheet April 01, 2002 TCMD0110G 10 Gbits/s Clocked Modulator Driver Features • Operation to 12.5 Gbits/s NRZ. ■ Internal optional retiming flip-flop to minimize output data pattern jitter. ■ Adjustable output amplitude up to 3 V RL = 50 Ω .


    Original     		PDF TCMD0110G DS02-008HSPL esec 3018 operation pulse amplitude modulation using 555 esec 3018 E2580 TCMD0110G