TC-2707
Abstract: DP190 5589H Outgassing
Text: Technical Data January, 2010 3M Thermally Conductive Epoxy Adhesive TC-2707 Product Description 3M™ Thermally Conductive Epoxy Adhesive TC-2707 is an aluminum metal filled, two-part, thermally conductive epoxy adhesive. Key Features • Improved thermal conductivity.
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TC-2707
TC-2707
DP-460
225-3S-06
DP190
5589H
Outgassing
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PDF
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DP460
Abstract: D1876 epoxy thinner Outgassing 5589H Outgass DP-460 ADHESIVE GAP PAD TC2810+37ML
Text: Technical Data January, 2010 3M Thermally Conductive Epoxy Adhesive TC-2810 Product Description 3M™ Thermally Conductive Epoxy Adhesive TC-2810 is a boron nitride filled, two-part, thermally conductive epoxy adhesive. Key Features • Improved thermal conductivity.
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TC-2810
TC-2810
DP-460
225-3S-06
DP460
D1876
epoxy thinner
Outgassing
5589H
Outgass
ADHESIVE GAP PAD
TC2810+37ML
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PDF
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10P8-11
Abstract: alodine 1200 MIL-PRF-23377 EC-286 CMFS035 msds paint BS22455 akzonobel painting curing PS84
Text: 10P8-11 VOC Compliant Epoxy Primer Product Group Epoxy primer Characteristics A two component VOC compliant epoxy primer with performance characteristics similar to MIL-PRF-23377, Class C2. This primer will provide a vey smooth finish optimizing the appearance of the
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10P8-11
MIL-PRF-23377,
EC-286
TR-115
CMFS035
BS22455
MIL-PRF-23377
alodine 1200
EC-286
CMFS035
msds paint
BS22455
akzonobel painting
curing
PS84
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PDF
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mjg-2
Abstract: EPY-500 vishay m-line rosin solvent strain gage M-prep neutralizer mjg 2 Strain Gage adhesive paper GT-14 unbonded strain gage degreaser
Text: Instruction Bulletin B-172 Vishay Micro-Measurements Strain Gage Installations with EPY-500 Adhesive Description EPY-500 is a two-part, heat curing, epoxy system that is specially formulated for MicroMeasurements. This adhesive has reduced particle size, allowing a much thinner glue line.
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Original
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B-172
EPY-500
27-Jan-05
mjg-2
vishay m-line rosin solvent
strain gage
M-prep neutralizer
mjg 2
Strain Gage adhesive paper
GT-14
unbonded strain gage
degreaser
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PDF
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LEAD FRAME SURFACE MOUNT
Abstract: 100PPM epoxy thinner NTC-T
Text: Updated April 2004 www.niccomp.com Tech Support: tpmg@niccomp.com COMPONENT CONSTRUCTION PRODUCT: SURFACE MOUNT TANTALUM ELECTROLYTIC CAPACITORS SERIES: NTC-T, NTC-L, NTP Conductive Adhesive Capacitor Element Epoxy Molding Lead Frame Tantalum Silver Adhesive
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100PPM
LEAD FRAME SURFACE MOUNT
epoxy thinner
NTC-T
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PDF
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Untitled
Abstract: No abstract text available
Text: RECOMMENDED REFLOW CONDITION CONDUCTIVE POLYMER ALUMINUM SOLID CAPACITORS Surface Mount RECOMMENDED REFLOW SOLDERING CONDITION The following conditions are recommended for air or infrared reflow soldering PXA/PXseries onto a glass epoxy circuit board of 90B50B0.8mm
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90B50B0
40sec
30sec)
30sec
60sec
50sec)
E1001C
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PDF
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JESD22-B102-D
Abstract: No abstract text available
Text: Product Family: Chip Power Resistor Part Number Series: CPA1206*FS Construction: • High Purity Alumina • Nickel alloy thin-film resistive element • Epoxy-resin overcoat • Pre-tinned Sn100, matte terminations over Ni barrier is standard Features:
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CPA1206*
Sn100,
25ppm/
Sn60Pb40
CR1206
MIL-STD-1285D)
CPA1206E39R0FS-T10)
JESD22-B102-D
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PDF
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IPC-4101
Abstract: No abstract text available
Text: Product Family: RF Chip Power Resistor Part Number Series: CFA1206E50R0FS Construction: • High Purity Alumina • Nickel alloy thin-film resistive element • Epoxy-resin overcoat • Pre-tinned Sn100, matte terminations over Ni barrier is standard Features:
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CFA1206E50R0FS
