THGBM4G4D1HBAIR
Abstract: THGBM4G6D2HBAIR P-VFBGA153-1113-0 toshiba 16GB Nand flash emmc thgbm4g5d1hbair Toshiba emmc THGBM4G7D2GBAIE THGBM4G8D4GBAIE THGBM 4GB eMMC toshiba
Text: Card Interface : e･MMC｜MLC NAND｜TOSHIBA Semiconductor & Storage Products. Page 1 of 2 Card Interface : e･MMC The interface of e･MMC is compliant with Version 4.41 of the JEDEC e･MMC™ standard for high-speed memory cards. Users can easily use e･MMC™ in various products as an embedded MMC memory device e･MMC™-compliant . Since e･MMC™
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128GB
P-TFBGA169-1418-0
P-FBGA169-1418-0
P-TFBGA169-1216-0
P-VFBGA153-1113-0
THGBM4G4D1HBAIR
THGBM4G6D2HBAIR
toshiba 16GB Nand flash emmc
thgbm4g5d1hbair
Toshiba emmc
THGBM4G7D2GBAIE
THGBM4G8D4GBAIE
THGBM
4GB eMMC toshiba
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KLM8G2FE3B
Abstract: klm8g samsung eMMC 4.5 TLC nand samsung tlc nand flash KLM4G 153 ball eMMC memory SAMSUNG emmc klm8g2 Samsung KLMBG4GE2A
Text: Samsung eMMC Managed NAND Flash memory solution supports mobile applications FBGA QDP Package BROCHURE Efficiency, reduced costs and quicker time to market Expand device development with capable memory solutions Simplify mass storage designs Conventional NAND Flash memory can be challenging to
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Untitled
Abstract: No abstract text available
Text: BE230C Display Embedded System Features IP66 for Front Bezel 512 •TI 1GHz 32-bit ARM Cortex-A8 Single Core CPU •512MB LPDDR •eMMC 4.41 I/F 8GB •WINCE 6.0 CORE OS •Support SD/SDHC Card •7" TFT LCD with 800x480 Resulution •4-wired Resistive Touch Panel
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BE230C
32-bit
512MB
800x480
1xRS232C,
RS-232
LPDDR-400
512MB
RS232C
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Untitled
Abstract: No abstract text available
Text: BE230A Display Embedded System Features •TI 1GHz 32-bit ARM Cortex-A8 Single Core CPU •512MB LPDDR •eMMC 4.41 I/F 8GB •WINCE 6.0 CORE OS •Support SD/SDHC Card •7" TFT LCD with 800x480 Resulution •4-wired Resistive Touch Panel •1 x RS232C, 1xCAN BUS
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BE230A
32-bit
512MB
800x480
RS232C,
RS-232
LPDDR-400
512MB
191mm
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Toshiba NAND BGA 224
Abstract: Toshiba emmc Toshiba BGA 224 toshiba emmc 4.41 4GB eMMC toshiba THGBM THGBM3G emmc jedec THGBM3G5 THGB
Text: Preliminary THGBM3G5D1FBAIE TOSHIBA e-MMC Module 4GB THGBM3G5D1FBAIE INTRODUCTION THGBM3G5D1FBAIE is 4-GByte density of e-MMC Module product housed in 169 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip assembled as Multi Chip Module.
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P-TFBGA169-1216-0
Toshiba NAND BGA 224
Toshiba emmc
Toshiba BGA 224
toshiba emmc 4.41
4GB eMMC toshiba
THGBM
THGBM3G
emmc jedec
THGBM3G5
THGB
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Toshiba emmc
Abstract: THGBM eMMC data retention Toshiba NAND BGA 224 P-TFBGA153-1113-0 THGBM3G4D1FBAIG BGA 221 eMMC toshiba Toshiba emmc performance THGBM3G
Text: Preliminary THGBM3G4D1FBAIG TOSHIBA e-MMC Module 2GB THGBM3G4D1FBAIG INTRODUCTION THGBM3G4D1FBAIG is 2-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip assembled as Multi Chip Module.
