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    EMMC JEDEC MECHANICAL STANDARD DATA RETENTION Search Results

    EMMC JEDEC MECHANICAL STANDARD DATA RETENTION Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ151KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ471KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ152MN4A Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ101KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ331KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd

    EMMC JEDEC MECHANICAL STANDARD DATA RETENTION Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    eMMC data retention

    Abstract: emmc jedec mechanical standard data retention samsung emmc boot emmc 5.0 numonyx oneNand flash Samsung EMMC "boot mode" samsung eMMC emmc Initialization eMMC samsung eMMC 5.0
    Text: NAND225AQA9P 2-Gbit demux I/O OneNAND , 2-Gbyte NAND with MMC™ interface & 2x1-Gbit x32 DDR LPSDRAM MCP Preliminary Data Features • MCP (multichip package) – 2-Gbit (x16) high-density SLC large page OneNAND™ flash memory(a) – 2x1-Gbit (x32) DDR LPSDRAM


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    NAND225AQA9P LFBGA199 eMMC data retention emmc jedec mechanical standard data retention samsung emmc boot emmc 5.0 numonyx oneNand flash Samsung EMMC "boot mode" samsung eMMC emmc Initialization eMMC samsung eMMC 5.0 PDF

    emmc 5.0

    Abstract: numonyx oneNand flash NUMONYX emmc samsung eMMC 5.0 eMMC driver eMMC powerdown emmc samsung eMMC samsung emmc boot samsung mcp emmc
    Text: NAND225AQA5P 2-Gbit demux I/O OneNAND , 2-Gbyte NAND with MMC™ interface & 2x1-Gbit x32 DDR LPSDRAM MCP Preliminary Data Features • MCP (multichip package) – 2-Gbit (x16) high-density SLC large page OneNAND™ flash memory(a) – 2x1-Gbit (x32) DDR LPSDRAM


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    NAND225AQA5P LFBGA199 emmc 5.0 numonyx oneNand flash NUMONYX emmc samsung eMMC 5.0 eMMC driver eMMC powerdown emmc samsung eMMC samsung emmc boot samsung mcp emmc PDF

    emmc pin

    Abstract: 221 ball eMMC memory numonyx oneNand flash samsung emmc boot eMMC slc mode emmc 5.0 samsung eMMC 5.0 emmc boot operation emmc jedec Flash Memory SAMSUNG OneNAND mcp
    Text: NAND114APA5M 1-Gbit, mux I/O OneNAND , 1-Gbyte NAND with MMC™ interface & 1-Gbit x32 DDR LPSDRAM MCP Preliminary Data Features • ■ ■ MCP (multichip package) – 1-Gbit (x16) high-density SLC large page OneNAND™ flash memory(a) – 1-Gbit (x32) DDR LPSDRAM


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    NAND114APA5M LFBGA199 emmc pin 221 ball eMMC memory numonyx oneNand flash samsung emmc boot eMMC slc mode emmc 5.0 samsung eMMC 5.0 emmc boot operation emmc jedec Flash Memory SAMSUNG OneNAND mcp PDF

    emmc pin

    Abstract: emmc 5.0 samsung eMMC 5.0 221 ball eMMC memory emmc controller emmc jedec mechanical standard data retention samsung eMMC NUMONYX emmc eMMC slc mode NAND08GAH
    Text: NAND114AQA5M 1-Gbit, demux I/O OneNAND , 1-Gbyte NAND with MMC™ interface & 1-Gbit x32 DDR LPSDRAM MCP Preliminary Data Features • MCP (multichip package) – 1-Gbit (x16) high-density SLC large page OneNAND™ flash memory(a) – 1-Gbit (x32) DDR LPSDRAM


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    NAND114AQA5M LFBGA199 emmc pin emmc 5.0 samsung eMMC 5.0 221 ball eMMC memory emmc controller emmc jedec mechanical standard data retention samsung eMMC NUMONYX emmc eMMC slc mode NAND08GAH PDF

    Manufacturer ID list eMMC

    Abstract: emmc 4.41 spec finder type 81.11
    Text: Intel Atom Processor Z2760 Datasheet October 2012 Revision 1.0 Document Number: 328104-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS


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    Z2760 Z2760 Manufacturer ID list eMMC emmc 4.41 spec finder type 81.11 PDF

    XAM3359AZCZ100

    Abstract: No abstract text available
    Text: REF: BBONEBLK_SRM BeagleBone Black System Reference Manual BeagleBone Black System Reference Manual Revision A5.2 April 11, 2013 Author: Gerald Coley Contributing Editor: Robert P J Day Page 1 of 108 Rev A5.2 REF: BBONEBLK_SRM BeagleBone Black System Reference Manual


