KLM8G2FE3B
Abstract: klm8g samsung eMMC 4.5 TLC nand samsung tlc nand flash KLM4G 153 ball eMMC memory SAMSUNG emmc klm8g2 Samsung KLMBG4GE2A
Text: Samsung eMMC Managed NAND Flash memory solution supports mobile applications FBGA QDP Package BROCHURE Efficiency, reduced costs and quicker time to market Expand device development with capable memory solutions Simplify mass storage designs Conventional NAND Flash memory can be challenging to
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KE4CN5B6A
Abstract: ke4cn3k6a 16GB emmc kingston
Text: K I N G S T O N . C O M / e mmc e•MMC — the perfect storage solution for mobile and embedded applications Overview Kingston’s 19nm e•MMC product follows the JEDEC e•MMC4.5 standard. e•MMC encloses the MLC NAND and e•MMC controller inside one JEDEC standard package, providing a standard interface to the host CPU. The e•MMC controller
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MKF-489
HS200
KE4CN5B6A
ke4cn3k6a
16GB emmc kingston
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OMAP5430
Abstract: OMAP5432 MIPI CSI-2 Parallel bridge Toshiba eMMC 4.40 emmc pcb layout toshiba eMMC DS MIPI DPI CAMERA PARALLEL RGB TO MIPI CSI-2 TWL6041 emmc toshiba
Text: Version F EL I M Data Manual IN Multimedia Device Engineering Samples 2.0 AR OMAP5430 Public Version PR ADVANCE INFORMATION concerns new products in the sampling or preproduction phase of development. Characteristic data and other specifications are subject to change without notice.
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OMAP5430
SWPS052F
OMAP5430
OMAP5432
MIPI CSI-2 Parallel bridge
Toshiba eMMC 4.40
emmc pcb layout
toshiba eMMC DS
MIPI DPI
CAMERA PARALLEL RGB TO MIPI CSI-2
TWL6041
emmc toshiba
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DART-4460
Abstract: MIPI CPI OM44 PowerVR SGX540
Text: VA‘I“CITE LTD DART-4460 T “ D I M ‘ VA R I SC I T E LT D DA‘T 2013 Variscite Ltd. D OMAP TM All Rights Reserved. No part of this document may be photocopied, reproduced, stored in a retrieval system, or transmitted, in any form or by any means whether, electronic, mechanical, or otherwise without the prior written
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DART-4460
DART-4460
MIPI CPI
OM44
PowerVR SGX540
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 5, 06/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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IMX50CEC
MCIMX50
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Samsung eMMC 4.51
Abstract: samsung eMMC 4.5
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 2, 05/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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IMX50CEC
MCIMX50
Samsung eMMC 4.51
samsung eMMC 4.5
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samsung eMMC 4.5
Abstract: Samsung eMMC 4.41 lpddr2 emmc emmc 4.41 spec emmc 4.5 spec 153 ball eMMC memory Samsung eMMC 4.51 samsung* lpddr2* pop package emmc Pin assignment eMMC 4.4
Text: Freescale Semiconductor Data Sheet: Advanced Information Document Number: IMX50CEC Rev. 2, 04/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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IMX50CEC
MCIMX50
samsung eMMC 4.5
Samsung eMMC 4.41
lpddr2 emmc
emmc 4.41 spec
emmc 4.5 spec
153 ball eMMC memory
Samsung eMMC 4.51
samsung* lpddr2* pop package
emmc Pin assignment
eMMC 4.4
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samsung eMMC 4.5
Abstract: eMMC 4.51 Samsung eMMC 4.41 emmc 4.5 spec Samsung eMMC 4.51 emmc 4.41 spec eMMC PoP samsung lpddr2 153 ball eMMC memory 0.8 emmc spec samsung
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 2, 05/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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IMX50CEC
MCIMX50
