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    EMMC 4.5 STANDARD JEDEC Search Results

    EMMC 4.5 STANDARD JEDEC Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ151KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ471KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ152MN4A Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ101KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ331KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd

    EMMC 4.5 STANDARD JEDEC Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    KLM8G2FE3B

    Abstract: klm8g samsung eMMC 4.5 TLC nand samsung tlc nand flash KLM4G 153 ball eMMC memory SAMSUNG emmc klm8g2 Samsung KLMBG4GE2A
    Text: Samsung eMMC Managed NAND Flash memory solution supports mobile applications FBGA QDP Package BROCHURE Efficiency, reduced costs and quicker time to market Expand device development with capable memory solutions Simplify mass storage designs Conventional NAND Flash memory can be challenging to


    Original     		PDF

    KE4CN5B6A

    Abstract: ke4cn3k6a 16GB emmc kingston
    Text: K I N G S T O N . C O M / e mmc e•MMC — the perfect storage solution for mobile and embedded applications Overview Kingston’s 19nm e•MMC product follows the JEDEC e•MMC4.5 standard. e•MMC encloses the MLC NAND and e•MMC controller inside one JEDEC standard package, providing a standard interface to the host CPU. The e•MMC controller


    Original     		PDF MKF-489 HS200 KE4CN5B6A ke4cn3k6a 16GB emmc kingston

    OMAP5430

    Abstract: OMAP5432 MIPI CSI-2 Parallel bridge Toshiba eMMC 4.40 emmc pcb layout toshiba eMMC DS MIPI DPI CAMERA PARALLEL RGB TO MIPI CSI-2 TWL6041 emmc toshiba
    Text: Version F EL I M Data Manual IN Multimedia Device Engineering Samples 2.0 AR OMAP5430 Public Version PR ADVANCE INFORMATION concerns new products in the sampling or preproduction phase of development. Characteristic data and other specifications are subject to change without notice.


    Original     		PDF OMAP5430 SWPS052F OMAP5430 OMAP5432 MIPI CSI-2 Parallel bridge Toshiba eMMC 4.40 emmc pcb layout toshiba eMMC DS MIPI DPI CAMERA PARALLEL RGB TO MIPI CSI-2 TWL6041 emmc toshiba

    DART-4460

    Abstract: MIPI CPI OM44 PowerVR SGX540
    Text: VA‘I“CITE LTD DART-4460 T “ D I M ‘ VA R I SC I T E LT D DA‘T 2013 Variscite Ltd. D OMAP TM All Rights Reserved. No part of this document may be photocopied, reproduced, stored in a retrieval system, or transmitted, in any form or by any means whether, electronic, mechanical, or otherwise without the prior written


    Original     		PDF DART-4460 DART-4460 MIPI CPI OM44 PowerVR SGX540

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 5, 06/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


    Original     		PDF IMX50CEC MCIMX50

    Samsung eMMC 4.51

    Abstract: samsung eMMC 4.5
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 2, 05/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


    Original     		PDF IMX50CEC MCIMX50 Samsung eMMC 4.51 samsung eMMC 4.5

    samsung eMMC 4.5

    Abstract: Samsung eMMC 4.41 lpddr2 emmc emmc 4.41 spec emmc 4.5 spec 153 ball eMMC memory Samsung eMMC 4.51 samsung* lpddr2* pop package emmc Pin assignment eMMC 4.4
    Text: Freescale Semiconductor Data Sheet: Advanced Information Document Number: IMX50CEC Rev. 2, 04/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


    Original     		PDF IMX50CEC MCIMX50 samsung eMMC 4.5 Samsung eMMC 4.41 lpddr2 emmc emmc 4.41 spec emmc 4.5 spec 153 ball eMMC memory Samsung eMMC 4.51 samsung* lpddr2* pop package emmc Pin assignment eMMC 4.4

    samsung eMMC 4.5

    Abstract: eMMC 4.51 Samsung eMMC 4.41 emmc 4.5 spec Samsung eMMC 4.51 emmc 4.41 spec eMMC PoP samsung lpddr2 153 ball eMMC memory 0.8 emmc spec samsung
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 2, 05/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


