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R7F7016114AFP-C
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Renesas Electronics Corporation
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High-end Automotive Microcontrollers Ideal for Body Applications |
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68016-114HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 14 Positions, 2.54 mm (0.100) Pitch. |
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131-6114-21H
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Amphenol Communications Solutions
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Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP. |
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131-6114-11H
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Amphenol Communications Solutions
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Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP. |
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131-6114-21D
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Amphenol Communications Solutions
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Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate. |
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