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    EP2C20 PQFP PACKAGE 484-PIN PLASTIC QUAD FLAT Search Results

    EP2C20 PQFP PACKAGE 484-PIN PLASTIC QUAD FLAT Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    XPH13016MC Toshiba Electronic Devices & Storage Corporation P-ch MOSFET, -60 V, -60 A, 0.0099 Ω@-10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation

    EP2C20 PQFP PACKAGE 484-PIN PLASTIC QUAD FLAT Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    BGA PACKAGE thermal profile

    Abstract: BGA 256 PACKAGE thermal resistance 484-pin BGA The Diode Data Book with Package Outlines CII51015-2 EP2C20 EP2C35 EP2C50 F256 MS 034 aaj
    Text: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Cyclone II devices. The chapters in this section contain the required PCB layout guidelines and package specifications.


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    BGA PACKAGE thermal profile

    Abstract: 896-Pin TQFP 144 PACKAGE DIMENSION CII51015-2 EP2C20 EP2C35 EP2C50 F256 EP2C5256 CII51015
    Text: 15. Package Information for Cyclone II Devices CII51015-2.3 Introduction This chapter provides package information for Altera Cyclone® II devices, including: • ■ ■ Device and package cross reference Thermal resistance values Package outlines Table 15–1 shows Cyclone II device package options.


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    PDF CII51015-2 EP2C15 BGA PACKAGE thermal profile 896-Pin TQFP 144 PACKAGE DIMENSION EP2C20 EP2C35 EP2C50 F256 EP2C5256 CII51015

    ep2c50f484

    Abstract: EP2C20F256 EP2C8F256 EP2C35F672 EP2C8F256 package TSMC 90nm sram EP2C5 pin table EP2C5F256 EP2C20F484 Cyclone II EP2C35
    Text: 1. Introduction CII51001-3.1 Introduction Following the immensely successful first-generation Cyclone device family, Altera® Cyclone II FPGAs extend the low-cost FPGA density range to 68,416 logic elements LEs and provide up to 622 usable I/O pins and up to 1.1 Mbits of embedded memory. Cyclone II FPGAs are


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    PDF CII51001-3 300-mm 90-nm ep2c50f484 EP2C20F256 EP2C8F256 EP2C35F672 EP2C8F256 package TSMC 90nm sram EP2C5 pin table EP2C5F256 EP2C20F484 Cyclone II EP2C35

    EP2C35F672

    Abstract: EP2C20F256 EP2C8F256 EP2C5 ep2c50f484 F256 CII51001-3 EP2C15A EP2C20 EP2C35
    Text: 1. Introduction CII51001-3.2 Introduction Following the immensely successful first-generation Cyclone device family, Altera® Cyclone II FPGAs extend the low-cost FPGA density range to 68,416 logic elements LEs and provide up to 622 usable I/O pins and up to 1.1 Mbits of embedded memory. Cyclone II FPGAs are


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    PDF CII51001-3 300-mm 90-nm EP2C35F672 EP2C20F256 EP2C8F256 EP2C5 ep2c50f484 F256 EP2C15A EP2C20 EP2C35

    pin information ep3c10

    Abstract: EP3C40F484 EP3c55 EP3C16F484 EP3C16 EP3C40Q240 EP3C40 U256 100 PIN PQFP ALTERA DIMENSION PIN INFORMATION FOR EP3C55
    Text: Cyclone Series Device Thermal Resistance July 2007, version 2.2 Revision History Data Sheet The following table shows the revision history for this data sheet. Date Document Version Changes Made July 2007 2.2 Updated values for EP3C25 E144 device in Table 2.


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    PDF EP3C25 EP3C10 pin information ep3c10 EP3C40F484 EP3c55 EP3C16F484 EP3C16 EP3C40Q240 EP3C40 U256 100 PIN PQFP ALTERA DIMENSION PIN INFORMATION FOR EP3C55

    bd248

    Abstract: UBGA169 EP1800 324 bga thermal HC1S6 EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: Altera Device Package Information May 2005, vers.13.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 14)


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    ep600i

    Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)


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    PQFP 176

    Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
    Text: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●


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    PDF 144-Pin 100-Pin 256-Pin 780-Pin 256-Pin 68-Pin PQFP 176 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760

    transistor D 2395

    Abstract: bt 1690
    Text: Cyclone II Device Handbook, Volume 1 Preliminary Information 101 Innovation Drive San Jose, CA 95134 408 544-7000 http://www.altera.com CII5V1-2.2 Copyright 2005 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and


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    PDF 896-Pin transistor D 2395 bt 1690

    Untitled

    Abstract: No abstract text available
    Text: Cyclone II Device Handbook, Volume 1 Preliminary Information 101 Innovation Drive San Jose, CA 95134 408 544-7000 http://www.altera.com CII5V1-2.1 Copyright 2005 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and