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P-TFBGA153-1113-0
Toshiba emmc
THGBM
eMMC data retention
Toshiba NAND BGA 224
THGBM3G4D1FBAIG
BGA 221 eMMC
toshiba
Toshiba emmc performance
THGBM3G
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SEM32G
Abstract: sandisk eMMC 4.41 emmc 4.41 spec JESD84-A441 eMMC 4.41 SEM04G emmc pcb layout SEM08G 153 ball eMMC memory sandisk 32GB Nand flash
Text: e.MMC 4.41 I/F Preliminary Data Sheet 80-36-03433 February 2010 SanDisk Corporation Corporate Headquarters • 601 McCarthy Boulevard • Milpitas, CA 95035 Phone 408 801-1000 • Fax (408) 801-8657 www.sandisk.com 80-36-03433 SanDisk iNAND e.MMC 4.41 I/F - Data Sheet
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25-Feb-10
SEM32G
sandisk eMMC 4.41
emmc 4.41 spec
JESD84-A441
eMMC 4.41
SEM04G
emmc pcb layout
SEM08G
153 ball eMMC memory
sandisk 32GB Nand flash
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Manufacturer ID list eMMC
Abstract: emmc 4.41 spec finder type 81.11
Text: Intel Atom Processor Z2760 Datasheet October 2012 Revision 1.0 Document Number: 328104-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS
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Z2760
Z2760
Manufacturer ID list eMMC
emmc 4.41 spec
finder type 81.11
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Untitled
Abstract: No abstract text available
Text: CYUSB303X EZ-USB FX3S SuperSpeed USB Controller EZ-USB® FX3S SuperSpeed USB Controller Features • ■ ■ ❐ Universal serial bus USB integration ❐ USB 3.0 and USB 2.0 peripherals compliant with USB 3.0 specification 1.0 ❐ 5-Gbps USB 3.0 PHY compliant with PIPE 3.0
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CYUSB303X
100-MHz
16-bit
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emmc 4.41 spec
Abstract: eMMC 4.41 emmc spec SD-DDR50 emmc 4.5 spec SDXC protocol emmc 4.41 firmware operation eMMC 4.41 application note MMC-DDR52 emmc v 4.41 operation mode
Text: CYUSB3035 EZ-USB FX3S SuperSpeed USB Controller Features • ■ ■ Universal serial bus USB integration ❐ USB 3.0 and USB 2.0 peripherals compliant with USB 3.0 specification 1.0 ❐ 5-Gbps USB 3.0 PHY compliant with PIPE 3.0 ❐ High-speed On-The-Go (HS-OTG) host and peripheral compliant with OTG Supplement Version 2.0
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CYUSB3035
100-MHz
emmc 4.41 spec
eMMC 4.41
emmc spec
SD-DDR50
emmc 4.5 spec
SDXC protocol
emmc 4.41 firmware operation
eMMC 4.41 application note
MMC-DDR52
emmc v 4.41 operation mode
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eMMC 4.41
Abstract: emmc 4.41 spec emmc spec emmc 5.0 emmc cmd18 EMMC HOST CONTROLLER emmc 4.5 spec DAT70 TO-39, UVC eMMC 4.41 application note
Text: CYUSB3035 EZ-USB FX3S SuperSpeed USB Controller Features • ■ ■ Universal serial bus USB integration ❐ USB 3.0 and USB 2.0 peripherals compliant with USB 3.0 specification 1.0 ❐ 5-Gbps USB 3.0 PHY compliant with PIPE 3.0 ❐ High-speed On-The-Go (HS-OTG) host and peripheral compliant with OTG Supplement Version 2.0
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CYUSB3035
100-MHz
16-bit
eMMC 4.41
emmc 4.41 spec
emmc spec
emmc 5.0
emmc cmd18
EMMC HOST CONTROLLER
emmc 4.5 spec
DAT70
TO-39, UVC
eMMC 4.41 application note
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CYUSB202X
Abstract: No abstract text available
Text: CYUSB202X SD2 USB and Mass Storage Peripheral Controller Features • ■ ■ ❐ ❐ Latest-generation storage support ❐ SD2.0/SDXC – UHS1 SDR50 / DDR50 Master ❐ eMMC 4.4 Master ❐ SDIO 3.0 Master Ultra low-power in core power-down mode ❐ Less than 60 µA with VBATT on and 20 µA with VBATT off
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CYUSB202X
SDR50
DDR50
CYUSB202X
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CLKIN32
Abstract: No abstract text available
Text: CYUSB302x SD3 USB and Mass Storage Peripheral Controller Features • ■ ■ ■ ■ Latest-generation storage support ❐ SD3.0/SDXC – UHS1 SDR50 / DDR50 Master ❐ eMMC 4.4 Master ❐ SDIO 3.0 Master ■ Independent power domains for core and I/O ■
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CYUSB302x
SDR50
DDR50
CLKIN32
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KLM8G2FEJA-A001
Abstract: KLMAG4FEJA-A001 KLM8G2FEJA KLMBG8FEJA-A001 KLMAG4FEJA-B001 klm8g samsung eMMC 4.5 Samsung eMMC 4.41 KLMXGXFEJA-X001 KLMCGAFEJA-B001
Text: Hello All, 8/16/32GB 27nm eMMC parts are now available to sample CS type ! Please input sample requests for all customers using old generations of moviNAND now. We'll expedite for ASAP delivery. SEC will ramp 27nm production quickly so it is imperative that all customers get qualified ASAP.
