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    EF1152 Search Results

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    EF1152 Price and Stock

    Panasonic Electronic Components ERJ-1GEF1152C

    RES SMD 11.5K OHM 1% 1/20W 0201
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    DigiKey ERJ-1GEF1152C Reel
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    Chip1Stop ERJ-1GEF1152C 5,903
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    Master Electronics ERJ-1GEF1152C 15,000
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    Panasonic Electronic Components ERJ-H3EF1152V

    RES 11.5K OHM 1% 1/8W 0603
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    DigiKey ERJ-H3EF1152V Reel 10,000
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    Mouser Electronics ERJ-H3EF1152V
    • 1 $0.22
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    Newark ERJ-H3EF1152V Reel 5,000
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    ERJ-H3EF1152V Cut Tape 5,000
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    Master Electronics ERJ-H3EF1152V
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    Rochester Electronics LLC EP2SGX60EF1152C5

    IC FPGA 534 I/O 1152FBGA
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    DigiKey EP2SGX60EF1152C5 Bulk 1
    • 1 $992.19
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    Rochester Electronics LLC EP1AGX90EF1152I6

    IC FPGA 538 I/O 1152FBGA
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    DigiKey EP1AGX90EF1152I6 Bulk 1
    • 1 $1091.37
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    Rochester Electronics LLC EP2SGX90EF1152C5

    IC FPGA 558 I/O 1152FBGA
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    DigiKey EP2SGX90EF1152C5 Bulk 1
    • 1 $2417.44
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    Find more EF1152 price and stock on Findchips.com

    EF1152 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    XQ2VP40-5FG676N

    Abstract: XQ2VP40-5FF1152N xq2vp40 XQ2VP70-6EF1704I XQ2VP70 XAPP290 H337 u267 PPC405 IBM verilog code for ALU implementation
    Text: c 2 R DS136 v2.0 December 20, 2007 QPro Virtex-II Pro 1.5V Platform FPGAs Complete Data Sheet Preliminary Product Specification Module 1: Introduction and Overview Module 3: DC and Switching Characteristics DS136-1 (v2.0) December 20, 2007 DS136-3 (v2.0) December 20, 2007


    Original     		PDF DS136 DS136-1 DS136-3 DS136-4 XQ2VP40-5FG676N XQ2VP40-5FF1152N xq2vp40 XQ2VP70-6EF1704I XQ2VP70 XAPP290 H337 u267 PPC405 IBM verilog code for ALU implementation

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G

    Untitled

    Abstract: No abstract text available
    Text: — OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE — 187 QPro Virtex-II 1.5V Platform FPGAs DS122 v3.0 April 7, 2014 Product Specification Summary of QPro Virtex™-II Features • High-performance clock management circuitry • Industry’s first military-grade platform FPGA solution


    Original     		PDF DS122 MIL-PRF-38535

    XQ2V1000-4FG456

    Abstract: XQ2V1000-4FG456N AF271 transistor xq2v30004cg717m CG717 AE193 matrix m21 XC2V1000-FG456 BG728 XQ2V3000
    Text: R DS122 v2.0 December 21, 2007 QPro Virtex-II 1.5V Platform FPGAs Product Specification Summary of QPro Virtex™-II Features • • Industry’s first military-grade platform FPGA solution • Certified to MIL-PRF-38535 (Qualified Manufacturer Listing)


    Original     		PDF DS122 MIL-PRF-38535 XQ2V1000-4FG456 XQ2V1000-4FG456N AF271 transistor xq2v30004cg717m CG717 AE193 matrix m21 XC2V1000-FG456 BG728 XQ2V3000

    ULVDS25

    Abstract: QPro Virtex-II EF957 IO-L93N
    Text: R DS122 v2.0 December 12, 2007 QPro Virtex-II 1.5V Platform FPGAs Product Specification Summary of QPro Virtex™-II Features • • Industry’s first military-grade platform FPGA solution • Certified to MIL-PRF-38535 (Qualified Manufacturer Listing)


    Original     		PDF DS122 MIL-PRF-38535 BG575 XQ2V6000-5EF957I, XQ2V6000-4EF1152I, XQ2V6000-5EF1152I. CG717 CF1144 ULVDS25 QPro Virtex-II EF957 IO-L93N

    BFG95

    Abstract: No abstract text available
    Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


    Original     		PDF UG112 UG072, UG075, XAPP427, BFG95

    xq2vp40

    Abstract: EF1152 wireless encrypt XQ2VP40-5FF1152N XQ2VP40-5FG676N
    Text: Product Not Recommended for New Designs c 2 R DS136 v2.1 July 25, 2011 QPro Virtex-II Pro 1.5V Platform FPGAs Complete Data Sheet Product Specification Module 1:  Introduction and Overview Module 3:  DC and Switching Characteristics DS136-1 (v2.1) July 25, 2011


    Original     		PDF DS136 DS136-1 DS136-3 DS136-4 xq2vp40 EF1152 wireless encrypt XQ2VP40-5FF1152N XQ2VP40-5FG676N