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    PDF 896-Pin

    TMS 3617

    Abstract: bga 896 TSMC 90nm sram
    Text: Cyclone II Device Handbook, Volume 1 Preliminary Information 101 Innovation Drive San Jose, CA 95134 408 544-7000 http://www.altera.com CII5V1-2.3 Copyright 2006 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and


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    PDF 896-Pin TMS 3617 bga 896 TSMC 90nm sram

    bga 896

    Abstract: TSMC 90nm sram EP2C50F484 APU 2471
    Text: Section I. Cyclone II Device Family Data Sheet This section provides information for board layout designers to successfully layout their boards for Cyclone II devices. It contains the required PCB layout guidelines, device pin tables, and package specifications.


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    EP2C5F256

    Abstract: CII51001-3 EP2C15A EP2C20 EP2C35 EP2C50 EP2C8F256 EP2C70F672 TSMC 90nm sram
    Text: Section I. Cyclone II Device Family Data Sheet This section provides information for board layout designers to successfully layout their boards for Cyclone II devices. It contains the required PCB layout guidelines, device pin tables, and package specifications.


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    EP2C8F256 package

    Abstract: S-2501-1 EP2C20F256 bga 896 TSMC 90nm sram
    Text: Section I. Cyclone II Device Family Data Sheet This section provides information for board layout designers to successfully layout their boards for Cyclone II devices. It contains the required PCB layout guidelines, device pin tables, and package specifications.


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    EP4CE15

    Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
    Text: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


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    PDF DS-PKG-16 EP4CE15 MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22

    pin configuration of 7496 IC

    Abstract: TMS 3617 Transistor TT 2246 ttl to mini-lvds EP2C35F672 IC 4033 pin configuration EP2C20F256 CI 4017 combinational digital lock circuit projects EP2C8F256
    Text: Cyclone II Device Handbook, Volume 1 101 Innovation Drive San Jose, CA 95134 www.altera.com CII5V1-3.2 Copyright 2007 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and


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    EP2C35F672

    Abstract: 26075 EP2C20F256 TMS 3617 PQFP16 ic 4017 pin configuration 2864 rom 3844 b so 8 EP2C5 EP2C15A
    Text: Section I. Cyclone II Device Family Data Sheet This section provides information for board layout designers to successfully layout their boards for Cyclone II devices. It contains the required PCB layout guidelines, device pin tables, and package specifications.


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    EP4CE6 package

    Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
    Text: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


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    PDF DS-PKG-16 EP4CE6 package EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80

    EP2C35F672

    Abstract: EP2C20F256 Sw 2604 tms 3617 4017 pins configuration 753 53 2525 401 CMOS 4017 series cyclone II FIR filter matlaB simulink design matlab programs for impulse noise removal
    Text: Section I. Cyclone II Device Family Data Sheet This section provides information for board layout designers to successfully layout their boards for Cyclone II devices. It contains the required PCB layout guidelines, device pin tables, and package specifications.


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    pin configuration of 7496 IC

    Abstract: tms 3617 Transistor TT 2246 4174 logic hex D type flip-flop tt 2246 data sheet ic 4017 Ic D 1708 ag BLOCK DIAGRAM DESCRIPTION of IC 4017 WITH 16 PINS EP2C20F256 EP2C35F672
    Text: Cyclone II Device Handbook, Volume 1 101 Innovation Drive San Jose, CA 95134 www.altera.com CII5V1-3.3 Copyright 2008 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and


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    106 25 V

    Abstract: No abstract text available
    Text: Cyclone II Device Handbook, Volume 1 Preliminary Information 101 Innovation Drive San Jose, CA 95134 408 544-7000 http://www.altera.com CII5V1-2.0 Copyright 2005 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and


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    PDF 896-Pin 106 25 V

    Untitled

    Abstract: No abstract text available
    Text: Section I. Cyclone II Device Family Data Sheet This section provides information for board layout designers to successfully layout their boards for Cyclone II devices. It contains the required PCB layout guidelines, device pin tables, and package specifications.


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    CII51001-1

    Abstract: CII51002-1 EP2C20 EP2C35 EP2C50 SSTL-18
    Text: Section I. Cyclone II Device Family Data Sheet This section provides provides information for board layout designers to successfully layout their boards for Cyclone II devices. It contains the required PCB layout guidelines, device pin tables, and package


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    SW 2596

    Abstract: EP2C35F672 HP 3070 series 3 Manual circuit integers p 2503 n EP2C20 484-pin package APU 2471 cyclone II EP2C20F256 K 3053 TRANSISTOR SSTL-18
    Text: Section I. Cyclone II Device Family Data Sheet This section provides information for board layout designers to successfully layout their boards for Cyclone II devices. It contains the required PCB layout guidelines, device pin tables, and package specifications.


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