Sn100,
25ppm/
Sn60Pb40
CR1206
MIL-STD-1285D)
CFA1206E50R0FS-T10)
IPC-4101
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PDF
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Untitled
Abstract: No abstract text available
Text: Product Family: 7 Watt RF Chip Power Resistor Part Number Series: CFA1206 Series Construction: Features: • • • • • • High purity alumina substrate Nickel alloy thin-film resistive element Epoxy-resin overcoat Pre-tinned Sn100, matte terminations
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CFA1206
Sn100,
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PDF
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Untitled
Abstract: No abstract text available
Text: Standard Product Reference Sheet FKY1112H-TR Features Package 2125（ｔ＝0.8ｍｍ）type, Milky white epoxy Product features ・Outer dimension 2.0 x 1.25 x 0.8mm L x W x H ・Lead-free soldering compatible ・RoHS compliant Recommended Applications
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FKY1112H-TR
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PDF
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DSA0090625.txt
Abstract: No abstract text available
Text: 5.0 mm DIA LED LAMP 599R2GYW-CC REV:A / 0 PACKAGE DIMENSIONS ITEM MATERIALS RESIN Epoxy Resin LEAD FRAME Sn Plating iron Alloy Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm 0.010 " Unless otherwise specified. 3.Protruded resin under flange
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599R2GYW-CC
DS-35-07-0235
HD-R/RD013
DSA0090625.txt
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PDF
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k2950
Abstract: IR 16713
Text: 5.0 mm DIA LED 540R2GY-CC LAMP REV:A / 0 PACKAGE DIMENSIONS ITEM MATERIALS RESIN Epoxy Resin LEAD FRAME Sn Plating iron Alloy Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm 0.010 " Unless otherwise specified. 3.Protruded resin under flange
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540R2GY-CC
DS-35-07-0235
HD-R/RD013
k2950
IR 16713
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PDF
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d4515
Abstract: LED highlight
Text: 5.0 mm DIA LED LAMP REV:A / 0 520PG2C-F2 PACKAGE DIMENSIONS ITEM MATERIALS RESIN Epoxy Resin LEAD FRAME Sn Plating iron Alloy Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm 0.010 " Unless otherwise specified. 3.Protruded resin under flange
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520PG2C-F2
-400V
DS-35-08-0395
mm8-12-24
d4515
LED highlight
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PDF
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Untitled
Abstract: No abstract text available
Text: 5.0 mm DIA LED LAMP REV:A / 1 520CG6C-f2 PACKAGE DIMENSIONS ITEM MATERIALS RESIN Epoxy Resin LEAD FRAME Sn Plating iron Alloy Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm 0.010 " Unless otherwise specified. 3.Protruded resin under flange
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520CG6C-f2
DS-35-08-0354
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PDF
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IPC4101
Abstract: No abstract text available
Text: Product Family: RF Power Chip Resistor Part Number: CF*2512E50R0FS Susumu World Group Construction: • 99.5% BeO or High Purity Alumina • Nickel alloy thin-film resistive element • Epoxy-resin overcoat • Pre-tinned Sn100, matte terminations over Ni barrier is standard
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2512E50R0FS
Sn100,
25ppm/
Sn60Pb40
MIL-STD-1285D)
A50R0
CFA2512E50R0FS-T10)
IPC4101
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PDF
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2512E50R0JS
Abstract: No abstract text available
Text: Product Family: RF Power Chip Resistor Part Number: CF*2512E50R0JS Susumu World Group Construction: • BeO or High Purity Alumina • Nickel alloy thin-film resistive element • Epoxy-resin overcoat • Pre-tinned Sn100, matte terminations over Ni barrier is standard
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2512E50R0JS
Sn100,
25ppm/
Sn60Pb40
MIL-STD-1285D)
A50R0
CFA2512E50R0JS-T10)
2512E50R0JS
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PDF
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Untitled
Abstract: No abstract text available
Text: TECHNICAL BULLETIN TB-2091 Micastat Static Protective Laminate Installation and Maintenance Made in America cement, white glue PVA , epoxy, and hot melt glue. Consult your adhesive supplier for specific application requirements. Micastat® is a universal grade laminate for use in general
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TB-2091
16-oz.