samsung eMMC 4.5
eMMC 4.51
Samsung eMMC 4.41
emmc 4.5 spec
Samsung eMMC 4.51
emmc 4.41 spec
eMMC PoP
samsung lpddr2
153 ball eMMC memory 0.8
emmc spec samsung
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 6, 08/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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IMX50CEC
MCIMX50
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 3, 11/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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IMX50CEC
MCIMX50
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samsung eMMC 4.5
Abstract: emmc 4.4 standard jedec Samsung eMMC 4.41 153 ball eMMC memory emmc 4.5 spec emmc spec emmc 4.41 spec 50 50 mfd CAPACITOR USB_OTG Samsung eMMC 4.51
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 4, 1/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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IMX50CEC
MCIMX50
samsung eMMC 4.5
emmc 4.4 standard jedec
Samsung eMMC 4.41
153 ball eMMC memory
emmc 4.5 spec
emmc spec
emmc 4.41 spec
50 50 mfd CAPACITOR
USB_OTG
Samsung eMMC 4.51
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 7, 10/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch
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IMX50CEC
MCIMX50
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Untitled
Abstract: No abstract text available
Text: TPS61280, TPS61281, TPS61282 www.ti.com SLVSBI1 – OCTOBER 2013 Low-, Wide- Voltage Battery Front-End DC/DC Converter Single-Cell Li-Ion, Ni-Rich, Si-Anode Applications Check for Samples: TPS61280, TPS61281, TPS61282 FEATURES DESCRIPTION • • The TPS6128x device provides a power supply
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TPS61280,
TPS61281,
TPS61282
TPS6128x
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Untitled
Abstract: No abstract text available
Text: TPS61280, TPS61281, TPS61282 www.ti.com SLVSBI1 – OCTOBER 2013 Low-, Wide- Voltage Battery Front-End DC/DC Converter Single-Cell Li-Ion, Ni-Rich, Si-Anode Applications Check for Samples: TPS61280, TPS61281, TPS61282 FEATURES DESCRIPTION • • The TPS6128x device provides a power supply
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TPS61280,
TPS61281,
TPS61282
TPS6128x
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Untitled
Abstract: No abstract text available
Text: TPS61280, TPS61281, TPS61282 www.ti.com SLVSBI1 – OCTOBER 2013 Low-, Wide- Voltage Battery Front-End DC/DC Converter Single-Cell Li-Ion, Ni-Rich, Si-Anode Applications Check for Samples: TPS61280, TPS61281, TPS61282 FEATURES DESCRIPTION • • The TPS6128x device provides a power supply
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TPS61280,
TPS61281,
TPS61282
TPS6128x
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LQFP100 tray dimension
Abstract: Increment Encoder interface with STM32F4
Text: STM32F411xC STM32F411xE ARM Cortex®-M4 32b MCU+FPU, 125 DMIPS, 512KB Flash, 128KB RAM, USB OTG FS, 11 TIMs, 1 ADC, 13 comm. interfaces Datasheet - preliminary data Features FBGA • Dynamic Efficiency Line ® ® – Core: ARM 32-bit Cortex -M4 CPU with
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STM32F411xC
STM32F411xE
512KB
128KB
32-bit
4-to-26
DocID026289
LQFP100 tray dimension
Increment Encoder interface with STM32F4
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Untitled
Abstract: No abstract text available
Text: Product Folder Sample & Buy Technical Documents Tools & Software Support & Community TMS320C5517 SPRS727C – AUGUST 2012 – REVISED APRIL 2014 TMS320C5517 Fixed-Point Digital Signal Processor 1 Device Overview 1.1 Features 1 • CORE: – High-Performance, Low-Power, TMS320C55x
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TMS320C5517
SPRS727C
TMS320C5517
TMS320C55x
200-MHz
