FR4 epoxy dielectric constant 4.2
Abstract: panasonic r1551 FR4 epoxy dielectric constant 4.4 FR4 dielectric constant 4.6 prepreg 1037 r1566 FR4 dielectric constant 4.4 thickness 1.6 R1551 epoxy prepreg panasonic FR4 dielectric constant 4.3
Text: Data Sheet Halogen-free Glass Epoxy Multi-layer Materials Laminate R-1566 W Prepreg R-1551(W) UL/ANSI FR-4 Primary:/127 IPC-4101 Slash Sheet Secondary:/92 /93 /94(*) /95(*) /122 /125(*) /128(*) (*)；Tg measurement is limited to DMA method for Slash Sheet
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R-1566
R-1551
IPC-4101
TM-650
FR4 epoxy dielectric constant 4.2
panasonic r1551
FR4 epoxy dielectric constant 4.4
FR4 dielectric constant 4.6
prepreg 1037
r1566
FR4 dielectric constant 4.4 thickness 1.6
R1551
epoxy prepreg panasonic
FR4 dielectric constant 4.3
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Nelco 4000-13
Abstract: Nelco 4000-6
Text: PCB Dielectric Material Selection and Fiber Weave Effect on High-Speed Channel Routing AN-528-1.1 Application Note As data rates increase, designers are increasingly moving away from wide parallel buses to serial buses with differential signaling. Differential signaling uses two output
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AN-528-1
Nelco 4000-13
Nelco 4000-6
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FR4 epoxy dielectric constant 4.4
Abstract: FR4 substrate epoxy dielectric constant 4.4 Rogers 4350B Nelco 4000-13 FR4 epoxy dielectric constant 3.2 FR4 substrate with dielectric constant 4.4 Rogers 4350B substrate Nelco-4000 FR4 substrate fiberglass n6000-21-si
Text: PCB Dielectric Material Selection and Fiber Weave Effect on High-Speed Channel Routing Application Note 528 May 2008, v1.0 Introduction As data rates increase, designers are increasingly moving away from wide parallel buses to serial buses with differential signaling. Differential
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Fabrication process steps metal core pcb
Abstract: led mcpcb large copper trace thermal Fabrication process steps mcpcb AL 5052 luxeon 1w fabrication of mcpcb fr4 metal slug Aluminum Base LED PCB FR4 Prepreg 390DH4
Text: AB10 LuxeonTM Emitter Assembly Information Application Brief Table of Contents • Introduction · Important Design Rules · Metal Core Printed Circuit Board MCPCB · Supply Chain and MCPCB Specification · MCPCB Design Guidelines · Process Flow to Build
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BERGQUIST LTI-04503
Abstract: BERGQUIST mp-06503 "10 watt led" LTI-04503 ASTM 5470 GAP FILLER TCP-1000 HT-04503 Aluminum Base LED PCB 10 watt L.E.D MP-06503
Text: Thermal Solutions For Long-Term Reliability Of Power LEDs Thermal Management For LEDApplications S O L U T I O N S G U I D E Bergquist Thermal Solutions Insure Color Consistency And Maximum Lifecycles For Your LEDs. Light Emitting Diodes LEDs have been around for years, primarily
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MK80AD
D-25421
BERGQUIST LTI-04503
BERGQUIST mp-06503
"10 watt led"
LTI-04503
ASTM 5470 GAP FILLER
TCP-1000
HT-04503
Aluminum Base LED PCB
10 watt L.E.D
MP-06503
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25038-59-9
Abstract: No abstract text available
Text: MATERIAL DECLARATION SHEET Material Product Line Revision Date Revision RoHS Compliant Halogen free compliant MF-FSMF020X Multifuse March.06, 2009 A Yes Yes 1 Breakdown of part eg Lead, Ceramic body, coating, plating, additive Carbon Black 2 Copper plating
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25038-59-9
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25038-59-9
Abstract: epoxy prepreg
Text: MATERIAL DECLARATION SHEET Material Product Line Revision Date Revision RoHS Compliant Halogen free compliant MF-FSMF035X Multifuse March.06, 2009 A Yes Yes 1 Breakdown of part eg Lead, Ceramic body, coating, plating, additive Carbon Black 2 Copper plating
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MF-FSMF035X
7440-r
25038-59-9
epoxy prepreg
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prepreg
Abstract: No abstract text available
Text: MATERIAL DECLARATION SHEET Material Product Line Revision Date Revision RoHS Compliant Halogen free compliant MF-FSMF050X Multifuse March.06, 2009 A Yes Yes 1 Breakdown of part eg Lead, Ceramic body, coating, plating, additive Carbon Black 2 Copper plating
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7440-5pper
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luxeon 5 watt
Abstract: AL 5052 luxeon 3 watt luxeon 10 watt LXHL-LW6C 5mm uv led datasheet philips Loctite 3873 luxeon 1w RED luxeon 1w Loctite 3873 rework
Text: power light source Luxeon V Portable TM Technical Data DS40 Features • Highest Flux LED in the world – 50X LuxeonTM is a revolutionary, energy efficient and ultra compact new light source, combining the lifetime and reliability advantages of Light Emitting
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Amicon D 125
Abstract: Power light source LUXEON III Emitter pcb thermal Design guide trace theta layout 5mm red green led temperature coefficient luxeon 1w SMD led warm white 5mm red led temperature coefficient 5mm uv led datasheet philips fabrication of mcpcb Aluminum Base 3 LED emitters PCB
Text: Technical Datasheet DS45 power light source Luxeon III Emitter Introduction Luxeon III is a revolutionary, energy efficient and ultra compact new light source, combining the lifetime and reliability advantages of Light Emitting Diodes with the brightness of conventional lighting.
