siemens 230 96
Abstract: z1221 HP 4194A
Text: EMC Components SMT Inductors SIMID 1812-Z Data Book Supplement SMT Inductors SIMID 1812-Z B82432-Z Size 1812/4532 inch/mm Rated inductance 0,22 to 1000 µH Rated current 0,04 to 0,7 A Construction ● Ferrite core ● Laser soldered, molded epoxy encapsulation
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1812-Z
B82432-Z
siemens 230 96
z1221
HP 4194A
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Z1223
Abstract: Z1122 siemens 350 98 z1471 z1394
Text: EMC Components SMT Inductors SIMID 1812 B82432-Z Data Book Supplement Vakatseite 2 SMT Inductors SIMID 1812 B82432- Z Size 1812/4532 (inch/mm) Rated inductance 0,22 to 1000 µH Rated current 0,04 to 0,7 A Construction ● Ferrite core ● Laser soldered, molded epoxy encapsulation
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B82432-Z
B82432-
Z1223
Z1122
siemens 350 98
z1471
z1394
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PDF
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mkt 344 polyester
Abstract: r46 arcotronics en132400 275VAC MKT 100 arcotronics 1.40 MKT X2 arcotronics R60 arcotronics MKP 31.5 IEC60068-1 arcotronics R82 ARCOTRONICS R46 nissei capacitor
Text: EMC, FILTERS & SUPPRESSION EPCOS type B81130 / B3292❋ CAPACITORS, Plastic Film series & B81122 A range of radial lead X2 and Y2 capacitors, with extensive approvals, designed for mains interference suppression. Meets EN132400 IEC60384-14 2nd edition , the unified European safety standard. Epoxy resin encapsulated in flame retardant plastic cases.
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B81130
B3292
B81122
EN132400
IEC60384-14
UL94V-0
098310S
mkt 344 polyester
r46 arcotronics
en132400 275VAC MKT 100
arcotronics 1.40 MKT X2
arcotronics R60
arcotronics MKP 31.5
IEC60068-1
arcotronics R82
ARCOTRONICS R46
nissei capacitor
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PDF
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TAG 203 350
Abstract: TPS103A TPS204B TPS203E SLT-P-22000
Text: Solder Mounted C Filter Data Sheets Solder Mounted C and Pi Circuit Filters SLT Circuit Diagram Ordering Information Please state Part Number. Materials SLT1/C/- Mounting eyelet: Brass, silver finish. Feedthrough terminations: Copper alloy, tin lead or silver finish.
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SLT1/C/1000
SLT/P/680
SLT/P/1500
SLT/P/5000
SLT/P/1500/SM3A
SLT/P/22000/SM3A
ODCSM40489/4/2005
TAG 203 350
TPS103A
TPS204B
TPS203E
SLT-P-22000
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PDF
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mg 5473
Abstract: No abstract text available
Text: Package Details SOT-223C Case Mechanical Drawing Lead Code: Part Marking: Full Part Number Reference individual device datasheet. Mounting Pad Geometry Dimensions in mm R2 (4-March 2010) w w w. c e n t r a l s e m i . c o m Package Details SOT-223C Case
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OT-223C
EIA-481-1-A
mg 5473
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PDF
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TR13
Abstract: bond wire gold
Text: Package Details - SOT-223 Mechanical Drawing Lead Code: Part Marking: Full Part Number. Reference individual device datasheet. Mounting Pad Geometry Dimensions in mm Central TM Semiconductor Corp. w w w. c e n t r a l s e m i . c o m R3 (5-November 2007)
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OT-223
EIA-481-1-A
TR13
bond wire gold
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PDF
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MMR4
Abstract: case 418 sot223 TR13
Text: Package Details SOT-223 Case Mechanical Drawing Lead Code: Part Marking: Full Part Number Reference individual device datasheet. Mounting Pad Geometry Dimensions in mm R4 (4-March 2010) w w w. c e n t r a l s e m i . c o m Package Details SOT-223 Case Tape Dimensions and Orientation (Dimensions in mm)
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OT-223
EIA-481-1-A
27-June
MMR4
case 418 sot223
TR13
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PDF
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On semiconductor date Code sot-223
Abstract: 6382 tRANSISTOR CZT75 5648 marking transistor marking code 443
Text: CZT751 SURFACE MOUNT PNP HIGH CURRENT SILICON TRANSISTOR Central TM Semiconductor Corp. DESCRIPTION: The CENTRAL SEMICONDUCTOR CZT751 type is a PNP Silicon Transistor manufactured by the epitaxial planar process, epoxy molded in a surface mount package, designed for high
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CZT751
OT-223
On semiconductor date Code sot-223
6382 tRANSISTOR
CZT75
5648 marking
transistor marking code 443
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PDF
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Untitled
Abstract: No abstract text available
Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package DIL Package Weight mg 380 Product Group Type No. DF005 – DF10 DF150 – DF1510 DF200 – DF2010 Solder Alloy Leadframe Copper Alloy Plating Matte Tin Encapsulation Tolerance
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DF005
DF150
DF1510
DF200
DF2010
2011/65/EU.
