TC-2707
Abstract: DP190 5589H Outgassing
Text: Technical Data January, 2010 3M Thermally Conductive Epoxy Adhesive TC-2707 Product Description 3M™ Thermally Conductive Epoxy Adhesive TC-2707 is an aluminum metal filled, two-part, thermally conductive epoxy adhesive. Key Features • Improved thermal conductivity.
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TC-2707
TC-2707
DP-460
225-3S-06
DP190
5589H
Outgassing
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DP460
Abstract: D1876 epoxy thinner Outgassing 5589H Outgass DP-460 ADHESIVE GAP PAD TC2810+37ML
Text: Technical Data January, 2010 3M Thermally Conductive Epoxy Adhesive TC-2810 Product Description 3M™ Thermally Conductive Epoxy Adhesive TC-2810 is a boron nitride filled, two-part, thermally conductive epoxy adhesive. Key Features • Improved thermal conductivity.
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TC-2810
TC-2810
DP-460
225-3S-06
DP460
D1876
epoxy thinner
Outgassing
5589H
Outgass
ADHESIVE GAP PAD
TC2810+37ML
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10P8-11
Abstract: alodine 1200 MIL-PRF-23377 EC-286 CMFS035 msds paint BS22455 akzonobel painting curing PS84
Text: 10P8-11 VOC Compliant Epoxy Primer Product Group Epoxy primer Characteristics A two component VOC compliant epoxy primer with performance characteristics similar to MIL-PRF-23377, Class C2. This primer will provide a vey smooth finish optimizing the appearance of the
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10P8-11
MIL-PRF-23377,
EC-286
TR-115
CMFS035
BS22455
MIL-PRF-23377
alodine 1200
EC-286
CMFS035
msds paint
BS22455
akzonobel painting
curing
PS84
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mjg-2
Abstract: EPY-500 vishay m-line rosin solvent strain gage M-prep neutralizer mjg 2 Strain Gage adhesive paper GT-14 unbonded strain gage degreaser
Text: Instruction Bulletin B-172 Vishay Micro-Measurements Strain Gage Installations with EPY-500 Adhesive Description EPY-500 is a two-part, heat curing, epoxy system that is specially formulated for MicroMeasurements. This adhesive has reduced particle size, allowing a much thinner glue line.
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B-172
EPY-500
27-Jan-05
mjg-2
vishay m-line rosin solvent
strain gage
M-prep neutralizer
mjg 2
Strain Gage adhesive paper
GT-14
unbonded strain gage
degreaser
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14P10
Abstract: MPC CAPACITOR
Text: Metallized Polycarbonate Capacitor MPC MPC are non-inductively wound with metallized Polycarbonate dielectric/electrode with copper-clad steel leads and epoxy resin coating. They are suitable for applications at high frequencies requiring long term stability. Its thinner body is ideal for critical spacing requirements.