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    PDF

    lpddr4

    Abstract: emmc pcb layout
    Text: REF: BBONEBLK_SRM BeagleBone Black System Reference Manual BeagleBone Black System Reference Manual Revision A5.2 April 11, 2013 Author: Gerald Coley Contributing Editor: Robert P J Day Page 1 of 108 Rev A5.2 REF: BBONEBLK_SRM BeagleBone Black System Reference Manual


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    PDF

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 5, 06/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


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    IMX50CEC MCIMX50 PDF

    Samsung eMMC 4.51

    Abstract: samsung eMMC 4.5
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 2, 05/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


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    IMX50CEC MCIMX50 Samsung eMMC 4.51 samsung eMMC 4.5 PDF

    samsung eMMC 4.5

    Abstract: Samsung eMMC 4.41 lpddr2 emmc emmc 4.41 spec emmc 4.5 spec 153 ball eMMC memory Samsung eMMC 4.51 samsung* lpddr2* pop package emmc Pin assignment eMMC 4.4
    Text: Freescale Semiconductor Data Sheet: Advanced Information Document Number: IMX50CEC Rev. 2, 04/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


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    IMX50CEC MCIMX50 samsung eMMC 4.5 Samsung eMMC 4.41 lpddr2 emmc emmc 4.41 spec emmc 4.5 spec 153 ball eMMC memory Samsung eMMC 4.51 samsung* lpddr2* pop package emmc Pin assignment eMMC 4.4 PDF

    samsung eMMC 4.5

    Abstract: eMMC 4.51 Samsung eMMC 4.41 emmc 4.5 spec Samsung eMMC 4.51 emmc 4.41 spec eMMC PoP samsung lpddr2 153 ball eMMC memory 0.8 emmc spec samsung
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 2, 05/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


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    IMX50CEC MCIMX50 samsung eMMC 4.5 eMMC 4.51 Samsung eMMC 4.41 emmc 4.5 spec Samsung eMMC 4.51 emmc 4.41 spec eMMC PoP samsung lpddr2 153 ball eMMC memory 0.8 emmc spec samsung PDF

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 6, 08/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


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    IMX50CEC MCIMX50 PDF

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 3, 11/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


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    IMX50CEC MCIMX50 PDF

    samsung eMMC 4.5

    Abstract: emmc 4.4 standard jedec Samsung eMMC 4.41 153 ball eMMC memory emmc 4.5 spec emmc spec emmc 4.41 spec 50 50 mfd CAPACITOR USB_OTG Samsung eMMC 4.51
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 4, 1/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


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    IMX50CEC MCIMX50 samsung eMMC 4.5 emmc 4.4 standard jedec Samsung eMMC 4.41 153 ball eMMC memory emmc 4.5 spec emmc spec emmc 4.41 spec 50 50 mfd CAPACITOR USB_OTG Samsung eMMC 4.51 PDF

    DART-4460

    Abstract: MIPI CPI OM44 PowerVR SGX540
    Text: VA‘I“CITE LTD DART-4460 T “ D I M ‘ VA R I SC I T E LT D DA‘T 2013 Variscite Ltd. D OMAP TM All Rights Reserved. No part of this document may be photocopied, reproduced, stored in a retrieval system, or transmitted, in any form or by any means whether, electronic, mechanical, or otherwise without the prior written


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    DART-4460 DART-4460 MIPI CPI OM44 PowerVR SGX540 PDF

    LQFP100 tray dimension

    Abstract: Increment Encoder interface with STM32F4
    Text: STM32F411xC STM32F411xE ARM Cortex®-M4 32b MCU+FPU, 125 DMIPS, 512KB Flash, 128KB RAM, USB OTG FS, 11 TIMs, 1 ADC, 13 comm. interfaces Datasheet - preliminary data Features FBGA • Dynamic Efficiency Line ® ® – Core: ARM 32-bit Cortex -M4 CPU with


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    STM32F411xC STM32F411xE 512KB 128KB 32-bit 4-to-26 DocID026289 LQFP100 tray dimension Increment Encoder interface with STM32F4 PDF

    Untitled

    Abstract: No abstract text available
    Text: Product Folder Sample & Buy Technical Documents Tools & Software Support & Community TMS320C5517 SPRS727C – AUGUST 2012 – REVISED APRIL 2014 TMS320C5517 Fixed-Point Digital Signal Processor 1 Device Overview 1.1 Features 1 • CORE: – High-Performance, Low-Power, TMS320C55x