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1400mA
Amicon D 125
Power light source LUXEON III Emitter
pcb thermal Design guide trace theta layout
5mm red green led temperature coefficient
luxeon 1w
SMD led warm white
5mm red led temperature coefficient
5mm uv led datasheet philips
fabrication of mcpcb
Aluminum Base 3 LED emitters PCB
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ph01 smd
Abstract: smd led warm white luxeon 1w high efficiency power supply for 1w Luxeon star LEDs circuit diagram Loctite 3873 UV led diode 200 nm peak 1W AL 5052 luxeon 10 watt DW01 DW01 PLUS
Text: Technical Datasheet DS25 power light source Luxeon Emitter Introduction Luxeon is a revolutionary, energy efficient and ultra compact new light source, combining the lifetime and reliability advantages of Light Emitting Diodes with the brightness of conventional lighting.
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multifuse
Abstract: No abstract text available
Text: MATERIAL DECLARATION SHEET Material Product Line Revision Date Revision RoHS Compliant MF-USMF Multifuse August 1, 2005 A Yes Breakdown of part eg Lead, Ceramic body, coating, plating, additive Material/substance name (eg.Sn alloy, Cu Copper) Material/ substance
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Untitled
Abstract: No abstract text available
Text: MATERIAL DECLARATION SHEET Material Product Line Revision Date Revision RoHS Compliant No. MF - NSMF Multifuse April 25, 2005 A Yes Breakdown of part Material/substance name Material/ CAS No. / Int. e.g. Lead, Ceramic (e.g. Sn alloy, Cu Copper substance Identifier
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il 074
Abstract: 25038-59-9 epoxy prepreg
Text: MATERIAL DECLARATION SHEET Material Product Line Revision Date Revision RoHS Compliant MF - MSMF Multifuse April 15, 2005 A Yes Breakdown of part e.g. Lead, Ceramic body, coating, plating, additive Material/substance name Material/ substance CAS No. / Int.
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il 074
25038-59-9
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FR4 Prepreg for RF 06 layer PCB
Abstract: Ablestik 84-1 lmis N4000-13 ablestik ablebond TRF1123 TRF1223 C001 ablebond ablestik m0021
Text: Application Report SLWA038 – June 2005 Junction Temperature of TRF1123/TRF1223 and Recommended PCB Layout Guidelines Tim McGovern . Wireless Infrastructure - Radio ABSTRACT
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TRF1123/TRF1223
TRF1123
TRF1223.