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100VDC,
250VDC,
400VDC
14P10
MPC CAPACITOR
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LEAD FRAME SURFACE MOUNT
Abstract: 100PPM epoxy thinner NTC-T
Text: Updated April 2004 www.niccomp.com Tech Support: tpmg@niccomp.com COMPONENT CONSTRUCTION PRODUCT: SURFACE MOUNT TANTALUM ELECTROLYTIC CAPACITORS SERIES: NTC-T, NTC-L, NTP Conductive Adhesive Capacitor Element Epoxy Molding Lead Frame Tantalum Silver Adhesive
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100PPM
LEAD FRAME SURFACE MOUNT
epoxy thinner
NTC-T
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h25b
Abstract: MKA Series MFZ Series
Text: SURFACE MOUNT ALUMINUM ELECTROLYTIC CAPACITORS Functional polymer electrolyte capacitors RECOMMENDED REFLOW SOLDERING CONDITION The following conditions are recommended for air or infrared reflow soldering PX/PXAseries onto a glass epoxy circuit board of 90B50B0.8mm
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90B50B0
40sec
30sec
50sec
60sec
50smmended
E1001A
h25b
MKA Series
MFZ Series
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Untitled
Abstract: No abstract text available
Text: RECOMMENDED REFLOW CONDITION CONDUCTIVE POLYMER ALUMINUM SOLID CAPACITORS Surface Mount RECOMMENDED REFLOW SOLDERING CONDITION The following conditions are recommended for air or infrared reflow soldering PXA/PXseries onto a glass epoxy circuit board of 90B50B0.8mm
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90B50B0
40sec
30sec)
30sec
60sec
50sec)
E1001C
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Untitled
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS CONDUCTIVE POLYMER ALUMINUM SOLID CAPACITORS Surface Mount RECOMMENDED REFLOW SOLDERING CONDITION The following conditions are recommended for air or infrared reflow soldering PXC/PXA series onto a glass epoxy circuit board of 90B50B0.8mm
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90B50B0
40sec
30sec)
30mmended
E1001D
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thermal camera
Abstract: IPC-4101 Sn60Pb40 solder Sn60Pb40 JESD22-B102D J-STD-002B 106G 208H 210F Res 2512
Text: Product Family: RF Chip Power Resistor Part Number Series: CFA2512E50R0JS Construction: • High Purity Alumina • Nickel alloy thin-film resistive element • Epoxy-resin overcoat • Pre-tinned Sn100, matte terminations over Ni barrier is standard Features:
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CFA2512E50R0JS
Sn100,
25ppm/
Sn60Pb40
MIL-STD-1285D)
A50R0
CFA2512E50R0JS-T10)
thermal camera
IPC-4101
Sn60Pb40 solder
JESD22-B102D
J-STD-002B
106G
208H
210F
Res 2512
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JESD22-B102-D
Abstract: No abstract text available
Text: Product Family: Chip Power Resistor Part Number Series: CPA1206*FS Construction: • High Purity Alumina • Nickel alloy thin-film resistive element • Epoxy-resin overcoat • Pre-tinned Sn100, matte terminations over Ni barrier is standard Features:
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CPA1206*
Sn100,
25ppm/
Sn60Pb40
CR1206
MIL-STD-1285D)
CPA1206E39R0FS-T10)
JESD22-B102-D
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IPC-4101
Abstract: No abstract text available
Text: Product Family: RF Chip Power Resistor Part Number Series: CFA1206E50R0FS Construction: • High Purity Alumina • Nickel alloy thin-film resistive element • Epoxy-resin overcoat • Pre-tinned Sn100, matte terminations over Ni barrier is standard Features:
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CFA1206E50R0FS
Sn100,
25ppm/
Sn60Pb40
CR1206
MIL-STD-1285D)
CFA1206E50R0FS-T10)
IPC-4101
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IPC-4101
Abstract: 39R0 106G 208H 210F JESD22-B102D J-STD-002B IPC4101
Text: Product Family: Chip Power Resistor Part Number Series: CPA1206*FS Construction: • High Purity Alumina • Nickel alloy thin-film resistive element • Epoxy-resin overcoat • Pre-tinned Sn100, matte terminations over Ni barrier is standard Features:
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CPA1206*
Sn100,
25ppm/
Sn60Pb40
effecti00
MIL-STD-1285D)
CPA1206E39R0FS-T10)
IPC-4101
39R0
106G
208H
210F
JESD22-B102D
J-STD-002B
IPC4101
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Untitled
Abstract: No abstract text available
Text: Product Family: RF Chip Power Resistor Part Number Series: CFA2512E50R0JS Construction: • High Purity Alumina • Nickel alloy thin-film resistive element • Epoxy-resin overcoat • Pre-tinned Sn100, matte terminations over Ni barrier is standard Features:
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CFA2512E50R0JS
Sn100,
25ppm/Â
Sn60Pb40
MIL-STD-1285D)
A50R0
CFA2512E50R0JS-T10)
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Untitled
Abstract: No abstract text available
Text: Standard Product Reference Sheet FKA1112H-TR Features Package 2125（ｔ＝0.8ｍｍ）type, Milky white epoxy Product features ・Outer dimension 2.0 x 1.25 x 0.8mm L x W x H ・Lead-free soldering compatible ・RoHS compliant Recommended Applications
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FKA1112H-TR
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Untitled
Abstract: No abstract text available
Text: Standard Product Specifications TAN1111R-TR Features Package 3216 Reverse Mount type, Water clear epoxy Lens Out Dimension 3.2 x 1.6 x 1.1mm L x W x H Product features ・Infra-Red emitting LED ・Lead–free soldering compatible ・RoHS compliant Recommended Applications
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TAN1111R-TR
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Untitled
Abstract: No abstract text available
Text: Standard Product Reference Sheet FKR1112H-TR Features Package 2125（ｔ＝0.8ｍｍ）type, Milky white epoxy Product features ・Outer dimension 2.0 x 1.25 x 0.8mm L x W x H ・Lead-free soldering compatible ・RoHS compliant Recommended Applications
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FKR1112H-TR
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Untitled
Abstract: No abstract text available
Text: Standard Product Reference Sheet FKY1112H-TR Features Package 2125（ｔ＝0.8ｍｍ）type, Milky white epoxy Product features ・Outer dimension 2.0 x 1.25 x 0.8mm L x W x H ・Lead-free soldering compatible ・RoHS compliant Recommended Applications
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FKY1112H-TR
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DSA0090625.txt
Abstract: No abstract text available
Text: 5.0 mm DIA LED LAMP 599R2GYW-CC REV:A / 0 PACKAGE DIMENSIONS ITEM MATERIALS RESIN Epoxy Resin LEAD FRAME Sn Plating iron Alloy Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm 0.010 " Unless otherwise specified. 3.Protruded resin under flange
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599R2GYW-CC
DS-35-07-0235
HD-R/RD013
DSA0090625.txt
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k2950
Abstract: IR 16713
Text: 5.0 mm DIA LED 540R2GY-CC LAMP REV:A / 0 PACKAGE DIMENSIONS ITEM MATERIALS RESIN Epoxy Resin LEAD FRAME Sn Plating iron Alloy Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm 0.010 " Unless otherwise specified. 3.Protruded resin under flange
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540R2GY-CC
DS-35-07-0235
HD-R/RD013
k2950
IR 16713
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Untitled
Abstract: No abstract text available
Text: CP02M581.01 Rev D – Page 1 of 3 Product Family: Chip Power Resistor Part Number Series: CPA2512*####FS Construction: • High Purity Alumina ceramic Nickel alloy thin-film resistive element Epoxy-resin overcoat Pre-tinned Sn100, matte terminations over
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CP02M581
CPA2512*
Sn100,
25ppm/Â
Sn60Pb40
CPA2512E27R0FS-T10)
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Untitled
Abstract: No abstract text available
Text: Metallized Polycarbonate Capacitor MPC MPC are non-inductively wound with metallized Polycarbonate dielectric/electrode with copper-clad steel leads and epoxy resin coating. They are suitable for applications at high frequencies requiring long term stability. Its thinner body is ideal for critical spacing requirements.
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sprague VITAMIN
Abstract: No abstract text available
Text: INTRODUCTION DEARBORN INTRODUCTION TO DEARBORN FILM CAPACITORS Capacitor housings include drawn and fabricated metal shells in standard, rectangular, and special shapes, glass and ceramic tubes, plastic-film tubes and plastic-film wraps with epoxy and resin end fills. Special mounting
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sprague capacitor
Abstract: sprague VITAMIN
Text: INTRODUCTION dSPRAGUE INTRODUCTION TO SPRAGUE FILM CAPACITORS Capacitor housings include drawn and fabricated metal shells in standard, rectangular, and special shapes, glass and ceramic tubes, plastic-film tubes and plastic-film wraps with epoxy and resin end fills. Special mounting
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120Hz)
sprague capacitor
sprague VITAMIN
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