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    TMS320C5517 SPRS727C TMS320C5517 TMS320C55x 200-MHz PDF

    Untitled

    Abstract: No abstract text available
    Text: Product Folder Sample & Buy Technical Documents Tools & Software Support & Community TMS320C5517 SPRS727B – AUGUST 2012 – REVISED APRIL 2014 TMS320C5517 Fixed-Point Digital Signal Processor 1 Device Overview 1.1 Features 1 • CORE: – High-Performance, Low-Power, TMS320C55x


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    TMS320C5517 SPRS727B TMS320C5517 TMS320C55xâ 225-MHz PDF

    Untitled

    Abstract: No abstract text available
    Text: Product Folder Sample & Buy Technical Documents Tools & Software Support & Community TMS320C5517 SPRS727C – AUGUST 2012 – REVISED APRIL 2014 TMS320C5517 Fixed-Point Digital Signal Processor 1 Device Overview 1.1 Features 1 • CORE: – High-Performance, Low-Power, TMS320C55x


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    TMS320C5517 SPRS727C TMS320C5517 TMS320C55x 200-MHz PDF

    "eMMC" Thermal Impedance

    Abstract: emmc spi bridge emmc bga 162 C5535 EMMC HOST CONTROLLER eMMC driver 9810h eMMC 4.41 operation TMS320C5535 emmc pin
    Text: TMS320C5535 TMS320C5534, TMS320C5533, TMS320C5532 SPRS737 – AUGUST 2011 www.ti.com TMS320C5535, 'C5534, 'C5533, 'C5532 Fixed-Point Digital Signal Processors Check for Samples: TMS320C5535, TMS320C5534, TMS320C5533, TMS320C5532 1 Fixed-Point Digital Signal Processor


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    TMS320C5535 TMS320C5534, TMS320C5533, TMS320C5532 SPRS737 TMS320C5535, C5534, C5533, C5532 "eMMC" Thermal Impedance emmc spi bridge emmc bga 162 C5535 EMMC HOST CONTROLLER eMMC driver 9810h eMMC 4.41 operation emmc pin PDF

    Untitled

    Abstract: No abstract text available
    Text: Product Folder Sample & Buy Technical Documents Tools & Software Support & Community TMS320C5535, TMS320C5534, TMS320C5533, TMS320C5532 SPRS737C – AUGUST 2011 – REVISED APRIL 2014 TMS320C5535, 'C5534, 'C5533, 'C5532 Fixed-Point Digital Signal Processors


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    TMS320C5535, TMS320C5534, TMS320C5533, TMS320C5532 SPRS737C C5534, C5533, C5532 TMS320C55x PDF

    SCIMX538DZK1C

    Abstract: samsung eMMC 4.5 MCIMX535 emmc pcb layout lpddr2 pcb layout LPDDR2 PoP samsung* lpddr2* pop package N7U2 Freescale i.MX53 Quick Start Board AMBA AXI
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 4.1, 2/2012 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch


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    IMX53CEC MCIMX53xD MX53xD SCIMX538DZK1C samsung eMMC 4.5 MCIMX535 emmc pcb layout lpddr2 pcb layout LPDDR2 PoP samsung* lpddr2* pop package N7U2 Freescale i.MX53 Quick Start Board AMBA AXI PDF

    MCIMX535

    Abstract: MCIMX535DVV1C MCIMX535DVV IMX53CEC mc33902 tepbga-2 MCIMX538DZK1C H.263 *IMX53 emmc pcb layout
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 4, 11/2011 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch


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    IMX53CEC MCIMX53xD MX53xD MCIMX535 MCIMX535DVV1C MCIMX535DVV mc33902 tepbga-2 MCIMX538DZK1C H.263 *IMX53 emmc pcb layout PDF

    eMMC "thermal impedance"

    Abstract: PCIMX535DVV1C emmc Card connector 062N n78c 4.712 eMMC PoP emmc pcb layout 100KPD diode 4.7-16
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 2, 5/2011 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA PoP 12 x 12 mm


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    IMX53CEC MCIMX53xD MX53xD DDR2/LVDDR2-800, eMMC "thermal impedance" PCIMX535DVV1C emmc Card connector 062N n78c 4.712 eMMC PoP emmc pcb layout 100KPD diode 4.7-16 PDF