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PDF
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Untitled
Abstract: No abstract text available
Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package R-1 Package Weight mg 181 Product Group Type No. 1H1 – 1H8 1A1 – 1A7 Material Die Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating Matte Tin Encapsulation
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2011/65/EU.
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PDF
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Untitled
Abstract: No abstract text available
Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package GBL Package Weight mg 2000 Product Group Type No. GBJ2A – GBJ2M GBL00 – GBL10 Material Die Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating Matte Tin Encapsulation
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GBL00
GBL10
2011/65/EU.
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PDF
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Untitled
Abstract: No abstract text available
Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package D3K Package Weight mg 1500 Product Group Type No. D2KB05 – D2KB100 D3KB05 – D3KB100 D4KB05 – D4KB100 Component Die Copper Alloy Plating Matte Tin Encapsulation Tolerance
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D2KB05
D2KB100
D3KB05
D3KB100
D4KB05
D4KB100
2011/65/EU.
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PDF
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Untitled
Abstract: No abstract text available
Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package KBJ-4 Package Weight mg 4600 Product Group Type No. GBJ4A – GBJ4M GBJ10A – GBJ10M Component Material Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating Matte Tin
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GBJ10A
GBJ10M
2011/65/EU.
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PDF
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Untitled
Abstract: No abstract text available
Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package KBL Package Weight mg 5600 Product Group Type No. KBL400 – KBL410 KBL400G – KBL410G Component Material Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating Matte Tin
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KBL400
KBL410
KBL400G
KBL410G
2011/65/EU.
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PDF
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|
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Untitled
Abstract: No abstract text available
Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package GBP Package Weight mg 1700 Product Group Type No. GBP200 – GBP210 Component Die Copper Alloy Plating Matte Tin Encapsulation Tolerance Material Solder Alloy Leadframe MSL Rating
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GBP200
GBP210
2011/65/EU.
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PDF
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Untitled
Abstract: No abstract text available
Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package ARS Package Weight mg 1600 Product Group Type No. ARS25A – ARS25J ARS35A – ARS35J ARS50A – ARS50J Component Die Copper Alloy Plating Matte Tin Encapsulation Tolerance
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ARS25A
ARS25J
ARS35A
ARS35J
ARS50A
ARS50J
2011/65/EU.
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PDF
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Untitled
Abstract: No abstract text available
Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package MB-S Package Weight mg 120 Product Group Type No. B1S – B10S Solder Alloy Leadframe Copper Alloy Plating Matte Tin Encapsulation Tolerance Material Doped Silicon* Die Attach
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2011/65/EU.
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PDF
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Untitled
Abstract: No abstract text available
Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package KBP Package Weight mg 1700 Product Group Type No. KBP150 – KBP1510 KBP200 – KBP2010 Component Material Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating Matte Tin
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KBP150
KBP1510
KBP200
KBP2010
2011/65/EU.
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PDF
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H20E
Abstract: No abstract text available
Text: TPJ £ 1 1 *2 Tvdmob^i Slowave Miniature Delay Line ^ T J Mounting Instructions m . _ mm . A p p lic a tio n N o te s A p p lic a tio n N o te 0 0 6 S lo w a v e ® M in ia tu re D e la y Lin e M o u n tin g In s tru c tio n s Mounting Instructions for the Leadless Surface M ount Delay Line package.
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13X10-6/
H20E
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PDF
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Ablestik 84-1LMI
Abstract: gold melting furnace 84-1LMI epoxy adhesive
Text: APPLICATION NOTES APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used in RF and microwave applications. Some of these chips are offered with
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Untitled
Abstract: No abstract text available
Text: APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used in RF and microwave applications. Some of these chips are offered with
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PDF
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84-1LM
Abstract: ECF564A
Text: APPLICATION NOTES APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are com m only used in RF and microwave applications. Some of these chips are offered with
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84-1LMI epoxy adhesive
Abstract: TS0300W3 TS0500W3
Text: APPLICATION NOTES APPLICATION NOTE 006 - WRAPPED CHIP DEVICE MOUNTING INSTRUCTIONS This line of microwave attenuators is designed for surface mount and wrap-around grounding applications. The W1 has a platinum gold wrap around ground with full back metallization and platinum gold input/output terminations. The WB1 has a platinum gold wrap-around ground and
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ECF564A
Abstract: No abstract text available
Text: Technology A pplication Notes Chip Device Mounting Instructions A pplication N o te 003 Chip D evice Mounting Instructions All of the chip products in this catalog use thick film metallization for terminations - either platinum gold, gold, or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used
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PDF
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