TB-2032.
TB-2091
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PDF
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Untitled
Abstract: No abstract text available
Text: 5.0 mm DIA LED LAMP REV:A / 1 520MY8C-f2 PACKAGE DIMENSIONS ITEM MATERIALS RESIN Epoxy Resin LEAD FRAME Sn Plating iron Alloy Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm 0.010 " Unless otherwise specified. 3.Protruded resin under flange
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520MY8C-f2
DS-35-05-0057
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PDF
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cho-bond 1086
Abstract: cho-bond 1075 Cho-Bond 584-29 cho-bond 1029 584-29 cho-bond primer 1086 RTV silicone viscosity 51-00-1035-0000 50-02-1075-0000 CHO-SEAL 1285
Text: CONDUCTIVE COMPOUNDS CHO-BOND Conductive Adhesives Single- and two-component epoxy and silicone adhesives, with room temperature, elevated temperature or moisture cure mechanisms. Epoxies for Microelectronics Chomerics’ growing family of conductive epoxies now includes one-part, silver-filled pastes formulated for today’s
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MIL-I-45208.
cho-bond 1086
cho-bond 1075
Cho-Bond 584-29
cho-bond 1029
584-29
cho-bond primer 1086
RTV silicone viscosity
51-00-1035-0000
50-02-1075-0000
CHO-SEAL 1285
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PDF
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Untitled
Abstract: No abstract text available
Text: CF02M591-01 Rev E - Page 1 of 3 Construction: • High purity alumina substrate Nickel alloy thin-film resistive element Epoxy-resin overcoat Pre-tinned Sn100, matte terminations over Ni barrier is standard (RoHS compliant and Pb Free)
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CF02M591-01
Sn100,
72C/W)
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PDF
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Untitled
Abstract: No abstract text available
Text: Standard Product Specifications FKR1105W-TR/-RR Features Package Product features 3216 Dome lens type, Water clear epoxy ・Outer dimension 3.2 x 1.6 x 1.85mm L x W x H ・ Surface mounting(-TR) / Reverse mounting(-RR) available ・12 times brighter than current product (TYP. brightness)
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FKR1105W-TR/-RR
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PDF
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Bottle Type Screw Jack
Abstract: Mallet tempilaq
Text: TECHNICAL BULLETIN TB-2091 Micastat Static Protective Laminate Installation and Maintenance Made in America applications to a minimum of 5/8" radius. Desco suggests the use of a high quality solvent or water-based contact cement, white glue PVA , epoxy, and hot melt glue. Consult
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TB-2091
16-oz.
TB-2032.
TB-2091
Bottle Type Screw Jack
Mallet
tempilaq
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PDF
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IPC-4101
Abstract: ipc4101 B25-12 res chip 2w 2512 EIA-638 106G 208H 210F JESD22-B102D J-STD-002B
Text: Product Family: Chip Power Resistor Part Number Series: CP*2512*####FS Standard CP*2512, CP*2525 shown in image Susumu World Group Construction: • 99.5% BeO or High Purity Alumina • Nickel alloy thin-film resistive element • Epoxy-resin overcoat • Pre-tinned Sn100, matte terminations
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Sn100,
25ppm/
Sn60Pb40
MIL-STD-1285D)
A27R0
CPA2512E27R0FS-T10)
IPC-4101
ipc4101
B25-12
res chip 2w 2512
EIA-638
106G
208H
210F
JESD22-B102D
J-STD-002B
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PDF
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CF02M591-01
Abstract: No abstract text available
Text: CF02M591-01 Rev E - Page 1 of 3 Product Family: 7 Watt RF Chip Power Resistor Part Number: CFA1206E50R0FS-T50 Construction: Features: • High purity alumina substrate Nickel alloy thin-film resistive element Epoxy-resin overcoat
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CF02M591-01
CFA1206E50R0FS-T50
Sn100,
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PDF
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