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KLMXGXFEJA-X001
KLM8G2FEJA-A001
KLMAG4FEJA-A001
KLM8G2FEJA
KLMBG8FEJA-A001
KLMAG4FEJA-B001
klm8g
samsung eMMC 4.5
Samsung eMMC 4.41
KLMCGAFEJA-B001
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sony cmos sensor imx 174
Abstract: Sony imx 174 Sony IMX 145 CMOS
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SLCEC Rev. 3, 04/2014 MCIMX6LxDVN10xx MCIMX6LxEVN10xx i.MX 6SoloLite Applications Processors for Consumer Products Package Information Plastic Package 13 x 13 mm, 0.5 mm pitch Ordering Information
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MCIMX6LxDVN10xx
MCIMX6LxEVN10xx
sony cmos sensor imx 174
Sony imx 174
Sony IMX 145 CMOS
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sony cmos sensor imx 174
Abstract: sony cmos sensor imx 179
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SLCEC Rev. 2.2, 08/2013 MCIMX6LxDVN10xx MCIMX6LxEVN10xx i.MX 6SoloLite Applications Processors for Consumer Products Package Information Plastic Package 13 x 13 mm, 0.5 mm pitch Ordering Information
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MCIMX6LxDVN10xx
MCIMX6LxEVN10xx
sony cmos sensor imx 174
sony cmos sensor imx 179
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IMX6DQ6SDLSRM
Abstract: Samsung eMMC 4.41 sony cmos sensor imx 174 sony cmos sensor imx 179 sony cmos sensor imx 175 sony IMX 136 sony CMOS sensor imx 136 sony IMX 138 LVDS to MIPI CSI Sony imx 134
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQIxEC Rev. 2, 04/2013 MCIMX6QxCxxxxC MCIMX6DxCxxxxC i.MX 6Dual/6Quad Applications Processors for Industrial Products Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch Ordering Information
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DDR3/LVDDR3/LPDDR2-1066
IMX6DQ6SDLSRM
Samsung eMMC 4.41
sony cmos sensor imx 174
sony cmos sensor imx 179
sony cmos sensor imx 175
sony IMX 136
sony CMOS sensor imx 136
sony IMX 138
LVDS to MIPI CSI
Sony imx 134
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQIEC Rev. 2.1, 07/2013 MCIMX6QxCxxxxC MCIMX6DxCxxxxC i.MX 6Dual/6Quad Applications Processors for Industrial Products Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch Ordering Information
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sony IMX 136
Abstract: IMX6DQ6SDLSRM sony sensor imx 136 sony CMOS sensor imx 136 Sony imx 134 cmos sensor sony IMX 138 sony cmos sensor imx 123 sony cmos sensor imx 174 sony CMOS sensor imx 135 sony IMX 260
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQIEC Rev. 2.2, 07/2013 MCIMX6QxCxxxxC MCIMX6DxCxxxxC i.MX 6Dual/6Quad Applications Processors for Industrial Products Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch Ordering Information
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64-bit
DDR3/LVDDR3/LPDDR2-1066
sony IMX 136
IMX6DQ6SDLSRM
sony sensor imx 136
sony CMOS sensor imx 136
Sony imx 134 cmos sensor
sony IMX 138
sony cmos sensor imx 123
sony cmos sensor imx 174
sony CMOS sensor imx 135
sony IMX 260
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bcm2835
Abstract: BROADCOM BCM2835
Text: 1 1 1 1 1 1 BCM2835 ARM Peripherals 2012 Broadcom Corporation. All rights reserved Broadcom Europe Ltd. 406 Science Park Milton Road Cambridge CB4 0WW Table of Contents 11 Introduction 1.11 Overview 1.21 Address map 1.2.11 Diagrammatic overview 1.2.21 ARM virtual addresses standard Linux kernel only
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BCM2835
BROADCOM BCM2835
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Sony imx 147
Abstract: sony cmos sensor imx 174
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQAEC Rev. 2.2, 07/2013 MCIMX6QxAxxxxC MCIMX6DxAxxxxC i.MX 6Dual/6Quad Automotive and Infotainment Applications Processors Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch Ordering Information
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sony IMX 159 camera
Abstract: IMX6DQ6SDLSRM arm cortex a9 mpcore sony CMOS sensor imx 135 sony IMX 135 LVDS to MIPI CSI Samsung eMMC 4.41 MIPI CSI-2 Parallel bridge sony cmos sensor imx 174 sony IMX 132
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQAxEC Rev. 2, 04/2013 MCIMX6QxAxxxxC MCIMX6DxAxxxxC i.MX 6Dual/6Quad Automotive and Infotainment Applications Processors Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch Ordering Information
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Sony imx 134
Abstract: IMX6DQ6SDLSRM Sony imx 134 cmos sensor Samsung eMMC 4.41 emmc 4.41 spec MIPI CSI-2 Parallel bridge LVDS to MIPI CSI MCIMX6Q5EYM10AC sony IMX 135 sony IMX 136
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQCxEC Rev. 2, 04/2013 MCIMX6QxDxxxxC MCIMX6QxExxxxC MCIMX6DxDxxxxC MCIMX6DxExxxxC i.MX 6Dual/6Quad Applications Processors for Consumer Products Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch
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IMX6DQ6SDLSRM
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQIEC Rev. 2.3, 07/2013 MCIMX6QxCxxxxC MCIMX6DxCxxxxC i.MX 6Dual/6Quad Applications Processors for Industrial Products Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch Ordering Information
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IMX6DQ6SDLSRM
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