    Original     		PDF IMX50CEC MCIMX50 samsung eMMC 4.5 eMMC 4.51 Samsung eMMC 4.41 emmc 4.5 spec Samsung eMMC 4.51 emmc 4.41 spec eMMC PoP samsung lpddr2 153 ball eMMC memory 0.8 emmc spec samsung

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 6, 08/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


    Original     		PDF IMX50CEC MCIMX50

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 3, 11/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


    Original     		PDF IMX50CEC MCIMX50

    samsung eMMC 4.5

    Abstract: emmc 4.4 standard jedec Samsung eMMC 4.41 153 ball eMMC memory emmc 4.5 spec emmc spec emmc 4.41 spec 50 50 mfd CAPACITOR USB_OTG Samsung eMMC 4.51
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 4, 1/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


    Original     		PDF IMX50CEC MCIMX50 samsung eMMC 4.5 emmc 4.4 standard jedec Samsung eMMC 4.41 153 ball eMMC memory emmc 4.5 spec emmc spec emmc 4.41 spec 50 50 mfd CAPACITOR USB_OTG Samsung eMMC 4.51

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 7, 10/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


    Original     		PDF IMX50CEC MCIMX50

    Untitled

    Abstract: No abstract text available
    Text: TPS61280, TPS61281, TPS61282 www.ti.com SLVSBI1 – OCTOBER 2013 Low-, Wide- Voltage Battery Front-End DC/DC Converter Single-Cell Li-Ion, Ni-Rich, Si-Anode Applications Check for Samples: TPS61280, TPS61281, TPS61282 FEATURES DESCRIPTION • • The TPS6128x device provides a power supply


    Original     		PDF TPS61280, TPS61281, TPS61282 TPS6128x

    Untitled

    Abstract: No abstract text available
    Text: TPS61280, TPS61281, TPS61282 www.ti.com SLVSBI1 – OCTOBER 2013 Low-, Wide- Voltage Battery Front-End DC/DC Converter Single-Cell Li-Ion, Ni-Rich, Si-Anode Applications Check for Samples: TPS61280, TPS61281, TPS61282 FEATURES DESCRIPTION • • The TPS6128x device provides a power supply


    Original     		PDF TPS61280, TPS61281, TPS61282 TPS6128x

    Untitled

    Abstract: No abstract text available
    Text: TPS61280, TPS61281, TPS61282 www.ti.com SLVSBI1 – OCTOBER 2013 Low-, Wide- Voltage Battery Front-End DC/DC Converter Single-Cell Li-Ion, Ni-Rich, Si-Anode Applications Check for Samples: TPS61280, TPS61281, TPS61282 FEATURES DESCRIPTION • • The TPS6128x device provides a power supply


    Original     		PDF TPS61280, TPS61281, TPS61282 TPS6128x

    LQFP100 tray dimension

    Abstract: Increment Encoder interface with STM32F4
    Text: STM32F411xC STM32F411xE ARM Cortex®-M4 32b MCU+FPU, 125 DMIPS, 512KB Flash, 128KB RAM, USB OTG FS, 11 TIMs, 1 ADC, 13 comm. interfaces Datasheet - preliminary data Features FBGA • Dynamic Efficiency Line ® ® – Core: ARM 32-bit Cortex -M4 CPU with


    Original     		PDF STM32F411xC STM32F411xE 512KB 128KB 32-bit 4-to-26 DocID026289 LQFP100 tray dimension Increment Encoder interface with STM32F4

    Untitled

    Abstract: No abstract text available
    Text: Product Folder Sample & Buy Technical Documents Tools & Software Support & Community TMS320C5517 SPRS727C – AUGUST 2012 – REVISED APRIL 2014 TMS320C5517 Fixed-Point Digital Signal Processor 1 Device Overview 1.1 Features 1 • CORE: – High-Performance, Low-Power, TMS320C55x