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Untitled
Abstract: No abstract text available
Text: Product Folder Sample & Buy Technical Documents Tools & Software Support & Community TMS320C5517 SPRS727B – AUGUST 2012 – REVISED APRIL 2014 TMS320C5517 Fixed-Point Digital Signal Processor 1 Device Overview 1.1 Features 1 • CORE: – High-Performance, Low-Power, TMS320C55x
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TMS320C5517
SPRS727B
TMS320C5517
TMS320C55xâ
225-MHz
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Untitled
Abstract: No abstract text available
Text: Product Folder Sample & Buy Technical Documents Tools & Software Support & Community TMS320C5517 SPRS727C – AUGUST 2012 – REVISED APRIL 2014 TMS320C5517 Fixed-Point Digital Signal Processor 1 Device Overview 1.1 Features 1 • CORE: – High-Performance, Low-Power, TMS320C55x
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TMS320C5517
SPRS727C
TMS320C5517
TMS320C55x
200-MHz
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"eMMC" Thermal Impedance
Abstract: emmc spi bridge emmc bga 162 C5535 EMMC HOST CONTROLLER eMMC driver 9810h eMMC 4.41 operation TMS320C5535 emmc pin
Text: TMS320C5535 TMS320C5534, TMS320C5533, TMS320C5532 SPRS737 – AUGUST 2011 www.ti.com TMS320C5535, 'C5534, 'C5533, 'C5532 Fixed-Point Digital Signal Processors Check for Samples: TMS320C5535, TMS320C5534, TMS320C5533, TMS320C5532 1 Fixed-Point Digital Signal Processor
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TMS320C5535
TMS320C5534,
TMS320C5533,
TMS320C5532
SPRS737
TMS320C5535,
C5534,
C5533,
C5532
"eMMC" Thermal Impedance
emmc spi bridge
emmc bga 162
C5535
EMMC HOST CONTROLLER
eMMC driver
9810h
eMMC 4.41 operation
emmc pin
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QSFP28 I2C
Abstract: No abstract text available
Text: Arria 10 Device Overview 2013.09.04 AIB-01023 Subscribe Feedback Altera’s Arria FPGAs and SoCs deliver optimal performance and power efficiency in the midrange. By using TSMC's 20-nm process technology on a high-performance architecture, Arria 10 FPGAs and SoCs
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AIB-01023
20-nm
QSFP28 I2C
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SCIMX538DZK1C
Abstract: samsung eMMC 4.5 MCIMX535 emmc pcb layout lpddr2 pcb layout LPDDR2 PoP samsung* lpddr2* pop package N7U2 Freescale i.MX53 Quick Start Board AMBA AXI
Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 4.1, 2/2012 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch
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IMX53CEC
MCIMX53xD
MX53xD
SCIMX538DZK1C
samsung eMMC 4.5
MCIMX535
emmc pcb layout
lpddr2 pcb layout
LPDDR2 PoP
samsung* lpddr2* pop package
N7U2
Freescale i.MX53 Quick Start Board
AMBA AXI
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MCIMX535
Abstract: MCIMX535DVV1C MCIMX535DVV IMX53CEC mc33902 tepbga-2 MCIMX538DZK1C H.263 *IMX53 emmc pcb layout
Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 4, 11/2011 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch
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IMX53CEC
MCIMX53xD
MX53xD
MCIMX535
MCIMX535DVV1C
MCIMX535DVV
mc33902
tepbga-2
MCIMX538DZK1C
H.263
*IMX53
emmc pcb layout
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lpddr2 spec
Abstract: tablet mid SAMSUNG RF MODULATORS MLC nand 2012 emmc DDR3 pcb layout MCIMX535DVV1C emmc 4.5 samsung samsung eMMC 5.1 H 204 TK1 SCIMX
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX53CEC Rev. 5, 12/2012 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch
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IMX53CEC
MCIMX53xD
MX53xD
lpddr2 spec
tablet mid
SAMSUNG RF MODULATORS
MLC nand 2012
emmc DDR3 pcb layout
MCIMX535DVV1C
emmc 4.5 samsung
samsung eMMC 5.1
H 204 TK1
SCIMX
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