FR4 Prepreg for RF 06 layer PCB
Ablestik 84-1 lmis
N4000-13
ablestik ablebond
TRF1223
C001
ablebond ablestik
m0021
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epoxy prepreg panasonic
Abstract: Capacitor tantalum 0402 10uF/16V IPC-600-A IPC-SM-840 type b class 2 ceramic capacitor 1uf/16v UAR10-4W5100 IPC-6011 ipc sm 840 CMD15-21VRC smd diode s1
Text: WirelessUSB LS Micro-Bridge Layout Guidelines The PCB Is a Component of Your Wireless Communication Product Design This application note provides guidelines for micro-bridge printed circuit board PCB design using the WirelessUSB™ LS 2.4-GHz DSSS Radio IC and its application as an
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FR4 Prepreg for RF 06 layer PCB
Abstract: IPC-600-A IPC-600A IPC-SM-840 type b class 2 IPC-SM-840 epoxy prepreg panasonic WUSB6935 PDC-9242 DESIGN RULE CHECK PCB PA2423L
Text: WirelessUSB LR+PA Radio Module Layout Guidelines AN6067 Author: Ram Kandiar Associated Project: Yes Associated Part Family: WirelessUSB™ LR Associated Application Notes: WirelessUSB LR Printed Circuit Board Layout Guidelines Abstract AN6067 describes the long range radio module solution of a WirelessUSB™ LR radio in the 2.4 GHz ISM band. The long range
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AN6067
AN6067
FR4 Prepreg for RF 06 layer PCB
IPC-600-A
IPC-600A
IPC-SM-840 type b class 2
IPC-SM-840
epoxy prepreg panasonic
WUSB6935
PDC-9242
DESIGN RULE CHECK PCB
PA2423L
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IPC-SM-840
Abstract: IPC-600-A IPC-6011 13001 datasheet 0.1 uf/50v smd capacitor ceramic SMD capacitor 0.1 uf/50v AN5030 tb 9207 transistor 13001 pcb design of a radio
Text: WirelessUSB LS Printed Circuit Board Layout Guidelines The PCB Is a Component of Your Wireless Communication Product Design This application note provides guidelines for printed circuit board PCB design using the WirelessUSB™ LS 2.4-GHz DSSS Radio SoC IC and its application as an integrated
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IPC-600-A
Abstract: IPC-6011 ipc600a class2 wireless power transfer loop antennas planar inverted f antenna FR4 epoxy dielectric constant 4.2 FR2 PCB FR4 Prepreg Indoor Antenna IPC-SM-840
Text: WirelessUSB Antenna Design Layout Guidelines The Antenna as a Component of Your Wireless Communication Product Design Introduction This application note describes the guidelines for the antenna design and, in particular, addresses the design of an integrated printed trace wiggle antenna implementation on a
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IPC-SM-840
Abstract: IPC-600-A printed antenna dual dipole wiggle ipc600a class2 planar inverted f antenna IPC-6011 drill motor speed control circuit FR4 epoxy dielectric constant 4.2 Indoor Antenna
Text: WirelessUSB Dual Antenna Design Layout Guidelines The Antenna as a Component of Your Wireless Communication Product Design Introduction This application note describes the guidelines for the antenna design and in particular, addresses the design of an integrated printed trace wiggle antenna implementation on a
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CY281200
Abstract: pcb layout guide differential ohms stackup DIFT10
Text: By Jimmy Ma Design Guidelines and PCB Layout For the CY281200 PCI-Express and AMB Clock Buffer 10/13/2008 SpectraLinear Inc ● 2200 Laurelwood Road ● Santa Clara, CA 95054 Revision 1.0 PH: 408-855-0555 FAX: 408-855-0550 Abstract This document will provide detailed design recommendations on how to design, route, and layout all the
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CY281200
CY281200
pcb layout guide differential ohms stackup
DIFT10
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IPC-SM-840
Abstract: IPC-600-A ipc600a class2 wiggle IPC-SM840 IPC 6012 IPC-6011 AN5032 how to make an electronics components testing board
Text: WirelessUSB Antenna Design Layout Guidelines - AN5032 The Antenna as a Component of Your Wireless Communication Product Design Introduction This application note describes the guidelines for the antenna design and, in particular, addresses the design of an
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AN5032
IPC-SM-840
IPC-600-A
ipc600a class2
wiggle
IPC-SM840
IPC 6012
IPC-6011
AN5032
how to make an electronics components testing board
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prepreg
Abstract: flexible circuit connector FR4 Prepreg SAS Connector signal spacing epoxy prepreg flex circuit connector FCI card edge Connector gold FR4 0.8mm thickness
Text: BOARD TO BOARD CONNECTIONS Field Guide FCI FLEXIBLE CONNECTIONS SM DESCRIPTION FCI integrates flexible circuitry and a broad range of connector options to optimize interconnect performance. Disciplined quality processes and low cost manufacturing produce superior
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ELXFLEXASSY0810ELT
prepreg
flexible circuit connector
FR4 Prepreg
SAS Connector signal spacing
epoxy prepreg
flex circuit connector
FCI card edge Connector gold
FR4 0.8mm thickness
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IPC-SM-840
Abstract: IPC-6011 IPC-600-A FR2 PCB printed antenna dual dipole IPC-SM-840 type b class 2 AN5033 abstract for wireless communication system wiggle planar inverted f antenna
Text: WirelessUSB Dual Antenna Design Layout Guidelines AN5033 Associated Project: No Associated Part Family: WirelessUSB™ Software Version: N/A Associated Application Notes: None Application Note Abstract AN5033 describes the guidelines for the antenna design and in particular, addresses the design of an integrated printed trace
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AN5033
AN5033
IPC-SM-840
IPC-6011
IPC-600-A
FR2 PCB
printed antenna dual dipole
IPC-SM-840 type b class 2
abstract for wireless communication system
wiggle
planar inverted f antenna
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