    Original     		PDF TMS320C5517 SPRS727C TMS320C5517 TMS320C55x 200-MHz

    Untitled

    Abstract: No abstract text available
    Text: Product Folder Sample & Buy Technical Documents Tools & Software Support & Community TMS320C5517 SPRS727B – AUGUST 2012 – REVISED APRIL 2014 TMS320C5517 Fixed-Point Digital Signal Processor 1 Device Overview 1.1 Features 1 • CORE: – High-Performance, Low-Power, TMS320C55x


    Original     		PDF TMS320C5517 SPRS727B TMS320C5517 TMS320C55xâ 225-MHz

    Untitled

    Abstract: No abstract text available
    Text: Product Folder Sample & Buy Technical Documents Tools & Software Support & Community TMS320C5517 SPRS727C – AUGUST 2012 – REVISED APRIL 2014 TMS320C5517 Fixed-Point Digital Signal Processor 1 Device Overview 1.1 Features 1 • CORE: – High-Performance, Low-Power, TMS320C55x


    Original     		PDF TMS320C5517 SPRS727C TMS320C5517 TMS320C55x 200-MHz

    "eMMC" Thermal Impedance

    Abstract: emmc spi bridge emmc bga 162 C5535 EMMC HOST CONTROLLER eMMC driver 9810h eMMC 4.41 operation TMS320C5535 emmc pin
    Text: TMS320C5535 TMS320C5534, TMS320C5533, TMS320C5532 SPRS737 – AUGUST 2011 www.ti.com TMS320C5535, 'C5534, 'C5533, 'C5532 Fixed-Point Digital Signal Processors Check for Samples: TMS320C5535, TMS320C5534, TMS320C5533, TMS320C5532 1 Fixed-Point Digital Signal Processor


    Original     		PDF TMS320C5535 TMS320C5534, TMS320C5533, TMS320C5532 SPRS737 TMS320C5535, C5534, C5533, C5532 "eMMC" Thermal Impedance emmc spi bridge emmc bga 162 C5535 EMMC HOST CONTROLLER eMMC driver 9810h eMMC 4.41 operation emmc pin

    QSFP28 I2C

    Abstract: No abstract text available
    Text: Arria 10 Device Overview 2013.09.04 AIB-01023 Subscribe Feedback Altera’s Arria FPGAs and SoCs deliver optimal performance and power efficiency in the midrange. By using TSMC's 20-nm process technology on a high-performance architecture, Arria 10 FPGAs and SoCs


    Original     		PDF AIB-01023 20-nm QSFP28 I2C

    SCIMX538DZK1C

    Abstract: samsung eMMC 4.5 MCIMX535 emmc pcb layout lpddr2 pcb layout LPDDR2 PoP samsung* lpddr2* pop package N7U2 Freescale i.MX53 Quick Start Board AMBA AXI
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 4.1, 2/2012 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch


    Original     		PDF IMX53CEC MCIMX53xD MX53xD SCIMX538DZK1C samsung eMMC 4.5 MCIMX535 emmc pcb layout lpddr2 pcb layout LPDDR2 PoP samsung* lpddr2* pop package N7U2 Freescale i.MX53 Quick Start Board AMBA AXI

    MCIMX535

    Abstract: MCIMX535DVV1C MCIMX535DVV IMX53CEC mc33902 tepbga-2 MCIMX538DZK1C H.263 *IMX53 emmc pcb layout
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 4, 11/2011 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch


    Original     		PDF IMX53CEC MCIMX53xD MX53xD MCIMX535 MCIMX535DVV1C MCIMX535DVV mc33902 tepbga-2 MCIMX538DZK1C H.263 *IMX53 emmc pcb layout

    lpddr2 spec

    Abstract: tablet mid SAMSUNG RF MODULATORS MLC nand 2012 emmc DDR3 pcb layout MCIMX535DVV1C emmc 4.5 samsung samsung eMMC 5.1 H 204 TK1 SCIMX
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX53CEC Rev. 5, 12/2012 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch


    Original     		PDF IMX53CEC MCIMX53xD MX53xD lpddr2 spec tablet mid SAMSUNG RF MODULATORS MLC nand 2012 emmc DDR3 pcb layout MCIMX535DVV1C emmc 4.5 samsung samsung eMMC 5.1 H 204 TK1 SCIMX